JPH0434307B2 - - Google Patents
Info
- Publication number
- JPH0434307B2 JPH0434307B2 JP57027109A JP2710982A JPH0434307B2 JP H0434307 B2 JPH0434307 B2 JP H0434307B2 JP 57027109 A JP57027109 A JP 57027109A JP 2710982 A JP2710982 A JP 2710982A JP H0434307 B2 JPH0434307 B2 JP H0434307B2
- Authority
- JP
- Japan
- Prior art keywords
- power supply
- wiring
- potential power
- wiring patterns
- pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/90—Masterslice integrated circuits
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Semiconductor Integrated Circuits (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57027109A JPS58143550A (ja) | 1982-02-22 | 1982-02-22 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57027109A JPS58143550A (ja) | 1982-02-22 | 1982-02-22 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58143550A JPS58143550A (ja) | 1983-08-26 |
| JPH0434307B2 true JPH0434307B2 (cg-RX-API-DMAC7.html) | 1992-06-05 |
Family
ID=12211906
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57027109A Granted JPS58143550A (ja) | 1982-02-22 | 1982-02-22 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58143550A (cg-RX-API-DMAC7.html) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5165086A (en) * | 1985-02-20 | 1992-11-17 | Hitachi, Ltd. | Microprocessor chip using two-level metal lines technology |
| JPS63175441A (ja) * | 1987-01-14 | 1988-07-19 | Nec Corp | 半導体装置 |
| JPS63307759A (ja) * | 1987-06-09 | 1988-12-15 | Nec Corp | 半導体集積回路 |
| JPS6413733U (cg-RX-API-DMAC7.html) * | 1987-07-16 | 1989-01-24 | ||
| JPH01251640A (ja) * | 1988-03-31 | 1989-10-06 | Toshiba Corp | 半導体集積回路装置 |
| JPH01251639A (ja) * | 1988-03-31 | 1989-10-06 | Toshiba Corp | 半導体集積回路装置 |
| JP2516403B2 (ja) * | 1988-06-01 | 1996-07-24 | 富士通株式会社 | ウエハ・スケ―ル・メモリ |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA1024661A (en) * | 1974-06-26 | 1978-01-17 | International Business Machines Corporation | Wireable planar integrated circuit chip structure |
-
1982
- 1982-02-22 JP JP57027109A patent/JPS58143550A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58143550A (ja) | 1983-08-26 |