JPH09284005A - Dielectric filter - Google Patents

Dielectric filter

Info

Publication number
JPH09284005A
JPH09284005A JP9213596A JP9213596A JPH09284005A JP H09284005 A JPH09284005 A JP H09284005A JP 9213596 A JP9213596 A JP 9213596A JP 9213596 A JP9213596 A JP 9213596A JP H09284005 A JPH09284005 A JP H09284005A
Authority
JP
Japan
Prior art keywords
dielectric filter
dielectric
input
output terminals
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9213596A
Other languages
Japanese (ja)
Other versions
JP2821416B2 (en
Inventor
博史 ▲高▼城
Hiroshi Takagi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Saitama Ltd
Original Assignee
NEC Saitama Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Saitama Ltd filed Critical NEC Saitama Ltd
Priority to JP8092135A priority Critical patent/JP2821416B2/en
Publication of JPH09284005A publication Critical patent/JPH09284005A/en
Application granted granted Critical
Publication of JP2821416B2 publication Critical patent/JP2821416B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0201Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components
    • H05K3/3431Leadless components

Abstract

PROBLEM TO BE SOLVED: To prevent deviation in the position of a dielectric filter in the reflow soldering to a printed circuit board. SOLUTION: Resonator holes 16a, 16b acting like resonance elements are penetrated between end faces of a dielectric 10 of the dielectric filter 1A. A ground electrode 11A made of a conductor film is formed on an outer surface of the dielectric block 10, and signal input output terminals 12a, 12b insulated from the ground electrode 11A are provided to a rear 33 and a side face 32a in succession to the rear 33. In the case the rear 33 of the dielectric block 10 is divided into four quadrants, thermal correction sections 13a, 13b with a calorific capacity nearly equal to the signal input output terminals 12a, 12b are provided to positions nearly corresponding to the signal input output terminals 12a, 12b on the quadrants where the signal input output terminals 12a, 12b are not in existence. Thus, the calorific capacity of the circumferential components of the dielectric filter 1A is balanced and then deviation of the positions of the components of the dielectric filter 1A in the case of reflow soldering is not caused.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】本発明は特定の周波数帯の高
周波数信号を通過または阻止させる誘電体フィルタに関
し、特に直方体状の誘電体ブロックに共振子穴を設ける
とともこの誘電体ブロックの外表面および上記共振子穴
の内壁面に導体膜を設けた構造の誘電体フィルタに関す
る。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a dielectric filter for passing or blocking a high-frequency signal in a specific frequency band, and more particularly, to a method of forming a resonator hole in a rectangular parallelepiped dielectric block and an outer surface of the dielectric block. And a dielectric filter having a structure in which a conductor film is provided on the inner wall surface of the resonator hole.

【0002】[0002]

【従来の技術】従来のこの種の誘電体フィルタの一つと
して、誘電体ブロックの外表面に設けた導体膜の一部が
残りの大部分の導体膜と絶縁されるように生成され,こ
の残りの大部分の導体膜と絶縁された部分を高周波数信
号の入出力端子とする形式のものが特開平5−1673
10号公報に開示されている。この形式の誘電体フィル
タは上記入出力端子をプリント基板のパターンに直接接
続できるという特徴がある。以下、開示されたと同様の
形式の誘電体フィルタについて、図4ないし図6を参照
して説明する。図4は従来技術による誘電体フィルタ1
Bの斜視図である。図5は誘電体フィルタ1Bを搭載す
るプリント基板2Bの正面図である。図6は誘電体フィ
ルタ1Bのプリント基板2Bへの実装状態を示す斜視図
である。
2. Description of the Related Art As one of conventional dielectric filters of this type, a part of a conductive film provided on an outer surface of a dielectric block is formed so as to be insulated from most of the remaining conductive films. Japanese Patent Application Laid-Open No. H5-1673 discloses a type in which a portion insulated from most of the remaining conductive film is used as an input / output terminal for a high frequency signal.
No. 10 discloses this. This type of dielectric filter is characterized in that the input / output terminals can be directly connected to a pattern on a printed circuit board. Hereinafter, a dielectric filter of the same type as that disclosed will be described with reference to FIGS. FIG. 4 shows a dielectric filter 1 according to the prior art.
It is a perspective view of B. FIG. 5 is a front view of a printed circuit board 2B on which the dielectric filter 1B is mounted. FIG. 6 is a perspective view showing a state where the dielectric filter 1B is mounted on the printed circuit board 2B.

