JP2001177012A - Wiring board for high frequency - Google Patents
Wiring board for high frequencyInfo
- Publication number
- JP2001177012A JP2001177012A JP33681599A JP33681599A JP2001177012A JP 2001177012 A JP2001177012 A JP 2001177012A JP 33681599 A JP33681599 A JP 33681599A JP 33681599 A JP33681599 A JP 33681599A JP 2001177012 A JP2001177012 A JP 2001177012A
- Authority
- JP
- Japan
- Prior art keywords
- conductor
- line
- ground
- frequency
- coplanar
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
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- Waveguide Connection Structure (AREA)
- Waveguides (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は電気的特性を向上さ
せた高周波入出力部を具備する高周波用配線基板に関す
るものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a high-frequency wiring board having a high-frequency input / output section with improved electrical characteristics.
【0002】[0002]
【従来の技術】高周波回路用基板や高周波用半導体素子
収納用パッケージ・高周波用半導体素子搭載用チップキ
ャリア等に用いられる高周波用配線基板においては、そ
の上面に搭載される高周波用半導体素子等の高周波用部
品とその高周波用配線基板が実装される外部電気回路基
板の高周波用回路とを電気的に接続するために、高周波
信号を伝送するための高周波用伝送線路を上面と下面と
に形成してそれらを貫通導体で電気的に接続して成る高
周波入出力部が形成される。そして、その高周波用配線
基板を外部電気回路基板に搭載するとともに下面の高周
波用伝送線路を外部電気回路基板の接続用線路導体に電
気的に接続することにより、高周波用配線基板が実装さ
れて使用されることとなる。2. Description of the Related Art In a high-frequency wiring board used for a high-frequency circuit board, a high-frequency semiconductor element storage package, a high-frequency semiconductor element mounting chip carrier, and the like, a high-frequency semiconductor element or the like mounted on the upper surface thereof is used. High-frequency transmission lines for transmitting high-frequency signals are formed on the upper and lower surfaces to electrically connect the components for high-frequency wiring of the external electric circuit board on which the high-frequency wiring board is mounted. A high-frequency input / output section is formed by electrically connecting them with a through conductor. The high-frequency wiring board is mounted on the external electric circuit board, and the high-frequency transmission line on the lower surface is electrically connected to the connection line conductor of the external electric circuit board, so that the high-frequency wiring board is mounted and used. Will be done.
【0003】そのような従来の高周波用配線基板を高周
波用半導体装置を実装するパッケージに適用した例とし
て、例えば特許第2605502 号公報に記載されたパッケー
ジがある。このパッケージは、パッケージ基板と、この
パッケージ基板に装着されたパッケージ側壁と、パッケ
ージ側壁により囲まれて形成されたキャビティを封止す
るフタと、キャビティ内に設けられた半導体集積回路チ
ップを実装するダイボンディング領域と、キャビティ内
に設けられた誘電体基板の表面上に金属薄膜からなる内
部高周波伝送線路を有し、パッケージ基板の底面部に金
属薄膜により形成したリード端子をなす外部コプレーナ
線路と、内部高周波伝送線路と外部コプレーナ線路を電
気的に接続する金属からなるバイアホールとから構成さ
れたパッケージにおいて、キャビティ内に形成される内
部高周波伝送線路を、コプレーナ線路で構成し、内部高
周波伝送線路と外部コプレーナ線路のそれぞれの接地金
属間を金属からなる複数のバイアホールにより接続した
ことを特徴とするものである。As an example in which such a conventional high-frequency wiring board is applied to a package for mounting a high-frequency semiconductor device, there is a package described in, for example, Japanese Patent No. 2605502. The package includes a package substrate, a package side wall mounted on the package substrate, a lid for sealing a cavity formed by being surrounded by the package side wall, and a die for mounting a semiconductor integrated circuit chip provided in the cavity. An external coplanar line having a bonding area, an internal high-frequency transmission line made of a metal thin film on the surface of a dielectric substrate provided in the cavity, and a lead terminal formed of the metal thin film on the bottom of the package substrate; In a package consisting of a high-frequency transmission line and a via hole made of metal that electrically connects the external coplanar line, the internal high-frequency transmission line formed in the cavity is constituted by a coplanar line, and the internal high-frequency transmission line and the external A plurality of metal bars are provided between each ground metal of the coplanar line. It is characterized in that it has connected by via hole.
【0004】これによれば、内部高周波伝送線路をコプ
レーナ線路として構成したので、その信号線と接地金属
との間隔を適切に選択することにより、信号線の線路幅
をICチップ上のマイクロストリップ線路の線路幅と適
合させることが可能となり、損失を低く抑え、反射損失
も低下させることができるというものである。According to this, since the internal high-frequency transmission line is configured as a coplanar line, the line width of the signal line can be reduced by appropriately selecting the distance between the signal line and the ground metal. The line width can be adjusted to a lower value, the loss can be reduced, and the reflection loss can be reduced.
【0005】また、外部コプレーナ線路と内部高周波伝
送線路を複数のバイアホールや同軸構造のバイアホール
により接続した場合には、高周波的な不整合も少なく、
かつアイソレーションを高めることが可能であるという
ものである。Further, when the external coplanar line and the internal high-frequency transmission line are connected by a plurality of via holes or via holes having a coaxial structure, high-frequency mismatch is small, and
In addition, it is possible to increase the isolation.
【0006】なお、このように高周波用伝送線路として
コプレーナ線路が用いられるのは、高周波用配線基板に
高周波用部品が搭載される側(上面)の信号線路のパタ
ーン幅と下面の外部電気回路基板に実装される側(下
面)の信号線路のパターン幅との不連続性を補償した
り、信号線間のアイソレーションを向上させる目的から
は、マイクロストリップ線路に比べてコプレーナ線路同
士の接続が好ましいことによるものである。The reason why the coplanar line is used as the high-frequency transmission line is that the pattern width of the signal line on the side (upper surface) on which the high-frequency component is mounted on the high-frequency wiring board and the external electric circuit substrate on the lower surface are used. For the purpose of compensating for the discontinuity with the pattern width of the signal line on the side (lower surface) mounted on the substrate and improving the isolation between the signal lines, it is preferable to connect the coplanar lines as compared with the microstrip line. It is because of that.
【0007】[0007]
【発明が解決しようとする課題】しかしながら、上記特
許第2605502 号公報に記載されたパッケージに適用され
た高周波用配線基板では、内部高周波伝送線路であるコ
プレーナ線路と貫通導体であるバイアホールとの接続部
におけるグランドの位相と、外部コプレーナ線路とバイ
アホールとの接続部におけるグランドの位相との間にバ
イアホールを介して表面と裏面のグランドが導通され、
グランド経路が長くなることからずれが発生していた。
そのため、内部のコプレーナ線路と外部コプレーナ線路
との接続部において、伝送される高周波信号の反射が発
生し、反射損失が増大するという問題点があった。However, in the high-frequency wiring board applied to the package described in Japanese Patent No. 2605502, a connection between a coplanar line as an internal high-frequency transmission line and a via hole as a through conductor. Between the ground phase at the portion and the ground phase at the connection between the external coplanar line and the via hole, the ground on the front and back surfaces is conducted through the via hole,
The shift occurred due to the long ground path.
