JPH04314355A - Chip carrier and soldering method thereof - Google Patents

Chip carrier and soldering method thereof

Info

Publication number
JPH04314355A
JPH04314355A JP7947891A JP7947891A JPH04314355A JP H04314355 A JPH04314355 A JP H04314355A JP 7947891 A JP7947891 A JP 7947891A JP 7947891 A JP7947891 A JP 7947891A JP H04314355 A JPH04314355 A JP H04314355A
Authority
JP
Japan
Prior art keywords
pad
chip carrier
positioning
area
preliminary solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7947891A
Other languages
Japanese (ja)
Inventor
Hironobu Ikeda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP7947891A priority Critical patent/JPH04314355A/en
Publication of JPH04314355A publication Critical patent/JPH04314355A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/12Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/14Structure, shape, material or disposition of the bump connectors prior to the connecting process of a plurality of bump connectors
    • H01L2224/1401Structure
    • H01L2224/1403Bump connectors having different sizes, e.g. different diameters, heights or widths
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components
    • H05K3/3431Leadless components

Abstract

PURPOSE: To prevent short-circuitting and opening due to positional displacement by providing a lower surface with a plurality of positioning pads each being greater than a connection pad in its area.
CONSTITUTION: A pad 4 is provided on the lower surface of a chip carrier 1 and a positioning pad 2 is provided at four corners, and further the area of the positioning pad 2 is formed to be greater than the area of the pad 4. For this, a preliminary solder for the positioning pad 2 is made higher than a preliminary solder 5a of the pad 4. Then, the tip end of positioning pad 2 of the chip carrier 1 is superimposed so as to ride on a conductor circuit 6 of a substrate 7. Thereupon, it becomes unnecessary to position the preliminary solder 5a of the pad 4 of the chip carrier 1 with the conductor circuit 8.
COPYRIGHT: (C)1992,JPO&Japio
JP7947891A 1991-04-12 1991-04-12 Chip carrier and soldering method thereof Pending JPH04314355A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7947891A JPH04314355A (en) 1991-04-12 1991-04-12 Chip carrier and soldering method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7947891A JPH04314355A (en) 1991-04-12 1991-04-12 Chip carrier and soldering method thereof

Publications (1)

Publication Number Publication Date
JPH04314355A true JPH04314355A (en) 1992-11-05

Family

ID=13691005

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7947891A Pending JPH04314355A (en) 1991-04-12 1991-04-12 Chip carrier and soldering method thereof

Country Status (1)

Country Link
JP (1) JPH04314355A (en)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09284005A (en) * 1996-04-15 1997-10-31 Saitama Nippon Denki Kk Dielectric filter
JPH1041426A (en) * 1996-07-19 1998-02-13 Nec Corp Ball grid array package mounting structure and ball grid array package
JPH11160584A (en) * 1997-12-01 1999-06-18 Kyocera Corp Optical package and optical module using the same
US6116922A (en) * 1999-02-02 2000-09-12 Hon Hai Precision Ind. Co., Ltd. Electrical connector
US6316735B1 (en) * 1996-11-08 2001-11-13 Ricoh Company, Ltd. Semiconductor chip mounting board and a semiconductor device using same board
US6927491B1 (en) 1998-12-04 2005-08-09 Nec Corporation Back electrode type electronic part and electronic assembly with the same mounted on printed circuit board
JP2015179794A (en) * 2013-05-30 2015-10-08 京セラサーキットソリューションズ株式会社 wiring board
JP2015179800A (en) * 2013-05-30 2015-10-08 京セラサーキットソリューションズ株式会社 wiring board
JP2018060835A (en) * 2016-09-30 2018-04-12 日亜化学工業株式会社 Semiconductor device package and semiconductor device using the same
DE102011016361B4 (en) 2010-04-07 2022-01-20 Maxim Integrated Products, Inc. Wafer-level chip-scale package device with bump units configured to reduce stress-related failures