【0003】図4を参照すると、誘電体フィルタ1Bは
ほぼ直方体をなす高誘電率セラミックスの誘電体ブロッ
ク10に形成される。図4においては誘電体ブロック1
0は銅メッキ,銀メッキあるいは半田メッキ等で外表面
に形成された導体膜であるグランド電極11B,入出力
端子12a,12bおよび短絡面15aに覆われて点模
様の部分のみ見える。誘電体ブロック10の二つの端面
(一方の端面は開放面14aおよび短絡面15bのある
面)間には共振子穴16aおよび16bが貫通してお
り、これら共振子穴16aおよび16bの内壁面にも導
体膜が施されている。この誘電体フィルタ1Bは二つの
共振子穴16aおよび16bを共振素子とする2段フィ
ルタである。共振子穴16aは入出力端子17aおよび
共振子穴16bと高周波数信号の電磁界結合を生じ、共
振子穴16bは共振子穴16aおよび入出力端子17b
と高周波数信号の電磁界結合を生じる。なお、誘電体ブ
ロック10の共振子穴16aと16bとの中間点に電磁
界の結合穴を有する誘電体フィルタも多く使われてい
る。
[0003] Referring to FIG. 4, a dielectric filter 1B is formed on a dielectric block 10 of a high dielectric constant ceramic having a substantially rectangular parallelepiped shape. In FIG. 4, the dielectric block 1
Numeral 0 is covered with the ground electrode 11B, the input / output terminals 12a and 12b and the short-circuit surface 15a, which are conductor films formed on the outer surface by copper plating, silver plating, solder plating, or the like, and only a dotted pattern portion is visible. Resonator holes 16a and 16b penetrate between two end faces of dielectric block 10 (one end face has open face 14a and short-circuit face 15b), and the inner wall faces of these resonator holes 16a and 16b Also, a conductor film is provided. This dielectric filter 1B is a two-stage filter using two resonator holes 16a and 16b as resonance elements. The resonator hole 16a causes electromagnetic coupling between the input / output terminal 17a and the resonator hole 16b and a high-frequency signal. The resonator hole 16b is connected to the resonator hole 16a and the input / output terminal 17b.
And a high frequency signal. A dielectric filter having an electromagnetic field coupling hole at an intermediate point between the resonator holes 16a and 16b of the dielectric block 10 is often used.

【0004】誘電体フィルタ1Bは導体膜が形成されて
いない切込部17aおよび17bによってグランド電極
11Bと絶縁されている入出力端子12aおよび12b
を高周波数信号の入力端子または出力端子としている。
なお、誘電体フィルタ1Bは、共振子穴16aの一方の
端面がグランド電極11Bを構成していない開放面14
aであるとき、共振子穴16bの同じ端面はグランド電
極11Bを構成している短絡面15bとなっている。こ
の誘電体フィルタ1Bは短絡面15b等に近い裏面33
および裏面33に続く側面32a(または別の側面)に
入出力端子12aおよび12bをそれぞれ配置してい
る。これら入出力端子12aおよび12bは互いに等し
い形状および面積を有している。
The dielectric filter 1B has input / output terminals 12a and 12b insulated from the ground electrode 11B by cutouts 17a and 17b where no conductor film is formed.
Are input terminals or output terminals of high frequency signals.
In the dielectric filter 1B, one end face of the resonator hole 16a has an open face 14 that does not constitute the ground electrode 11B.
In the case of a, the same end surface of the resonator hole 16b is a short-circuit surface 15b constituting the ground electrode 11B. The dielectric filter 1B has a back surface 33 close to the short-circuit surface 15b and the like.
The input / output terminals 12a and 12b are arranged on a side surface 32a (or another side surface) following the back surface 33, respectively. These input / output terminals 12a and 12b have the same shape and area.

【0005】図4の誘電体フィルタ1Bは裏面33側を
図5のプリント基板2Bのグランド面21B側にリフロ
ー半田付けする。いま、誘電体フィルタ1Bの裏面33
の中心点O1においてx軸とy軸が交わるとし、プリン
ト基板2Bも同様の中心点O2,x軸およびy軸を定め
る。そして、図5のプリント基板2Bの座標を右上から
反時計回りに第1象限,第2象限,第3象限および第4
象限の4象限に分割すると、図4の誘電体ブロック10
の裏面33は入出力端子12bの位置する象限が第1象
限となり、以下時計回りに第2象限,第3象限および第
4象限になる。従って、入出力端子12aの位置する象
限が第3象限となる。
[0005] The dielectric filter 1B shown in FIG. 4 is reflow soldered on the back surface 33 side to the ground surface 21B side of the printed circuit board 2B shown in FIG. Now, the back surface 33 of the dielectric filter 1B
, The x-axis and the y-axis intersect at the center point O1, and the printed circuit board 2B also defines the same center point O2, the x-axis and the y-axis. Then, the coordinates of the printed circuit board 2B shown in FIG. 5 are moved counterclockwise from the upper right in the first quadrant, the second quadrant, the third quadrant, and the fourth quadrant.
When the quadrant is divided into four quadrants, the dielectric block 10 shown in FIG.
On the back surface 33, the quadrant in which the input / output terminal 12b is located becomes the first quadrant, and then becomes the second, third, and fourth quadrants in a clockwise direction. Therefore, the quadrant where the input / output terminal 12a is located is the third quadrant.

【0006】図5を参照すると、プリント基板2Bは銅
膜に金メッキを施した導体膜であるグランド面21B,
端子部22aおよび22bをレジンまたはプラスチック
を材料とする誘電体基板29の表面に形成している。グ
ランド面21Bの最大外形は誘電体フィルタ1Bの裏面
33の最大外形よりやや大きい。即ち、プリント基板2
B上の二点鎖線で示したフィルタ搭載部30の範囲内が
誘電体フィルタ1Bの搭載部である。端子部22aは誘
電体基板29上に導体膜を形成していない剥離部27a
によってグランド面21Bから絶縁され、端子部22b
も同様の剥離部27bによってグランド面21Bから絶
縁されている。
Referring to FIG. 5, the printed circuit board 2B has a ground surface 21B, which is a conductor film obtained by plating a copper film with gold,
The terminal portions 22a and 22b are formed on the surface of a dielectric substrate 29 made of resin or plastic. The maximum outer shape of the ground surface 21B is slightly larger than the maximum outer shape of the back surface 33 of the dielectric filter 1B. That is, the printed circuit board 2
The area within the filter mounting section 30 indicated by the two-dot chain line on B is the mounting section for the dielectric filter 1B. The terminal portion 22a is a peeled portion 27a on which no conductive film is formed on the dielectric substrate 29.
The terminal portion 22b is insulated from the ground surface 21B by the
Is also insulated from the ground surface 21B by a similar peeling portion 27b.