Therefore, there is a problem in that reflection of a transmitted high-frequency signal occurs at a connection portion between the internal coplanar line and the external coplanar line, and the reflection loss increases.
【0008】本発明は上記従来技術の問題点に鑑みて案
出されたものであり、その目的は、コプレーナ線路と貫
通導体との接続部におけるグランドの位相のずれをなく
し、高周波信号の反射損失を抑えることができる高周波
入出力部を具備する高周波用配線基板を提供することに
ある。SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems of the prior art, and has as its object to eliminate a phase shift of the ground at the connection between the coplanar line and the through conductor, and to reduce the reflection loss of a high-frequency signal. It is an object of the present invention to provide a high-frequency wiring board provided with a high-frequency input / output unit capable of suppressing the occurrence of the high-frequency wiring.
【0009】[0009]
【課題を解決するための手段】本発明の高周波用配線基
板は、誘電体基板の上面に形成された高周波信号を伝送
するための第1のコプレーナ線路と、前記誘電体基板の
下面に前記第1のコプレーナ線路と平行に形成された第
2のコプレーナ線路とを、前記誘電体基板の内部に形成
された内層接地導体を挟んで対向配置するとともに、両
コプレーナ線路の線路導体の先端同士を前記内層接地導
体と絶縁された貫通導体で電気的に接続し、かつこの貫
通導体から前記両コプレーナ線路に直交する方向の両側
で0.2〜5mmの距離の位置において、両コプレーナ
線路の接地導体同士を前記内層接地導体と電気的に接続
された接地貫通導体で電気的に接続して成る高周波入出
力部を具備することを特徴とするものである。A high-frequency wiring board according to the present invention comprises a first coplanar line formed on an upper surface of a dielectric substrate for transmitting a high-frequency signal, and a first coplanar line formed on a lower surface of the dielectric substrate. The first coplanar line and a second coplanar line formed in parallel with each other are disposed to face each other with an inner layer ground conductor formed inside the dielectric substrate interposed therebetween. The ground conductors of the two coplanar lines are electrically connected to each other by a through conductor insulated from the inner layer ground conductor, and at a distance of 0.2 to 5 mm from both sides of the through conductor in a direction orthogonal to the two coplanar lines. And a high-frequency input / output unit electrically connected to the inner layer ground conductor by a ground through conductor electrically connected to the inner layer ground conductor.
【0010】本発明の高周波用配線基板によれば、高周
波入出力部の構成を、誘電体基板内に形成した内層接地
導体を挟んで第1および第2のコプレーナ線路を対向配
置し、両コプレーナ線路の線路導体の先端同士を電気的
に接続した貫通導体から上記所定の位置において内層接
地導体と電気的に接続された接地貫通導体を介して両コ
プレーナ線路の接地導体同士を電気的に接続して成るも
のとしたことから、接続部を貫通導体と内層接地導体と
接地貫通導体とにより貫通導体の周りに接地導体を配し
てインピーダンス整合を行なうため、同軸構造に近い電
気的特性を有するものとすることができ、高周波的な不
整合を少なくして反射損失を低減することができる。ま
た、コプレーナ線路間に内層接地導体を形成し、この内
層接地導体と両方のコプレーナ線路の接地導体とを接地
貫通導体で電気的に接続したことから、接地導体が同一
平面であるため、従来のようなバイアホールの長さに伴
う信号線路が長くなることによるグランドの位相差がな
くなるため、線路導体と貫通導体との接続部におけるグ
ランドの位相を等しくしてそのずれをなくすことがで
き、高周波信号の反射の発生を抑制して反射損失を抑え
ることができる。According to the high-frequency wiring board of the present invention, the structure of the high-frequency input / output unit is such that the first and second coplanar lines are arranged opposite to each other with the inner-layer ground conductor formed in the dielectric substrate interposed therebetween. The ground conductors of the two coplanar lines are electrically connected to each other through the ground through conductor electrically connected to the inner-layer ground conductor at the predetermined position from the through conductor that electrically connects the ends of the line conductors of the line. Since the connection part is formed by the through conductor, the inner-layer ground conductor, and the ground through conductor, the ground conductor is arranged around the through conductor to perform impedance matching, and therefore has electrical characteristics close to a coaxial structure. And the high-frequency mismatch can be reduced to reduce the reflection loss. In addition, since an inner-layer ground conductor is formed between the coplanar lines, and the inner-layer ground conductor and the ground conductors of both coplanar lines are electrically connected by the ground through conductor, the ground conductor is in the same plane. Since the phase difference of the ground due to the length of the signal line due to the length of the via hole is eliminated, the phase of the ground at the connection portion between the line conductor and the through conductor can be equalized and the shift can be eliminated. The reflection loss can be suppressed by suppressing the occurrence of signal reflection.
【0011】さらに、本発明の高周波用配線基板によれ
ば、第2のコプレーナ線路の線路導体にリード端子を取
着する場合に、リード端子の取着強度を増すためには線
路導体のパターン幅とリード端子の幅とが関係するのに
対して、第2のコプレーナ線路と内層接地導体との距離
を離してインピーダンスマッチングを行なうことにより
線路導体のパターン幅を広げることができ、リード端子
の取着強度を増すことができる。Further, according to the high-frequency wiring board of the present invention, when the lead terminal is attached to the line conductor of the second coplanar line, the pattern width of the line conductor is required to increase the attachment strength of the lead terminal. And the width of the lead terminal are related to each other, the impedance of the second coplanar line and the inner-layer ground conductor are separated to perform impedance matching, so that the line width of the line conductor can be increased. The wearing strength can be increased.
【0012】また、本発明の高周波用配線基板は、上記
構成において、前記第1および第2のコプレーナ線路の
前記接地導体をそれぞれの前記線路導体の先端を囲むよ
うに延設し、かつこの線路導体の先端の前記伝送方向の
延長方向で前記貫通導体から0.2〜5mmの位置にお
いて、前記内層接地導体と前記延設した接地導体とをそ
れぞれ補助接地貫通導体で電気的に接続したことを特徴
とするものである。Further, in the high-frequency wiring board according to the present invention, the ground conductor of the first and second coplanar lines extends so as to surround a tip of each of the line conductors. At a position of 0.2 to 5 mm from the through conductor in the extension direction of the transmission direction at the tip of the conductor, the inner-layer ground conductor and the extended ground conductor are electrically connected by auxiliary ground through conductors, respectively. It is a feature.
【0013】このように線路導体の先端の伝送方向の延
長方向に接地導体を延設するとともに、その方向の所定
位置で延設した接地導体と内層接地導体とを補助接地貫
通導体で電気的に接続した場合には、信号伝送方向に接
地貫通導体を設けることによって、接地導体の壁が形成
されることとなるため、線路導体の先端から伝送方向の
延長方向に向かう誘電体基板内への高周波信号の電磁界
の漏れを効果的に抑制することができ、高周波入出力部
における高周波信号の反射損失をさらに抑制することが
できる。As described above, the ground conductor extends in the direction of extension of the transmission direction at the tip of the line conductor, and the ground conductor and the inner-layer ground conductor extending at a predetermined position in the direction are electrically connected by the auxiliary ground through conductor. In the case of connection, since the ground conductor wall is formed by providing the ground through conductor in the signal transmission direction, the high-frequency wave from the tip of the line conductor into the dielectric substrate extending in the transmission direction extension direction. Leakage of the electromagnetic field of the signal can be effectively suppressed, and reflection loss of the high-frequency signal at the high-frequency input / output unit can be further suppressed.