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5892231A (en) * 1981-11-28 1983-06-01 Mitsubishi Electric Corp Bonding for semiconductor element
JPS6273639A (en) * 1985-09-26 1987-04-04 Fujitsu Ltd Method of mounting semiconductor chip
JPH02164045A (en) * 1988-12-19 1990-06-25 Fujitsu Ltd Packaging of solder bump component
JPH0371649A (en) * 1989-08-11 1991-03-27 Hitachi Ltd Semiconductor integrated circuit and manufacture thereof

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5892231A (en) * 1981-11-28 1983-06-01 Mitsubishi Electric Corp Bonding for semiconductor element
JPS6273639A (en) * 1985-09-26 1987-04-04 Fujitsu Ltd Method of mounting semiconductor chip
JPH02164045A (en) * 1988-12-19 1990-06-25 Fujitsu Ltd Packaging of solder bump component
JPH0371649A (en) * 1989-08-11 1991-03-27 Hitachi Ltd Semiconductor integrated circuit and manufacture thereof

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09284005A (en) * 1996-04-15 1997-10-31 Saitama Nippon Denki Kk Dielectric filter
JPH1041426A (en) * 1996-07-19 1998-02-13 Nec Corp Ball grid array package mounting structure and ball grid array package
US6316735B1 (en) * 1996-11-08 2001-11-13 Ricoh Company, Ltd. Semiconductor chip mounting board and a semiconductor device using same board
JPH11160584A (en) * 1997-12-01 1999-06-18 Kyocera Corp Optical package and optical module using the same
US6927491B1 (en) 1998-12-04 2005-08-09 Nec Corporation Back electrode type electronic part and electronic assembly with the same mounted on printed circuit board
US6116922A (en) * 1999-02-02 2000-09-12 Hon Hai Precision Ind. Co., Ltd. Electrical connector
DE102011016361B4 (en) 2010-04-07 2022-01-20 Maxim Integrated Products, Inc. Wafer-level chip-scale package device with bump units configured to reduce stress-related failures
JP2015179794A (en) * 2013-05-30 2015-10-08 京セラサーキットソリューションズ株式会社 wiring board
JP2015179800A (en) * 2013-05-30 2015-10-08 京セラサーキットソリューションズ株式会社 wiring board
JP2018060835A (en) * 2016-09-30 2018-04-12 日亜化学工業株式会社 Semiconductor device package and semiconductor device using the same

Similar Documents

Publication Publication Date Title
JPS59151443A (en) Semiconductor device
JPH04314355A (en) Chip carrier and soldering method thereof
JPH01226160A (en) Terminal device for connecting electronic parts and manufacture thereof
JPH03285338A (en) Bonding pad
JPH04258131A (en) Solder bump forming method and solder ball
JPH04176136A (en) Printed-wiring board
JPH04103154A (en) Semiconductor device, manufacture thereof, and mounting method thereof
JPH02181453A (en) Semiconductor device
JPH04318935A (en) Electrode and manufacture thereof and connecting method thereof
JPH01266732A (en) Printed wiring board
JPS6334969A (en) Semiconductor storage device
JPH04352458A (en) Leadless hybrid integrated circuit
JPH03273673A (en) Semiconductor device
JPH03268440A (en) Mounting structure of semiconductor chip
JPH03248450A (en) Semiconductor package
JPH01238091A (en) Printed board
JPH04258126A (en) Semiconductor device
JPH04241432A (en) Wire bonding structure between semiconductor chip and substrate mounted with same
JPH0453179A (en) Flexible printed board and manufacture thereof
JPH01202830A (en) Semiconductor element with bump electrode, manufacture thereof and semiconductor device using that element
JPH01155632A (en) Tape carrier type semiconductor device
JPH04254363A (en) Lead frame and semiconductor integrated circuit device utilizing the same
JPH03218034A (en) Semiconductor mounting board
JPH04271135A (en) Bump formation
JPH02205055A (en) Resin-sealed semiconductor device

Legal Events

Date Code Title Description
A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 19970722