【0007】図6を参照すると、誘電体フィルタ1Bの
裏面33に形成されたグランド電極11B,入出力端子
12aおよび12bが、プリント基板2Bのグランド面
21B,端子部22aおよび22bにそれぞれリフロー
半田付けされる。図6においては、誘電体フィルタ1B
の裏面33がプリント基板2Bに側面32aに盛り上っ
た半田35d,35f,35gおよび図示されない半田
により半田付けされ、誘電体フィルタ1Bの上面31が
表面に現われている。半田35dは誘電体フィルタ1B
の入出力端子12aとプリント基板2Bの端子部22a
とを半田付けし、同様に、半田35fおよび35gがグ
ランド電極11B(図示せず)とグランド面21Bとを
半田付けしている。半田35d,35fおよび35g等
は半田付けの前にプリント基板2Bのグランド面21B
および端子部22a,22bに用意されている。
Referring to FIG. 6, ground electrode 11B and input / output terminals 12a and 12b formed on back surface 33 of dielectric filter 1B are reflow soldered to ground surface 21B and terminal portions 22a and 22b of printed circuit board 2B, respectively. Is done. In FIG. 6, the dielectric filter 1B
Is soldered to the printed circuit board 2B with the solders 35d, 35f, and 35g raised on the side surfaces 32a and solder (not shown), and the upper surface 31 of the dielectric filter 1B appears on the front surface. Solder 35d is dielectric filter 1B
Terminal 12a of the printed circuit board 2B
Similarly, solders 35f and 35g solder the ground electrode 11B (not shown) and the ground surface 21B. Before soldering, the solders 35d, 35f and 35g are grounded on the ground surface 21B of the printed circuit board 2B.
And the terminal portions 22a and 22b.

【0008】上述のリフロー半田付けにおいて、誘電体
フィルタ1Bは融けた状態から早く冷却して固着する上
記半田の位置に引張られる。半田35d,35fおよび
35g等の固着時間は、これら半田の位置する部分の熱
容量が小さい程早くなる。ここで、プリント基板2Bの
第1象限に位置する端子部22aおよび第3象限に位置
する端子部22bの導体膜形状およびその面積は、プリ
ント基板2Bの端子部22aおよび22bの第2象限お
よび第4象限に対応する位置,つまりx軸またはy軸に
関して対称点にあるA部およびB部と異なる。このた
め、端子部22aおよび22bの位置(つまり、入出力
端子12aおよび12bの位置)の熱容量は、A部およ
びB部(つまりA部およびB部に対応する位置のグラン
ド電極11B)の熱容量と明らかに異なることがわか
る。
In the above-described reflow soldering, the dielectric filter 1B is pulled from the molten state to the position of the solder where the dielectric filter 1B cools down quickly and is fixed. The fixing time of the solders 35d, 35f, 35g and the like becomes shorter as the heat capacity of the portions where these solders are located is smaller. Here, the conductor film shape and the area of the terminal portion 22a located in the first quadrant of the printed circuit board 2B and the terminal portion 22b located in the third quadrant are the same as those of the terminal portion 22a and the terminal portion 22b of the printed circuit board 2B. It is different from the positions corresponding to the four quadrants, that is, the portions A and B, which are symmetrical with respect to the x axis or the y axis. Therefore, the heat capacity at the positions of the terminal portions 22a and 22b (that is, the positions of the input / output terminals 12a and 12b) is the same as the heat capacity of the A portion and the B portion (that is, the ground electrode 11B at the position corresponding to the A portion and the B portion). It turns out that they are clearly different.

【0009】いま、A部およびB部の熱容量が端子部2
2aおよび22bの位置の熱容量より小さい場合には、
A部の半田35fおよび中心点O2に関してA部の点対
称の位置にある半田が、端子部22aの半田35dおよ
び端子部22bの位置にある半田より早く固着するの
で、誘電体フィルタ1BはA1およびA2の方向に,つ
まりプリント基板2Bのフィルタ搭載部30に対して反
時計方向に回転して固着されることになる。逆に、A部
およびB部の熱容量が端子部22aおよび22bの位置
の熱容量より大きい場合には、誘電体フィルタ1BはA
1およびA2とは逆方向に,つまりプリント基板2Bの
フィルタ搭載部30に対して時計方向に回転して固着さ
れることになる。なお、端子部22a,22b,A部お
よびB部の熱容量は誘電体フィルタ1Bおよびプリント
基板2Bの材質や寸法によって異なる。
Now, the heat capacity of the portions A and B is equal to that of the terminal 2
If it is smaller than the heat capacity at positions 2a and 22b,
Since the solder 35f of the portion A and the solder at the point symmetrical position of the portion A with respect to the center point O2 are fixed earlier than the solder 35d of the terminal portion 22a and the solder at the position of the terminal portion 22b, the dielectric filter 1B has A1 and A2. In the direction of A2, that is, in the counterclockwise direction with respect to the filter mounting portion 30 of the printed circuit board 2B, it is fixed. Conversely, when the heat capacities of the portions A and B are larger than the heat capacities at the terminals 22a and 22b, the dielectric filter 1B
1 and A2 are fixed in a direction opposite to that of A2, that is, in a clockwise direction with respect to the filter mounting portion 30 of the printed circuit board 2B. The heat capacities of the terminal portions 22a and 22b, the A portion and the B portion vary depending on the materials and dimensions of the dielectric filter 1B and the printed board 2B.