【0014】[0014]
【発明の実施の形態】以下、本発明の高周波用配線基板
を図面に基づいて説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a high-frequency wiring board according to the present invention will be described with reference to the drawings.
【0015】図1は本発明の高周波用配線基板の実施の
形態の一例を示すものであり、それぞれ(a)は上面
図、(b)は(a)のA−A’線断面図、(c)は
(a)のB−B’線断面図、(d)は下面図である。い
ずれも高周波入出力部の近傍を示している。FIGS. 1A and 1B show an embodiment of a high-frequency wiring board according to the present invention. FIG. 1A is a top view, FIG. 1B is a cross-sectional view taken along the line AA ′ of FIG. (c) is a sectional view taken along the line BB 'of (a), and (d) is a bottom view. Each shows the vicinity of the high frequency input / output unit.
【0016】これらの図において、1は高周波用配線基
板である。2は誘電体基板、3は誘電体基板2の上面に
形成された高周波信号を伝送するための第1の線路導
体、4は第1の線路導体3の両側に配設された第1の接
地導体であり、これら線路導体3と接地導体4とで第1
のコプレーナ線路5が構成されている。6は誘電体基板
2の下面にその先端が第1の線路導体3と対向するよう
にして第1の線路導体3と平行に形成された第2の線路
導体、7は第2の線路導体6の両側に配設された第2の
接地導体であり、これら線路導体6と接地導体7とで第
2のコプレーナ線路8が構成されている。この例では、
第1および第2のコプレーナ線路5・8をそれぞれ2本
ずつ形成している。In these figures, reference numeral 1 denotes a high-frequency wiring board. Reference numeral 2 denotes a dielectric substrate, 3 denotes a first line conductor formed on the upper surface of the dielectric substrate 2 for transmitting a high-frequency signal, and 4 denotes a first ground disposed on both sides of the first line conductor 3. Conductor, and the line conductor 3 and the ground conductor 4
The coplanar line 5 of FIG. Reference numeral 6 denotes a second line conductor formed on the lower surface of the dielectric substrate 2 in parallel with the first line conductor 3 so that the front end thereof faces the first line conductor 3, and 7 denotes a second line conductor 6. , And a second coplanar line 8 is formed by the line conductor 6 and the ground conductor 7. In this example,
Two first and second coplanar lines 5 and 8 are formed respectively.
【0017】また、9は誘電体基板2の内部に第1のコ
プレーナ線路5および第2のコプレーナ線路8と対向す
るように形成された内層接地導体、10は第1のコプレ
ーナ線路5の線路導体3の先端と第2のコプレーナ線路
8の線路導体6の先端とを電気的に接続する貫通導体で
あり、貫通導体10は内層接地導体9とは電気的に絶縁
されている。Reference numeral 9 denotes an inner-layer ground conductor formed inside the dielectric substrate 2 so as to face the first coplanar line 5 and the second coplanar line 8, and 10 denotes a line conductor of the first coplanar line 5. 3 is a through conductor that electrically connects the tip of the line conductor 6 of the second coplanar line 8 to the tip of the line conductor 6, and the through conductor 10 is electrically insulated from the inner-layer ground conductor 9.
【0018】このようにして、誘電体基板2の上面に形
成された第1のコプレーナ線路5と、誘電体基板2の下
面に形成された第2のコプレーナ線路8とを、誘電体基
板2の内部に形成された内層接地導体9を挟んで対向配
置するとともに、両コプレーナ線路5・8の線路導体3
・6の先端同士を貫通導体10で電気的に接続し、高周
波用配線基板1の高周波入出力部を構成している。この
ような高周波入出力部では、第2のコプレーナ線路8の
線路導体7は外部電気回路基板との接続用の実装電極も
兼ねるものとなっている。The first coplanar line 5 formed on the upper surface of the dielectric substrate 2 and the second coplanar line 8 formed on the lower surface of the dielectric substrate 2 Opposingly disposed with the inner-layer ground conductor 9 formed therein interposed therebetween, the line conductors 3 of both coplanar lines 5.8 are provided.
The six tips are electrically connected to each other by the through conductor 10 to constitute a high-frequency input / output unit of the high-frequency wiring board 1. In such a high-frequency input / output unit, the line conductor 7 of the second coplanar line 8 also serves as a mounting electrode for connection to an external electric circuit board.
【0019】そして、11は接地貫通導体であり、内層
接地導体9と電気的に接続されるとともに、貫通導体1
0から第1および第2のコプレーナ線路5・8に直交す
る方向の両側で0.2〜5mmの位置において、第1お
よび第2のコプレーナ線路5・8の接地導体4・7同士
を電気的に接続するものである。Reference numeral 11 denotes a ground through conductor which is electrically connected to the inner layer ground conductor 9 and
The ground conductors 4.7 of the first and second coplanar lines 5.8 are electrically connected to each other at a position of 0.2 to 5 mm on both sides in a direction orthogonal to the first and second coplanar lines 5.8 from 0. Is to be connected to.
【0020】なお、この例では、誘電体基板2の上面に
形成された第1の接地導体4および下面に形成された第
2の接地導体7はそれぞれの線路導体3・6の先端を囲
むように延設しており、これにより、より良好な接地状
態を得ることができるものとしている。In this example, the first ground conductor 4 formed on the upper surface of the dielectric substrate 2 and the second ground conductor 7 formed on the lower surface surround the ends of the respective line conductors 3 and 6. , So that a better grounding state can be obtained.
【0021】また、12は誘電体基板2の上面に接合さ
れた枠体であり、Mは誘電体基板2の上面に形成された
半導体素子等の電子部品の搭載部である。このように搭
載部Mおよび枠体12を備えることにより、この高周波
用配線基板1を高周波用電子部品を収容する電子部品収
納用パッケージとして使用することができる。このよう
な高周波用配線基板1は、例えばセラミックグリーンシ
ート積層法等により作製することができ、その場合に
は、誘電体基板2は複数の誘電体層2a・2bを積層し
て形成される。このとき、誘電体層2a・2bを適当な
厚みに設定することにより、内層接地導体9の位置すな
わち内層接地導体9と第1および第2のコプレーナ線路
5・8との距離を高周波入出力部に対する要求仕様に応
じて所望の設定とすることができる。Reference numeral 12 denotes a frame joined to the upper surface of the dielectric substrate 2, and M denotes a mounting portion for electronic components such as semiconductor elements formed on the upper surface of the dielectric substrate 2. By providing the mounting portion M and the frame 12 in this manner, the high-frequency wiring board 1 can be used as an electronic component storage package for storing high-frequency electronic components. Such a high-frequency wiring board 1 can be manufactured by, for example, a ceramic green sheet laminating method or the like. In this case, the dielectric substrate 2 is formed by laminating a plurality of dielectric layers 2a and 2b. At this time, by setting the dielectric layers 2a and 2b to an appropriate thickness, the position of the inner-layer ground conductor 9, that is, the distance between the inner-layer ground conductor 9 and the first and second coplanar lines 5.8 can be changed. The desired setting can be made according to the required specification for.
