JPH0432036B2 - - Google Patents
Info
- Publication number
- JPH0432036B2 JPH0432036B2 JP6978383A JP6978383A JPH0432036B2 JP H0432036 B2 JPH0432036 B2 JP H0432036B2 JP 6978383 A JP6978383 A JP 6978383A JP 6978383 A JP6978383 A JP 6978383A JP H0432036 B2 JPH0432036 B2 JP H0432036B2
- Authority
- JP
- Japan
- Prior art keywords
- copper
- ceramics
- chromium
- film
- joining
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000919 ceramic Substances 0.000 claims description 22
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 20
- 229910052802 copper Inorganic materials 0.000 claims description 20
- 239000010949 copper Substances 0.000 claims description 20
- 229910052804 chromium Inorganic materials 0.000 claims description 11
- 239000011651 chromium Substances 0.000 claims description 11
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 9
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 claims description 6
- 229910000423 chromium oxide Inorganic materials 0.000 claims description 6
- 239000003929 acidic solution Substances 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- 230000001590 oxidative effect Effects 0.000 claims description 3
- 230000003647 oxidation Effects 0.000 claims 2
- 238000007254 oxidation reaction Methods 0.000 claims 2
- 239000000463 material Substances 0.000 description 6
- 238000005219 brazing Methods 0.000 description 4
- 239000007789 gas Substances 0.000 description 3
- 238000004381 surface treatment Methods 0.000 description 3
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- QLOKJRIVRGCVIM-UHFFFAOYSA-N 1-[(4-methylsulfanylphenyl)methyl]piperazine Chemical compound C1=CC(SC)=CC=C1CN1CCNCC1 QLOKJRIVRGCVIM-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000001844 chromium Chemical class 0.000 description 1
- GRWVQDDAKZFPFI-UHFFFAOYSA-H chromium(III) sulfate Chemical compound [Cr+3].[Cr+3].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O GRWVQDDAKZFPFI-UHFFFAOYSA-H 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- QDOXWKRWXJOMAK-UHFFFAOYSA-N dichromium trioxide Chemical compound O=[Cr]O[Cr]=O QDOXWKRWXJOMAK-UHFFFAOYSA-N 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000002075 main ingredient Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052863 mullite Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 229910052845 zircon Inorganic materials 0.000 description 1
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Ceramic Products (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6978383A JPS59195587A (ja) | 1983-04-20 | 1983-04-20 | セラミツクスと銅の接合方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6978383A JPS59195587A (ja) | 1983-04-20 | 1983-04-20 | セラミツクスと銅の接合方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59195587A JPS59195587A (ja) | 1984-11-06 |
| JPH0432036B2 true JPH0432036B2 (enrdf_load_stackoverflow) | 1992-05-28 |
Family
ID=13412699
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6978383A Granted JPS59195587A (ja) | 1983-04-20 | 1983-04-20 | セラミツクスと銅の接合方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59195587A (enrdf_load_stackoverflow) |
-
1983
- 1983-04-20 JP JP6978383A patent/JPS59195587A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59195587A (ja) | 1984-11-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3057932B2 (ja) | セラミックス焼結体の接合方法 | |
| JPS606910B2 (ja) | 金属セラミツクス接合体 | |
| JPS61158876A (ja) | セラミツク対金属の直接液相結合 | |
| JPS59232979A (ja) | セラミツクとアルミニウム合金の複合体 | |
| JPH0367985B2 (enrdf_load_stackoverflow) | ||
| US6013357A (en) | Power module circuit board and a process for the manufacture thereof | |
| JPH0432036B2 (enrdf_load_stackoverflow) | ||
| JPS59232692A (ja) | セラミツクと金属等との接合用ろう材及びこれを用いたセラミツクと金属等の複合体 | |
| JPH03261669A (ja) | セラミックスと金属との接合体およびその製造法 | |
| JPS6140625B2 (enrdf_load_stackoverflow) | ||
| JP3157520B2 (ja) | 窒化アルミニウム基板の製造方法 | |
| JPH05191038A (ja) | 金属層を備えたセラミックス基板とその製造方法 | |
| JP2541837B2 (ja) | セラミックスと金属との接合体の製造方法 | |
| JPH07187839A (ja) | 窒化物系セラミックス−金属接合体およびその製造方法 | |
| JP3352823B2 (ja) | 炭化珪素セラミックスとシリコンとの接合方法 | |
| JPH059396B2 (enrdf_load_stackoverflow) | ||
| JPS6334963A (ja) | 半導体装置用セラミツク基板の製造方法およびその方法に使用するクラツド材 | |
| JP2001274534A (ja) | セラミックス銅回路基板およびその製造方法 | |
| JPH0264081A (ja) | 窒化アルミニュームのメタライズ法 | |
| JPH0245354B2 (ja) | Kinzokukairoojusuruseramitsukusukibannoseizohoho | |
| JPH01142089A (ja) | メタル・コア基板及びその製造方法 | |
| JPS62265185A (ja) | セラミツクスと金属の接合方法 | |
| JPS62171979A (ja) | 非酸化物系セラミックスのメタライズ方法 | |
| JPH08144065A (ja) | セラミックスのメタライズ及び接合方法 | |
| SU446490A1 (ru) | Припой |