【0010】[0010]

【発明が解決しようとする課題】上述した誘電体フィル
タは、プリント基板にリフロー半田付けする場合に、プ
リント基板への最初の設定場所からの位置ずれを起すの
で、誘電体フィルタのグランド電極とプリント基板の端
子部とが接続され(ショートし)、誘電体フィルタの機
能を果さなくなる恐れがあるという問題があった。
When the above dielectric filter is reflow-soldered to a printed circuit board, the dielectric filter is displaced from a first set place on the printed circuit board. There is a problem that the terminals of the substrate may be connected (short-circuited) and the function of the dielectric filter may not be achieved.

【0011】従って、本発明の目的は、プリント基板へ
のリフロー半田付けにおいてプリント基板への設定位置
からの位置ずれを防止できる誘電体フィルタを提供する
ことにある。
Accordingly, it is an object of the present invention to provide a dielectric filter which can prevent a displacement from a set position on a printed circuit board during reflow soldering to the printed circuit board.

【0012】[0012]

【課題を解決するための手段】本発明の誘電体フィルタ
は、ほぼ直方体をなす誘電体ブロックと、前記誘電体ブ
ロックの二つの端面間を貫通する貫通穴およびこの貫通
穴の内壁面に施した導体膜を有する共振子穴と、前記誘
電体ブロックの外表面に導体膜を施して形成したグラン
ド電極と、前記誘電体ブロックの裏面に導体膜によって
形成されているとともに前記グランド電極と絶縁されて
いる入出力端子とを備える誘電体フィルタにおいて、前
記誘電体ブロックの裏面を4象限に分割したとき,前記
入出力端子の存在しない象限の前記入出力端子にほぼ対
応する場所に前記入出力端子と熱容量のほぼ等しい導体
膜で形成した熱補正部をさらに備える。
DISCLOSURE OF THE INVENTION The dielectric filter of the present invention is provided on a dielectric block having a substantially rectangular parallelepiped shape, a through hole penetrating between two end faces of the dielectric block, and an inner wall surface of the through hole. A resonator hole having a conductor film, a ground electrode formed by applying a conductor film to the outer surface of the dielectric block, and a conductor film formed on the back surface of the dielectric block and insulated from the ground electrode. And a rear surface of the dielectric block is divided into four quadrants, the input / output terminals are provided at locations substantially corresponding to the input / output terminals in the quadrant where the input / output terminals do not exist. The thermal correction unit further includes a conductive film having a substantially equal heat capacity.

【0013】前記誘電体フィルタの一つは、前記熱補正
部が、前記入出力端子とほぼ同じ面積を持つとともに前
記グランド電極に細い導体膜で接続されている構成をと
ることができる。
One of the dielectric filters may have a structure in which the thermal correction section has substantially the same area as the input / output terminals and is connected to the ground electrode by a thin conductor film.

【0014】前記誘電体フィルタの別の一つは、前記入
出力端子および前記熱補正部が、前記前記誘電体ブロッ
クの裏面に続く側面にも形成されている構成をとること
ができる。
Another one of the dielectric filters may have a configuration in which the input / output terminal and the thermal correction section are also formed on a side surface of the dielectric block which is continuous with a back surface of the dielectric block.

【0015】本発明による誘電体フィルタは、前記入出
力端子の存在しない象限の前記入出力端子にほぼ対応す
る場所に前記入出力端子と熱容量のほぼ等しい導体膜で
形成した熱補正部をさらに備えることにより、誘電体フ
ィルタの裏面の導体膜およびリフロー半田付けの相手側
であるプリント基板の熱容量を各象限でバランスさせる
ことができ、リフロー半田付けの際の半田の固着時間を
各象限で同一とさせてプリント基板への初期設定位置か
らの位置ずれを防ぐことができる。
[0015] The dielectric filter according to the present invention further includes a heat compensator formed of a conductive film having substantially the same heat capacity as the input / output terminal at a location substantially corresponding to the input / output terminal in the quadrant where the input / output terminal does not exist. By doing so, the heat capacity of the conductor film on the back surface of the dielectric filter and the printed circuit board that is the counterpart of reflow soldering can be balanced in each quadrant, and the solder fixing time during reflow soldering is the same in each quadrant. As a result, it is possible to prevent displacement from the initial setting position on the printed circuit board.

【0016】[0016]

【発明の実施の形態】次に、本発明について図面を参照
して説明する。図1は本発明の一実施の形態による誘電
体フィルタ1Aの斜視図である。図2は誘電体フィルタ
1Aを搭載するプリント基板2Aの正面図である。図3
は誘電体フィルタ1Aのプリント基板2Aへの実装状態
を示す斜視図である。
Next, the present invention will be described with reference to the drawings. FIG. 1 is a perspective view of a dielectric filter 1A according to one embodiment of the present invention. FIG. 2 is a front view of a printed circuit board 2A on which the dielectric filter 1A is mounted. FIG.
FIG. 3 is a perspective view showing a state in which the dielectric filter 1A is mounted on a printed circuit board 2A.