【0022】特に、内層接地導体9を形成する位置を、
第1のコプレーナ線路5との距離が第2のコプレーナ線
路8との距離よりも小さくなるように設定すると、イン
ピーダンスマッチングができるとともに、第2のコプレ
ーナ線路のパターン幅を広くすることができ、リード端
子の取着強度が増加することとなって好ましいものとな
る。In particular, the position where the inner-layer ground conductor 9 is formed is
When the distance from the first coplanar line 5 is set to be smaller than the distance from the second coplanar line 8, impedance matching can be performed, and the pattern width of the second coplanar line can be increased. This is preferable because the attachment strength of the terminal is increased.
【0023】このような本発明の高周波用配線基板1に
よれば、その高周波入出力部において、第1および第2
のコプレーナ線路5・8の接続部を貫通導体10と内層
接地導体9と接地貫通導体11とにより同軸構造に近い
電気的特性を有するものとすることができ、高周波的な
不整合を少なくして反射損失を低減することができ、ま
た、線路導体3・6と貫通導体10との接続部における
グランドの位相を等しくしてそのずれをなくすことがで
き、高周波信号の反射の発生を抑制して反射損失を抑え
ることができる。According to such a high frequency wiring board 1 of the present invention, the first and second
The connection between the coplanar lines 5 and 8 can be made to have electrical characteristics close to a coaxial structure by the through conductor 10, the inner-layer ground conductor 9, and the ground through conductor 11, thereby reducing high-frequency mismatch. The reflection loss can be reduced, the phase of the ground at the connection between the line conductors 3 and 6 and the through conductor 10 can be made equal to eliminate the shift, and the occurrence of reflection of high-frequency signals can be suppressed. The reflection loss can be suppressed.
【0024】ここで、接地貫通導体11を形成する位置
が貫通導体10から第1および第2のコプレーナ線路5
・8に直交する方向の両側で0.2mmより近い距離の
位置となると、貫通導体10と接地貫通導体11との電
磁結合による容量性成分と、誘導成分(自己誘導成分)
のうち容量性成分が増加する。すると、インピーダンス
整合に適する容量性成分と誘導成分との整合が損なわれ
て、共振点が現れることとなりやすく、また製造も困難
となる傾向がある。他方、接地貫通導体11を形成する
位置が5mmより遠い距離の位置となると、容量性成分
が減少し、相対的に誘導成分が大きくなるため、同様に
共振点が現れることとなる傾向がある。従って、接地貫
通導体11を形成する位置は、第1および第2のコプレ
ーナ線路5・8に直交する方向の両側で0.2〜5mm
の位置とすることが必要である。Here, the position where the ground through conductor 11 is formed is defined by the first and second coplanar lines 5 extending from the through conductor 10.
When the position is closer than 0.2 mm on both sides in the direction orthogonal to 8, a capacitive component due to electromagnetic coupling between the through conductor 10 and the ground through conductor 11 and an inductive component (self-induction component)
Among them, the capacitive component increases. Then, the matching between the capacitive component and the inductive component suitable for impedance matching is impaired, and a resonance point tends to appear, and the manufacturing tends to be difficult. On the other hand, when the position where the ground through conductor 11 is formed is located at a distance farther than 5 mm, the capacitive component decreases and the inductive component relatively increases, so that a resonance point tends to appear. Therefore, the position where the ground through conductor 11 is formed is 0.2 to 5 mm on both sides in the direction orthogonal to the first and second coplanar lines 5.8.
Is required.
【0025】そして、このような本発明の高周波用配線
基板1を外部電気回路基板の上面に搭載するとともに、
第2のコプレーナ線路8の線路導体6を外部電気回路基
板の接続用線路導体に、また接地導体7を外部電気回路
基板の接地導体にそれぞれ半田バンプ等の導電性接続部
材により、あるいは半田材を用いたリフロープロセスに
より電気的に接続することによって、高周波用配線基板
1が外部電気回路基板に実装されることとなる。The high-frequency wiring board 1 of the present invention is mounted on the upper surface of an external electric circuit board.
The line conductor 6 of the second coplanar line 8 is connected to the line conductor for connection of the external electric circuit board, and the ground conductor 7 is connected to the ground conductor of the external electric circuit board by a conductive connecting member such as a solder bump or a solder material. By electrically connecting by the used reflow process, the high-frequency wiring board 1 is mounted on the external electric circuit board.
【0026】次に、本発明の高周波用配線基板の実施の
形態の他の例を図2に図1と同様の図で示す。図2にお
いて、それぞれ(a)は上面図、(b)は(a)のA−
A’線断面図、(c)は(a)のB−B’線断面図、
(d)は下面図であり、いずれも高周波入出力部の近傍
を示している。また、図1と同様の箇所には同じ符号を
付してある。Next, another embodiment of the high-frequency wiring board according to the present invention is shown in FIG. 2 in the same view as FIG. In FIG. 2, (a) is a top view, and (b) is A-
A ′ line sectional view, (c) is a BB ′ line sectional view of (a),
(D) is a bottom view, all showing the vicinity of the high frequency input / output unit. The same parts as those in FIG. 1 are denoted by the same reference numerals.
【0027】これらの図において、1は高周波用配線基
板、2は複数の誘電体層2a・2bを積層して形成され
た誘電体基板、3は誘電体基板2の上面に形成された第
1の線路導体、4は第1の線路導体3の両側に配設され
た第1の接地導体、5はこれら線路導体3と接地導体4
とで構成された第1のコプレーナ線路である。6は誘電
体基板2の下面にその先端が第1の線路導体3と対向す
るようにして第1の線路導体3と平行に形成された第2
の線路導体、7は第2の線路導体6の両側に配設された
第2の接地導体、8はこれら線路導体6と接地導体7と
で構成された第2のコプレーナ線路である。この例でも
図1の例と同様に、第1および第2のコプレーナ線路5
・8をそれぞれ2本ずつ形成している。In these figures, 1 is a high-frequency wiring board, 2 is a dielectric board formed by laminating a plurality of dielectric layers 2a and 2b, and 3 is a first dielectric board formed on the upper surface of the dielectric board 2. Are the first ground conductors disposed on both sides of the first line conductor 3, and 5 are the first line conductors 3 and the ground conductors 4.
And a first coplanar line composed of: Reference numeral 6 denotes a second substrate formed on the lower surface of the dielectric substrate 2 in parallel with the first line conductor 3 so that the front end thereof faces the first line conductor 3.
Is a second ground conductor disposed on both sides of the second line conductor 6, and 8 is a second coplanar line constituted by the line conductor 6 and the ground conductor 7. In this example, as in the example of FIG.
8 are formed two each.