【0017】図1の誘電体フィルタ1Aは、上述した誘
電体フィルタ1Bのグランド電極11Aの一部を切込部
18aおよび18bにより除いて熱補正部13a,13
bおよびブリッジ部19a,19bを形成したものであ
る。以下、これらの変更点のみを説明する。
The dielectric filter 1A shown in FIG. 1 has thermal correction sections 13a and 13b except that a part of the ground electrode 11A of the above-described dielectric filter 1B is removed by cutouts 18a and 18b.
b and bridge portions 19a and 19b. Hereinafter, only these changes will be described.

【0018】熱補正部13aは、入出力端子12aとほ
ぼ同じ形状および面積を有する導体膜であり、入出力端
子12aのx軸に関する対称位置に設ける。なお、熱補
正部13aは、入出力端子12bともほぼ同じ形状およ
び面積を有し、入出力端子12bのy軸に関する対称位
置に設けられているとも言える。切込部18aは、入出
力端子12aを形成するための切込部17aと形状等の
基本的構成は同じであるが、熱補正部13aをグランド
電極11Aと接続するための6本の細い導体膜であるブ
リッジ部19aの部分を欠き、6個所に分離している。
ブリッジ部19aは、熱補正部13aの電位をグランド
電極11Aに保つ接続部であり、切込部18aの形成に
よる誘電体フィルタ1Aの誘電体フィルタ1Bからの電
気特性変動を少くしている。なお、ブリッジ部19aは
除去することが可能であり、この場合には後述するプリ
ント基板2Aのブリッジ部29aにより熱補正部13a
とグランド電極11Aとの接続が保たれる。
The thermal correction section 13a is a conductor film having substantially the same shape and area as the input / output terminal 12a, and is provided at a symmetrical position with respect to the x-axis of the input / output terminal 12a. In addition, it can be said that the heat correction unit 13a has substantially the same shape and area as the input / output terminal 12b, and is provided at a symmetric position with respect to the y-axis of the input / output terminal 12b. The notch 18a has the same basic configuration and the like as the notch 17a for forming the input / output terminal 12a, but has six thin conductors for connecting the heat compensator 13a to the ground electrode 11A. The bridge portion 19a, which is a film, is omitted, and is separated into six portions.
The bridge portion 19a is a connection portion that keeps the potential of the heat correction portion 13a at the ground electrode 11A, and reduces the variation in electric characteristics of the dielectric filter 1A from the dielectric filter 1B due to the formation of the cutout portion 18a. Note that the bridge 19a can be removed. In this case, the bridge 29a of the printed circuit board 2A, which will be described later, uses the heat compensator 13a.
And the connection with the ground electrode 11A is maintained.

【0019】熱補正部13bは、入出力端子12bとほ
ぼ同じ形状および面積を有する導体膜であり、入出力端
子12bのx軸に関する対称位置に設ける。熱補正部1
3bも、入出力端子12aとほぼ同じ形状および面積を
有し、入出力端子12aのy軸に関する対称位置に設け
られていると言える。熱補正部13bに付随して切込部
18bおよびブリッジ部19bが設けられ、切込部18
bおよびブリッジ部19bの構成および機能は切込部1
8aおよびブリッジ部19aのそれとそれぞれ同じであ
る。
The thermal correction section 13b is a conductor film having substantially the same shape and area as the input / output terminal 12b, and is provided at a symmetrical position with respect to the x-axis of the input / output terminal 12b. Thermal correction unit 1
3b also has substantially the same shape and area as the input / output terminal 12a, and can be said to be provided at a symmetric position with respect to the y-axis of the input / output terminal 12a. A cut portion 18b and a bridge portion 19b are provided in association with the heat correcting portion 13b.
b and the bridge 19b have the notch 1
8a and the bridge portion 19a.

【0020】熱補正部13aおよび13bは入出力端子
12aおよび12bとほぼ同じ構成であるので、これら
4者はほぼ同じ熱容量を有することになる。また、熱補
正部13aは第1象限上の入出力端子12aに対して第
4象限上での対応する位置にあり,熱補正部13bは第
3象限上の入出力端子12bに対して第2象限上での対
応する位置にある。従って、入出力端子12a,12b
および熱補正部13a,13bが誘電体ブロック10の
裏面33を4象限に分割した全ての象限にバランスよく
配置されていることになる。
Since the heat compensators 13a and 13b have substantially the same configuration as the input / output terminals 12a and 12b, these four have substantially the same heat capacity. Further, the heat correction unit 13a is located at a corresponding position on the fourth quadrant with respect to the input / output terminal 12a on the first quadrant, and the heat correction unit 13b is connected with the second input / output terminal 12b on the third quadrant. At the corresponding position in the quadrant. Therefore, the input / output terminals 12a, 12b
In addition, the thermal correction units 13a and 13b are arranged in a balanced manner in all quadrants obtained by dividing the back surface 33 of the dielectric block 10 into four quadrants.

【0021】図2のプリント基板2Aは、上述したプリ
ント基板2Bのグランド面21Bの一部を剥離部28a
および28bにより除いて補正部23a,23bおよび
ブリッジ部29a,29bを形成したものである。これ
ら、剥離部28a,28b,補正部23a,23bおよ
びブリッジ部29a,29bは、誘電体フィルタ1Aの
切込部18a,18b,熱補正部13a,13bおよび
ブリッジ部19a,19bの形成にそれぞれ対応して形
成されている。以下、これらの変更点のみを説明する。
In the printed circuit board 2A of FIG. 2, a part of the ground surface 21B of the above-described printed circuit board 2B is separated by a peeling portion 28a.
The correction parts 23a and 23b and the bridge parts 29a and 29b are formed except for the parts 28 and 28b. These stripped portions 28a, 28b, correction portions 23a, 23b, and bridge portions 29a, 29b correspond to the formation of cut portions 18a, 18b, thermal correction portions 13a, 13b, and bridge portions 19a, 19b of dielectric filter 1A, respectively. It is formed. Hereinafter, only these changes will be described.