【0028】9は誘電体基板2の内部に第1および第2
のコプレーナ線路5・8と対向するように形成された内
層接地導体、10は第1のコプレーナ線路5の線路導体
3の先端と第2のコプレーナ線路8の線路導体6の先端
とを電気的に接続する貫通導体である。また、11は接
地貫通導体であり、内層接地導体9と電気的に接続され
るとともに、貫通導体10から第1および第2のコプレ
ーナ線路5・8に直交する方向の両側で0.2〜5mm
の位置において、第1および第2のコプレーナ線路5・
8の接地導体4・7同士を電気的に接続している。Reference numeral 9 denotes a first and a second inside the dielectric substrate 2.
The inner-layer ground conductor 10 formed so as to face the coplanar lines 5 and 8 electrically connects the tip of the line conductor 3 of the first coplanar line 5 and the tip of the line conductor 6 of the second coplanar line 8. It is a through conductor to be connected. Reference numeral 11 denotes a ground through conductor, which is electrically connected to the inner-layer ground conductor 9, and is 0.2 to 5 mm on both sides in a direction orthogonal to the first and second coplanar lines 5.8 from the through conductor 10.
, The first and second coplanar lines 5.
8 ground conductors 4 and 7 are electrically connected to each other.
【0029】12は誘電体基板2の上面に接合された枠
体であり、Mは誘電体基板2の上面に形成された半導体
素子等の電子部品の搭載部である。Reference numeral 12 denotes a frame joined to the upper surface of the dielectric substrate 2, and M denotes a mounting portion for electronic components such as semiconductor elements formed on the upper surface of the dielectric substrate 2.
【0030】そして、13は補助接地貫通導体であり、
誘電体基板2の上面に形成された第1の接地導体4およ
び下面に形成された第2の接地導体7をそれぞれの線路
導体3・6の先端を囲むように延設して、より良好な接
地状態を得ることができるものとし、かつ第1のコプレ
ーナ線路5の線路導体3および第2のコプレーナ線路8
の線路導体6のそれぞれの先端の伝送方向の延長方向で
貫通導体10から0.2〜5mmの位置において、内層
接地導体9と延設した接地導体4・7とをそれぞれこれ
ら補助接地貫通導体13で電気的に接続している。Reference numeral 13 denotes an auxiliary ground through conductor,
The first ground conductor 4 formed on the upper surface of the dielectric substrate 2 and the second ground conductor 7 formed on the lower surface are extended so as to surround the ends of the respective line conductors 3 and 6 so as to improve the performance. A ground state can be obtained, and the line conductor 3 of the first coplanar line 5 and the second coplanar line 8
The inner-layer ground conductor 9 and the extended ground conductors 4 and 7 are respectively connected to the auxiliary ground through conductor 13 at a position of 0.2 to 5 mm from the through conductor 10 in the extension direction of the transmission direction at the end of each of the line conductors 6. Is electrically connected.
【0031】このような本発明の高周波用配線基板1に
よれば、その高周波入出力部において、図1の例と同様
に第1および第2のコプレーナ線路5・8の接続部を貫
通導体10と内層接地導体9と接地貫通導体11とによ
り同軸構造に近い電気的特性を有するものとすることが
でき、高周波的な不整合を少なくして反射損失を低減す
ることができ、また、線路導体3・6と貫通導体10と
の接続部におけるグランドの位相を等しくしてそのずれ
をなくすことができ、高周波信号の反射の発生を抑制し
て反射損失を抑えることができる。そして、補助接地貫
通導体13を所定の位置に設けたことにより、前述のよ
うに線路導体の先端から伝送方向の延長方向に向かう誘
電体基板内への高周波信号の電磁界の漏れを効果的に抑
制することができ、高周波入出力部における高周波信号
の反射損失をさらに抑制することができるものとなる。According to such a high-frequency wiring board 1 of the present invention, in the high-frequency input / output section, the connection between the first and second coplanar lines 5.8 is connected to the through conductor 10 as in the example of FIG. And the inner-layer ground conductor 9 and the ground through conductor 11 can have electrical characteristics close to a coaxial structure, can reduce high-frequency mismatch and reduce reflection loss, and It is possible to equalize the phases of the grounds at the connection portions of the through conductors 3 and 6 to eliminate the shift, to suppress the occurrence of reflection of the high-frequency signal, and to suppress the reflection loss. By providing the auxiliary ground through conductor 13 at a predetermined position, the leakage of the electromagnetic field of the high-frequency signal from the tip of the line conductor into the dielectric substrate extending in the transmission direction can be effectively prevented as described above. Thus, the reflection loss of the high-frequency signal in the high-frequency input / output unit can be further suppressed.
【0032】ここで、補助接地貫通導体13を形成する
位置が各線路導体3・6の延長方向で貫通導体10から
0.2mmより近い距離の位置となると、貫通導体10
と補助接地貫通導体13との電磁結合による容量性成分
と、誘導成分(自己誘導成分)のうち容量性成分が増加
する。すると、インピーダンス整合に適する容量性成分
と誘導成分の整合が損なわれて共振点が現れる傾向があ
る。他方、接地貫通導体13を形成する位置が5mmよ
り遠い距離の位置となると、容量性成分が減少し、相対
的に誘導性成分が大きくなるため、同様に共振点が現れ
ることとなる傾向がある。従って、補助接地貫通導体1
3を形成する位置は、第1のコプレーナ線路5の線路導
体3および第2のコプレーナ線路8の線路導体6のそれ
ぞれの先端の伝送方向の延長方向で貫通導体10から
0.2〜5mmの位置とすることが必要である。Here, when the position where the auxiliary ground through conductor 13 is formed is located at a distance closer than 0.2 mm from the through conductor 10 in the extension direction of each line conductor 3, 6, the through conductor 10
The capacitive component due to the electromagnetic coupling between the conductor and the auxiliary ground through conductor 13 and the capacitive component among the inductive components (self-induced components) increase. Then, the matching between the capacitive component and the inductive component suitable for impedance matching tends to be impaired, and a resonance point tends to appear. On the other hand, when the position where the ground through conductor 13 is formed is located at a distance farther than 5 mm, the capacitive component decreases and the inductive component relatively increases, so that a resonance point tends to appear similarly. . Therefore, the auxiliary ground through conductor 1
3 is formed at a position 0.2 to 5 mm from the penetrating conductor 10 in the extension direction of the transmission direction of each end of the line conductor 3 of the first coplanar line 5 and the line conductor 6 of the second coplanar line 8. It is necessary to
【0033】また、第1のコプレーナ線路5の接地導体
4および第2のコプレーナ線路8の接地導体7をそれぞ
れ線路導体3・6の先端を囲むように延設する場合、第
1のコプレーナ線路5から貫通導体10を介して第2の
コプレーナ線路8へ、あるいはその逆へ信号を伝達する
ときのロスを極小にするように容量成分を調整し、接地
導体4・7を形成する。また、このとき、抵抗・インダ
クタ・容量が、信号線路全体でマッチングした位置に形
成することが好ましい。When the ground conductor 4 of the first coplanar line 5 and the ground conductor 7 of the second coplanar line 8 are extended so as to surround the ends of the line conductors 3 and 6, respectively, the first coplanar line 5 Then, the capacitance components are adjusted so as to minimize the loss when transmitting signals to the second coplanar line 8 via the through conductor 10 and vice versa, and the ground conductors 4 and 7 are formed. At this time, it is preferable that the resistance, the inductor, and the capacitance are formed at matching positions in the entire signal line.
【0034】そして、このような本発明の高周波用配線
基板1についても、これを外部電気回路基板の上面に搭
載するとともに、第2のコプレーナ線路8の線路導体7
を外部電気回路基板の接続用線路導体に、また接地導体
7を外部電気回路基板の接地導体にそれぞれ半田バンプ
等の導電性接続部材により、あるいは半田材を用いたリ
フロープロセスにより電気的に接続することによって、
高周波用配線基板1が外部電気回路基板に実装されるこ
ととなる。The high-frequency wiring board 1 of the present invention is also mounted on the upper surface of the external electric circuit board and the line conductor 7 of the second coplanar line 8 is mounted.
Is electrically connected to the connection line conductor of the external electric circuit board, and the ground conductor 7 is electrically connected to the ground conductor of the external electric circuit board by a conductive connection member such as a solder bump or a reflow process using a solder material. By
The high-frequency wiring board 1 is mounted on the external electric circuit board.
【0035】さらに、本発明の他の実施形態を図3に図
1と同様の図で示す。図3において、それぞれ(a)は
上面図、(b)は(a)のA−A’線断面図、(c)は
(a)のB−B’線断面図、(d)は下面図であり、い
ずれも高周波入出力部の近傍を示している。また、図1
と同様の箇所には同じ符号を付してあり、それらの詳細
な説明は省略する。Further, another embodiment of the present invention is shown in FIG. 3 in a view similar to FIG. 3, (a) is a top view, (b) is a sectional view taken along line AA 'of (a), (c) is a sectional view taken along line BB' of (a), and (d) is a bottom view, respectively. Each of them shows the vicinity of the high frequency input / output unit. FIG.
The same reference numerals are given to the same portions as and the detailed description thereof will be omitted.
【0036】図3の実施形態では、内層接地導体9が2
層から成り、従って内層接地導体9a,9bを有し、ま
た誘電体基板2は3層の誘電体層2a,2b,2cから
成る。これらの内層接地導体9aと内層接地導体9bと
は、中間の接地貫通導体14により接続されている。こ
のような構成により、貫通導体10の周囲の接地電位の
壁を強固に形成することができ、同軸構造に近い疑似同
軸構造とすることで、高周波信号の伝送特性を向上させ
て、伝送損失を小さくできる。In the embodiment shown in FIG.
The dielectric substrate 2 comprises three dielectric layers 2a, 2b, 2c, and thus has inner-layer ground conductors 9a, 9b. The inner-layer ground conductor 9a and the inner-layer ground conductor 9b are connected by an intermediate ground through conductor 14. With such a configuration, the wall of the ground potential around the through conductor 10 can be firmly formed, and by adopting a pseudo-coaxial structure close to a coaxial structure, transmission characteristics of a high-frequency signal are improved, and transmission loss is reduced. Can be smaller.
【0037】この構成において、内層接地導体9aを形
成する位置を、第1のコプレーナ線路5との距離が、内
層接地導体9bと第2のコプレーナ線路8との距離より
も小さくなるように設定すると、インピーダンスマッチ
ングが行い易くなるとともに、第2のコプレーナ線路8
のパターン幅を広くすることができ、リード端子の取着
強度が増大することとなり好ましい。In this configuration, the position where the inner-layer ground conductor 9a is formed is set so that the distance between the first coplanar line 5 and the inner coplanar line 5 is smaller than the distance between the inner-layer ground conductor 9b and the second coplanar line 8. , Impedance matching becomes easier, and the second coplanar line 8
Is preferable because the pattern width can be increased, and the attachment strength of the lead terminal increases.
【0038】上記中間の接地貫通導体14の長さは50
μm〜0.5mmとするのが良く、50μm未満では短
すぎて製造が困難となり、0.5mmを超えると内層接
地導体9a,9b間の距離が遠くなるため、接地電位が
不安定になり易い。The length of the intermediate ground through conductor 14 is 50.
It is preferable that the thickness be set to μm to 0.5 mm. If it is less than 50 μm, it is too short to make it difficult to manufacture, and if it exceeds 0.5 mm, the distance between the inner-layer ground conductors 9a and 9b becomes long, so that the ground potential tends to be unstable. .
【0039】また、第1の接地導体4と上層側のの内層
接地導体9aとを接続する接地貫通導体11の長さは5
0μm〜0.5mmとするのが良く、50μm未満で
は、線路導体3に内層接地導体9aが近接することによ
りそれらの間で容量成分が発生し、インピーダンス整合
のためには高周波用配線基板1の配線パターン幅を細く
することとなる。そうすると、搭載する半導体チップと
高周波用配線基板1との接続部で信号の反射特性の劣化
が大きくなる。0.5mmを超えると、高周波用配線基
板1の配線パターン幅が広くなり易く、そのため高周波
用配線基板1が大型化し、小型化を阻害することにな
る。The length of the ground through conductor 11 connecting the first ground conductor 4 to the upper inner layer ground conductor 9a is 5
If the thickness is less than 50 μm, a capacitance component is generated between the line conductor 3 and the inner-layer ground conductor 9 a due to the proximity thereof, and the impedance of the high-frequency wiring board 1 is reduced for impedance matching. The width of the wiring pattern is reduced. Then, the deterioration of the signal reflection characteristic at the connection between the mounted semiconductor chip and the high-frequency wiring board 1 is increased. If it exceeds 0.5 mm, the wiring pattern width of the high-frequency wiring board 1 tends to be widened, so that the high-frequency wiring board 1 becomes large and hinders miniaturization.
【0040】第2の接地導体7と下層側の内層接地導体
9bとを接続する接地貫通導体11の長さは50μm〜
0.5mmとするのが良く、50μm未満では、上記と
同様に高周波用配線基板1の配線パターン幅が細くなり
易く、そのため外部接続用のリード端子の接合部の強度
が弱くなる、若しくはリード端子の接合が困難になる。
一方、0.5mmを超えると、高周波用配線基板1の配
線パターン幅が広くなり易く、そのため高周波用配線基
板1が大型化する。The length of the ground through conductor 11 for connecting the second ground conductor 7 and the lower inner ground conductor 9b is 50 μm or more.
When the thickness is less than 50 μm, the width of the wiring pattern of the high-frequency wiring board 1 is apt to be reduced similarly to the above, so that the strength of the joint portion of the lead terminal for external connection is reduced, or Bonding becomes difficult.
On the other hand, if it exceeds 0.5 mm, the wiring pattern width of the high-frequency wiring board 1 tends to be widened, and therefore the high-frequency wiring board 1 becomes large.