【0022】補正部23aは、端子部22aとほぼ同じ
形状および面積を有し、端子部22aのx軸に関する対
称位置に設ける。この補正部23aは端子部22bとも
ほぼ同じ形状および面積を有し、端子部22bのy軸に
関する対称位置に設けられているとも言える。剥離部2
8aは、端子部22aを形成するための剥離部27aと
形状等の基本的構成は同じであるが、補正部23aをグ
ランド面21Aと接続するための2本の細い導体膜であ
るブリッジ部29aの部分を欠き、4個所に分離してい
る。補正部23bは、端子部22bとほぼ同じ形状およ
び面積を有し、端子部22bのx軸に関する対称位置に
設ける。補正部23bも、端子部22aとほぼ同じ形状
および面積を有し、端子部22aのy軸に関する対称位
置に設けられていると言える。補正部23bに付随して
剥離部28bおよびブリッジ部29bが設けられ、剥離
部28bおよびブリッジ部29bの構成および機能は剥
離部28aおよびブリッジ部29aのそれとそれぞれ同
じである。補正部23aおよび23bは端子部22aお
よび22bとほぼ同じ構成であるので、これら4者はほ
ぼ同じ熱容量を有することになる。また、補正部23a
および23bは誘電体フィルタ1Aの熱補正部13aお
よび13bにリフロー半田付けされる位置にある。
The correction portion 23a has substantially the same shape and area as the terminal portion 22a, and is provided at a symmetrical position with respect to the x axis of the terminal portion 22a. It can be said that the correction portion 23a has substantially the same shape and area as the terminal portion 22b, and is provided at a symmetrical position with respect to the y-axis of the terminal portion 22b. Peeling part 2
8a has the same basic configuration as the peeling portion 27a for forming the terminal portion 22a in shape and the like, but a bridge portion 29a which is two thin conductor films for connecting the correcting portion 23a to the ground surface 21A. And is separated into four parts. The correction section 23b has substantially the same shape and area as the terminal section 22b, and is provided at a symmetric position with respect to the x-axis of the terminal section 22b. It can be said that the correction section 23b also has substantially the same shape and area as the terminal section 22a, and is provided at a symmetric position with respect to the y-axis of the terminal section 22a. A peeling section 28b and a bridge section 29b are provided in association with the correction section 23b, and the configurations and functions of the peeling section 28b and the bridge section 29b are the same as those of the peeling section 28a and the bridge section 29a, respectively. Since the correction parts 23a and 23b have substantially the same configuration as the terminal parts 22a and 22b, these four have substantially the same heat capacity. The correction unit 23a
And 23b are located at positions where they are reflow-soldered to the thermal correctors 13a and 13b of the dielectric filter 1A.

【0023】図3を参照すると、誘電体フィルタ1Aの
裏面33に形成されているグランド電極11Aおよび入
出力端子12a,12bが、プリント基板2Aのグラン
ド面21Aおよび端子部22a,22bにそれぞれリフ
ロー半田付けされる。図3においては、誘電体フィルタ
1Aの裏面33が側面32aにも盛り上っている半田3
5a,35b,35c,35d,35eおよび図示され
ない半田によりプリント基板2Aに半田付けされ、誘電
体フィルタ1Aの上面31が表面に現われている。半田
35aおよび35dは誘電体フィルタ1Aの熱補正部1
3aとプリント基板2Aの補正部23aおよび入出力端
子12aと端子部22aとを半田付けし、同様に、半田
35a,35cおよび35eがグランド電極11A(図
示せず)とグランド面21Aとを半田付けしている。半
田35aないし35e等は半田付けの前にプリント基板
2Aのグランド面21A,端子部22a,22bおよび
補正部23a,23bに用意されている。
Referring to FIG. 3, ground electrode 11A and input / output terminals 12a and 12b formed on back surface 33 of dielectric filter 1A are connected to ground surface 21A and terminal portions 22a and 22b of printed circuit board 2A by reflow soldering, respectively. Attached. In FIG. 3, the back surface 33 of the dielectric filter 1 </ b> A has the solder 3 on the side surface 32 a as well.
5a, 35b, 35c, 35d, 35e and solder (not shown) are soldered to the printed circuit board 2A, and the upper surface 31 of the dielectric filter 1A appears on the surface. The solders 35a and 35d are connected to the thermal correction unit 1 of the dielectric filter 1A.
3a, the correction portion 23a of the printed circuit board 2A, the input / output terminal 12a, and the terminal portion 22a, and similarly, the solders 35a, 35c, and 35e solder the ground electrode 11A (not shown) and the ground surface 21A. doing. The solders 35a to 35e are prepared on the ground surface 21A of the printed circuit board 2A, the terminals 22a and 22b, and the correction units 23a and 23b before soldering.