【0041】また、図4は本発明の他の実施形態を示す
ものであり、図3の構成において、図2に示した補助接
地貫通導体13を設けたものである。図4において、そ
れぞれ(a)は上面図、(b)は(a)のA−A’線断
面図、(c)は(a)のB−B’線断面図、(d)は下
面図であり、いずれも高周波入出力部の近傍を示してい
る。また、図3と同様の箇所には同じ符号を付してあ
り、それらの詳細な説明は省略する。この構成により、
同軸構造に近い疑似同軸構造とすることで、高周波信号
の伝送特性を向上させ得るともに、線路導体の先端から
伝送方向の延長方向に向かう誘電体基板内への高周波信
号の電磁界の漏れを効果的に抑制することができ、高周
波入出力部における高周波信号の反射損失を抑制するこ
とができる。この補助接地貫通導体13の長さは、図3
の接地貫通導体11の場合と同様の理由で同様の範囲が
良い。FIG. 4 shows another embodiment of the present invention, in which the auxiliary ground through conductor 13 shown in FIG. 2 is provided in the configuration of FIG. 4, (a) is a top view, (b) is a sectional view taken along line AA 'of (a), (c) is a sectional view taken along line BB' of (a), and (d) is a bottom view, respectively. Each of them shows the vicinity of the high frequency input / output unit. In addition, the same portions as those in FIG. 3 are denoted by the same reference numerals, and detailed description thereof will be omitted. With this configuration,
By adopting a pseudo-coaxial structure close to the coaxial structure, it is possible to improve the transmission characteristics of high-frequency signals and also to prevent the leakage of the electromagnetic field of high-frequency signals from the tip of the line conductor into the dielectric substrate extending in the transmission direction. And the reflection loss of the high-frequency signal in the high-frequency input / output unit can be suppressed. The length of the auxiliary ground through conductor 13 is shown in FIG.
The same range is preferable for the same reason as in the case of the ground through conductor 11 described above.
【0042】また、本発明でいう高周波帯域とは1〜1
00GHz程度の高周波帯域及びミリ波帯域であり、従
って本発明の高周波用配線基板1は1〜100GHz程
度の高周波帯域及びミリ波帯域で使用されるものである
が、1〜80GHz程度の比較的周波数の低い帯域で使
用するのが好ましい。それは、80GHzを超える高周
波帯域では高周波信号が外部磁場の影響を受け易くな
り、ノイズおよび損失の増大をもたらすからである。よ
り好ましくは、1〜40GHz程度で使用するのが良
い。The high-frequency band referred to in the present invention is 1 to 1
The high frequency wiring board 1 of the present invention is used in a high frequency band of about 1 to 100 GHz and a millimeter wave band, but has a relatively high frequency band of about 1 to 80 GHz. It is preferably used in a low band. This is because in a high-frequency band exceeding 80 GHz, a high-frequency signal is easily affected by an external magnetic field, resulting in an increase in noise and loss. More preferably, it is good to use at about 1 to 40 GHz.
【0043】なお、本発明は以上の実施の形態の例に限
定されるものではなく、本発明の要旨を逸脱しない範囲
で種々の変更・改良を施すことは何ら差し支えない。例
えば、上記の実施の形態の例ではそれぞれ第1および第
2のコプレーナ線路として線路導体を2本ずつ設けた場
合について示したが、線路導体を1本設けた場合やさら
に複数本配設した多ポートの場合であってもよい。内層
接地導体9a,9bについては、上記実施形態では2層
設けたものについて示したが、3層以上あってもよい。It should be noted that the present invention is not limited to the above-described embodiments, and that various changes and improvements can be made without departing from the scope of the present invention. For example, in the example of the above-described embodiment, the case where two line conductors are provided as the first and second coplanar lines, respectively, is shown. However, a case where one line conductor is provided or a plurality of line conductors are provided. It may be the case of a port. As the inner-layer ground conductors 9a and 9b, two layers are shown in the above embodiment, but three or more layers may be provided.
【0044】また、接地貫通導体の近傍に高周波信号の
波長の1/4以下程度の繰り返し間隔の位置となるよう
にして、さらに複数の接地貫通導体を配設してもよい。
さらにまた、補助接地貫通導体の近傍に高周波信号の波
長の1/4以下程度の繰り返し間隔の位置となるように
して、さらに複数の補助接地貫通導体を配設してもよ
い。Further, a plurality of ground through conductors may be provided near the ground through conductor at a repetition interval of about 以下 or less of the wavelength of the high frequency signal.
Still further, a plurality of auxiliary ground through conductors may be provided near the auxiliary ground through conductor at a repetition interval of about 以下 or less of the wavelength of the high-frequency signal.
【0045】また、コプレーナ線路の線路導体にリード
端子やボール等の接続用金属部材を取り付けた構造とし
てもよい。Further, a structure in which a connecting metal member such as a lead terminal or a ball is attached to the line conductor of the coplanar line may be adopted.
【0046】[0046]
【発明の効果】本発明の高周波用配線基板によれば、誘
電体基板内に形成した内層接地導体を挟んで第1および
第2のコプレーナ線路を対向配置し、両コプレーナ線路
の線路導体の先端同士を電気的に接続した貫通導体から
上記所定の位置において内層接地導体と電気的に接続さ
れた接地貫通導体を介して両コプレーナ線路の接地導体
同士を電気的に接続して成る高周波入出力部を具備する
ものとしたことから、接続部を貫通導体と内層接地導体
と接地貫通導体とにより同軸構造に近い電気的特性を有
するものとすることができ、高周波的な不整合を少なく
して反射損失を低減することができる。また、コプレー
ナ線路間に内層接地導体を形成し、この内層接地導体と
両方のコプレーナ線路の接地導体とを接地貫通導体で電
気的に接続したことから、線路導体と貫通導体との接続
部におけるグランドの位相を等しくしてそのずれをなく
すことができ、高周波信号の反射の発生を抑制して反射
損失を抑えることができる。According to the high-frequency wiring board of the present invention, the first and second coplanar lines are opposed to each other with the inner-layer ground conductor formed in the dielectric substrate interposed therebetween. A high-frequency input / output section formed by electrically connecting the ground conductors of both coplanar lines via a ground through conductor electrically connected to the inner-layer ground conductor at the predetermined position from a through conductor electrically connected to each other; The connection portion can have electrical characteristics close to a coaxial structure by the through conductor, the inner-layer ground conductor, and the ground through conductor, thereby reducing high-frequency mismatch and reflecting light. Loss can be reduced. Also, since an inner-layer ground conductor is formed between the coplanar lines, and the inner-layer ground conductor and the ground conductors of both coplanar lines are electrically connected by the ground through conductor, the ground at the connection between the line conductor and the through conductor is formed. Can be made equal to eliminate the shift, and the occurrence of reflection of the high-frequency signal can be suppressed to suppress the reflection loss.
【0047】また、本発明の高周波用配線基板によれ
ば、線路導体の先端の伝送方向の延長方向に接地導体を
延設するとともに、その方向の所定位置で延設した接地
導体と内層接地導体とを補助接地貫通導体で電気的に接
続したことから、線路導体の先端から伝送方向の延長方
向に向かう誘電体基板内への高周波信号の電磁界の漏れ
を効果的に抑制することができ、高周波入出力部におけ
る高周波信号の反射損失をさらに抑制することができ
る。According to the high-frequency wiring board of the present invention, the ground conductor extends in the direction of extension of the transmission direction at the end of the line conductor, and the ground conductor and the inner-layer ground conductor extending at predetermined positions in that direction. Is electrically connected to the auxiliary ground through conductor, the leakage of the electromagnetic field of the high-frequency signal from the tip of the line conductor into the dielectric substrate extending in the transmission direction can be effectively suppressed, The reflection loss of the high-frequency signal in the high-frequency input / output unit can be further suppressed.