【0024】上述のリフロー半田付けにおいては、誘電
体フィルタ1Aの入出力端子12a,12b,熱補正部
13a,13bおよびこれらにそれぞれ対応するプリン
ト基板2Aの端子部22a,22b,補正部23a,2
3bが誘電体フィルタ1Aおよびプリント基板2Aの4
分割された各象限に熱バランスよく配置されているの
で、半田35a,35b,35c,35d,35e等は
殆ど同時刻に固着する。従って、誘電体フィルタ1Aは
プリント基板2Aに初期設定された位置からの位置ずれ
を起すことがなく、誘電体フィルタ1Aのグランド電極
11Aとプリント基板2Aの端子部22aや22bとが
接続されて本来のフィルタ機能を果さなくなる恐れを解
消できる。
In the above-described reflow soldering, the input / output terminals 12a and 12b of the dielectric filter 1A, the thermal correctors 13a and 13b, and the corresponding terminals 22a and 22b of the printed circuit board 2A and the correctors 23a and 2b, respectively.
3b is the dielectric filter 1A and 4 of the printed circuit board 2A.
Since the solders 35a, 35b, 35c, 35d, 35e and the like are fixed at almost the same time because they are arranged in a well-balanced manner in each of the divided quadrants. Accordingly, the dielectric filter 1A does not shift from the position initially set on the printed circuit board 2A, and the ground electrode 11A of the dielectric filter 1A is connected to the terminal portions 22a and 22b of the printed circuit board 2A. Can be eliminated.

【0025】なお、誘電体フィルタ1Aの熱補正部13
aおよび13bは、入出力端子12aおよび12bにほ
ぼ対応する位置で熱容量をほぼ同じ同じにする形状およ
び分割状態であればよく、本発明における熱補正部は上
述の形状に限定されるものではない。
The thermal correction unit 13 of the dielectric filter 1A
a and 13b may have a shape and a divided state in which heat capacities are substantially the same at positions substantially corresponding to the input / output terminals 12a and 12b, and the heat correction unit in the present invention is not limited to the above-described shape. .

【0026】また、本発明は、図1ないし図3に示した
実施の形態の誘電体フィルタ1Aの如き、裏面33の第
1象限および第3象限に入出力端子12aおよび12b
を備える形式に限定されない。即ち、特開平5−167
310号公報の如く、裏面の第1象限および第2象限に
入出力端子を有する形式の誘電体フィルタでは、入出力
端子の存在しない第3象限および第4象限に上述の熱補
正部13aおよび13bと同等の熱補正部を設けること
により、プリント基板へのリフロー半田付けに際して初
期設定された位置からの位置ずれを防ぐことができる。
Also, according to the present invention, the input / output terminals 12a and 12b are provided in the first and third quadrants of the back surface 33, such as the dielectric filter 1A of the embodiment shown in FIGS.
It is not limited to the format provided with. That is, JP-A-5-167
As disclosed in Japanese Patent Application Publication No. 310-310, in a dielectric filter of a type having input / output terminals in the first and second quadrants on the back surface, the above-described thermal correction units 13a and 13b are provided in the third and fourth quadrants where no input / output terminals exist. By providing a thermal correction unit equivalent to that described above, it is possible to prevent misalignment from an initially set position during reflow soldering to a printed circuit board.

【0027】[0027]

【発明の効果】以上説明したように本発明の誘電体フィ
ルタは、誘電体ブロックの裏面を4象限に分割したと
き,高周波数信号の入出力端子の存在しない象限の前記
入出力端子にほぼ対応する場所に前記入出力端子と熱容
量のほぼ等しい導体膜で形成された熱補正部を備えるの
で、プリント基板へのリフロー半田付けに際して初期設
定された位置からの位置ずれを防ぐことができ、誘電体
フィルタの機能を十分に発揮させることができるという
効果がある。
As described above, the dielectric filter of the present invention, when the back surface of the dielectric block is divided into four quadrants, almost corresponds to the input / output terminals in the quadrant where there are no input / output terminals for high frequency signals. Since the thermal correction section formed of a conductive film having substantially the same heat capacity as the input / output terminal is provided at a location where the input / output terminal is mounted, it is possible to prevent a displacement from an initially set position at the time of reflow soldering to a printed circuit board, and There is an effect that the function of the filter can be sufficiently exhibited.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の一実施の形態による誘電体フィルタ1
Aの斜視図である。
FIG. 1 shows a dielectric filter 1 according to an embodiment of the present invention.
It is a perspective view of A.

【図2】誘電体フィルタ1Aを搭載するプリント基板2
Aの正面図である。
FIG. 2 is a printed circuit board 2 on which a dielectric filter 1A is mounted.
It is a front view of A.

【図3】誘電体フィルタ1Aのプリント基板2Aへの実
装状態を示す斜視図である。
FIG. 3 is a perspective view showing a mounting state of a dielectric filter 1A on a printed circuit board 2A.

【図4】従来技術による誘電体フィルタ1Bの斜視図で
ある。
FIG. 4 is a perspective view of a conventional dielectric filter 1B.

【図5】誘電体フィルタ1Bを搭載するプリント基板2
Bの正面図である。
FIG. 5 is a printed circuit board 2 on which a dielectric filter 1B is mounted.
It is a front view of B.

【図6】誘電体フィルタ1Bのプリント基板2Bへの実
装状態を示す斜視図である。
FIG. 6 is a perspective view showing a state in which a dielectric filter 1B is mounted on a printed circuit board 2B.

【符号の説明】[Explanation of symbols]

1A 誘電体フィルタ 10 誘電体ブロック 11A グランド電極 12a,12b 入出力端子 13a,13b 熱補正部 14a,14b 開放面 15a,15b 短絡面 16a,16b 共振子穴 17a,17b,18a,18b 切込部 19a,19b ブリッジ部 31 上面 31a 側面 2A プリント基板 21A グランド面 22a,22b 端子部 23a,23b 補正部 27a,27b,28a,28b 剥離部 29a,29b ブリッジ部 30 フィルタ搭載部 35a〜35e 半田 1A Dielectric filter 10 Dielectric block 11A Ground electrode 12a, 12b Input / output terminal 13a, 13b Thermal correction unit 14a, 14b Open surface 15a, 15b Short-circuit surface 16a, 16b Resonator hole 17a, 17b, 18a, 18b Notch 19a , 19b Bridge portion 31 Top surface 31a Side surface 2A Printed circuit board 21A Ground surface 22a, 22b Terminal portion 23a, 23b Correction portion 27a, 27b, 28a, 28b Stripping portion 29a, 29b Bridge portion 30 Filter mounting portion 35a to 35e Solder

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 ほぼ直方体をなす誘電体ブロックと、前
記誘電体ブロックの二つの端面間を貫通する貫通穴およ
びこの貫通穴の内壁面に施した導体膜を有する共振子穴
と、前記誘電体ブロックの外表面に導体膜を施して形成
したグランド電極と、前記誘電体ブロックの裏面に導体
膜によって形成されているとともに前記グランド電極と
絶縁されている入出力端子とを備える誘電体フィルタに
おいて、 前記誘電体ブロックの裏面を4象限に分割したとき,前
記入出力端子の存在しない象限の前記入出力端子にほぼ
対応する場所に前記入出力端子と熱容量のほぼ等しい導
体膜で形成した熱補正部をさらに備えることを特徴とす
る誘電体フィルタ。
1. A dielectric block having a substantially rectangular parallelepiped shape, a through hole penetrating between two end faces of the dielectric block, and a resonator hole having a conductor film formed on an inner wall surface of the through hole, and the dielectric body. In a dielectric filter comprising a ground electrode formed by applying a conductor film to the outer surface of the block, and an input / output terminal formed of a conductor film on the back surface of the dielectric block and insulated from the ground electrode, When the back surface of the dielectric block is divided into four quadrants, a thermal compensator formed of a conductive film having substantially the same heat capacity as that of the input / output terminals at a position substantially corresponding to the input / output terminals of the quadrant where the input / output terminals do not exist. A dielectric filter, further comprising:
【請求項2】 前記熱補正部が、前記入出力端子とほぼ
同じ面積を持つとともに前記グランド電極に細い導体膜
で接続されていることを特徴とする請求項1記載の誘電
体フィルタ。
2. The dielectric filter according to claim 1, wherein the thermal correction unit has substantially the same area as the input / output terminal and is connected to the ground electrode with a thin conductor film.
【請求項3】 前記入出力端子および前記熱補正部が、
前記前記誘電体ブロックの裏面に続く側面にも形成され
ていることを特徴とする請求項1記載の誘電体フィル
タ。
3. The input / output terminal and the thermal compensator are
The dielectric filter according to claim 1, wherein the dielectric filter is also formed on a side surface of the dielectric block that is continuous with a back surface of the dielectric block.
JP8092135A 1996-04-15 1996-04-15 Dielectric filter Expired - Fee Related JP2821416B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8092135A JP2821416B2 (en) 1996-04-15 1996-04-15 Dielectric filter

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8092135A JP2821416B2 (en) 1996-04-15 1996-04-15 Dielectric filter

Publications (2)

Publication Number Publication Date
JPH09284005A true JPH09284005A (en) 1997-10-31
JP2821416B2 JP2821416B2 (en) 1998-11-05

Family

ID=14045997

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8092135A Expired - Fee Related JP2821416B2 (en) 1996-04-15 1996-04-15 Dielectric filter

Country Status (1)

Country Link
JP (1) JP2821416B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010045324A (en) * 2008-06-23 2010-02-25 Denso Corp Electronic circuit board and electronic control device

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4992548A (en) * 1973-01-10 1974-09-04
JPS6062191A (en) * 1983-09-14 1985-04-10 日本電気株式会社 Method of soldering chip carrier
JPH0463489A (en) * 1990-07-03 1992-02-28 Fujitsu Ltd Soldering structure for multiterminal surface mounting type component
JPH04314355A (en) * 1991-04-12 1992-11-05 Nec Corp Chip carrier and soldering method thereof
JPH07302732A (en) * 1994-05-09 1995-11-14 Fuji Elelctrochem Co Ltd Multilayered chip component and multlayered chip filter, and manufacture of multilayered chip component
JPH0865009A (en) * 1994-08-22 1996-03-08 Murata Mfg Co Ltd Dielectric filter

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4992548A (en) * 1973-01-10 1974-09-04
JPS6062191A (en) * 1983-09-14 1985-04-10 日本電気株式会社 Method of soldering chip carrier
JPH0463489A (en) * 1990-07-03 1992-02-28 Fujitsu Ltd Soldering structure for multiterminal surface mounting type component
JPH04314355A (en) * 1991-04-12 1992-11-05 Nec Corp Chip carrier and soldering method thereof
JPH07302732A (en) * 1994-05-09 1995-11-14 Fuji Elelctrochem Co Ltd Multilayered chip component and multlayered chip filter, and manufacture of multilayered chip component
JPH0865009A (en) * 1994-08-22 1996-03-08 Murata Mfg Co Ltd Dielectric filter

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010045324A (en) * 2008-06-23 2010-02-25 Denso Corp Electronic circuit board and electronic control device

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