【0048】以上のように、本発明によれば、コプレー
ナ線路と貫通導体との接続部におけるグランドの位相の
ずれをなくし、高周波信号の反射損失を抑えることがで
きる高周波入出力部を具備する高周波用配線基板を提供
することができた。As described above, according to the present invention, the high-frequency input / output unit having the high-frequency input / output unit capable of eliminating the phase shift of the ground at the connection between the coplanar line and the through conductor and suppressing the reflection loss of the high-frequency signal. The wiring board for use was able to be provided.
【図1】(a)は本発明の高周波用配線基板の実施の形
態の一例を示す上面図、(b)は(a)のA−A’線断
面図、(c)は(a)のB−B’線断面図、(d)は下
面図である。1A is a top view showing an example of an embodiment of a high-frequency wiring board according to the present invention, FIG. 1B is a cross-sectional view taken along line AA ′ of FIG. 1A, and FIG. FIG. 3D is a sectional view taken along the line BB ′, and FIG.
【図2】(a)は本発明の高周波用配線基板の実施の形
態の他の例を示す上面図、(b)は(a)のA−A’線
断面図、(c)は(a)のB−B’線断面図、(d)は
下面図である。2A is a top view showing another example of the high-frequency wiring board according to the embodiment of the present invention, FIG. 2B is a cross-sectional view taken along the line AA ′ of FIG. 2A, and FIG. ) Is a sectional view taken along line BB ′, and (d) is a bottom view.
【図3】(a)は本発明の高周波用配線基板の実施の形
態の他の例を示す上面図、(b)は(a)のA−A’線
断面図、(c)は(a)のB−B’線断面図、(d)は
下面図である。3A is a top view showing another embodiment of the high-frequency wiring board according to the present invention, FIG. 3B is a cross-sectional view taken along the line AA ′ of FIG. 3A, and FIG. ) Is a sectional view taken along line BB ′, and (d) is a bottom view.
【図4】(a)は本発明の高周波用配線基板の実施の形
態の他の例を示す上面図、(b)は(a)のA−A’線
断面図、(c)は(a)のB−B’線断面図、(d)は
下面図である。4A is a top view showing another example of the high-frequency wiring board according to the embodiment of the present invention, FIG. 4B is a cross-sectional view taken along line AA ′ of FIG. 4A, and FIG. ) Is a sectional view taken along line BB ′, and (d) is a bottom view.
1・・・高周波用配線基板 2・・・誘電体基板 3、6・・・線路導体 4、7・・・接地導体 5・・・第1のコプレーナ線路 8・・・第2のコプレーナ線路 9、9a、9b・・・内層接地導体 10・・・貫通導体 11・・・接地貫通導体 13・・・補助接地貫通導体 14・・・中間の接地貫通導体 REFERENCE SIGNS LIST 1 high-frequency wiring board 2 dielectric substrate 3 6 line conductor 4 7 ground conductor 5 first coplanar line 8 second coplanar line 9 , 9a, 9b ... inner layer ground conductor 10 ... through conductor 11 ... ground through conductor 13 ... auxiliary ground through conductor 14 ... middle ground through conductor
Claims (2)
号を伝送するための第1のコプレーナ線路と、前記誘電
体基板の下面に前記第1のコプレーナ線路と平行に形成
された第2のコプレーナ線路とを、前記誘電体基板の内
部に形成された内層接地導体を挟んで対向配置するとと
もに、両コプレーナ線路の線路導体の先端同士を前記内
層接地導体と絶縁された貫通導体で電気的に接続し、か
つ該貫通導体から前記両コプレーナ線路に直交する方向
の両側で0.2〜5mmの位置において、両コプレーナ
線路の接地導体同士を前記内層接地導体と電気的に接続
された接地貫通導体で電気的に接続して成る高周波入出
力部を具備することを特徴とする高周波用配線基板。1. A first coplanar line formed on an upper surface of a dielectric substrate for transmitting a high-frequency signal, and a second coplanar line formed on a lower surface of the dielectric substrate in parallel with the first coplanar line. The coplanar line is disposed facing the inner layer ground conductor formed inside the dielectric substrate, and the ends of the line conductors of both coplanar lines are electrically connected to each other by a through conductor insulated from the inner layer ground conductor. A ground through conductor which electrically connects the ground conductors of both coplanar lines to the inner layer ground conductor at a position of 0.2 to 5 mm on both sides in a direction orthogonal to the both coplanar lines from the through conductor. A high-frequency wiring board, comprising: a high-frequency input / output unit electrically connected to the wiring board.
前記接地導体をそれぞれの前記線路導体の先端を囲むよ
うに延設し、かつ該線路導体の先端の前記伝送方向の延
長方向で前記貫通導体から0.2〜5mmの位置におい
て、前記内層接地導体と前記延設した接地導体とをそれ
ぞれ補助接地貫通導体で電気的に接続したことを特徴と
する請求項1記載の高周波用配線基板。2. The ground conductor of each of the first and second coplanar lines extends so as to surround an end of each of the line conductors, and the penetrating ends of the line conductors extend in an extension direction of the transmission direction. 2. The high-frequency wiring board according to claim 1, wherein the inner-layer ground conductor and the extended ground conductor are electrically connected to each other by an auxiliary ground through conductor at a position of 0.2 to 5 mm from the conductor.
Priority Applications (1)
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JP33681599A JP3833426B2 (en) | 1999-10-07 | 1999-11-26 | High frequency wiring board |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11-286843 | 1999-10-07 | ||
JP28684399 | 1999-10-07 | ||
JP33681599A JP3833426B2 (en) | 1999-10-07 | 1999-11-26 | High frequency wiring board |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2001177012A true JP2001177012A (en) | 2001-06-29 |
JP3833426B2 JP3833426B2 (en) | 2006-10-11 |
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JP33681599A Expired - Fee Related JP3833426B2 (en) | 1999-10-07 | 1999-11-26 | High frequency wiring board |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2003069671A3 (en) * | 2002-02-14 | 2004-03-25 | Ma Com Inc | Rf transition for an area array package |
JP2005158966A (en) * | 2003-11-25 | 2005-06-16 | Kyocera Corp | Wiring board |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07221512A (en) * | 1994-02-04 | 1995-08-18 | Sony Corp | High frequency connection line |
JP2605502B2 (en) * | 1991-05-14 | 1997-04-30 | 三菱電機株式会社 | package |
JPH10173410A (en) * | 1996-12-12 | 1998-06-26 | Sharp Corp | Transmission circuit using strip line |
-
1999
- 1999-11-26 JP JP33681599A patent/JP3833426B2/en not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2605502B2 (en) * | 1991-05-14 | 1997-04-30 | 三菱電機株式会社 | package |
JPH07221512A (en) * | 1994-02-04 | 1995-08-18 | Sony Corp | High frequency connection line |
JPH10173410A (en) * | 1996-12-12 | 1998-06-26 | Sharp Corp | Transmission circuit using strip line |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2003069671A3 (en) * | 2002-02-14 | 2004-03-25 | Ma Com Inc | Rf transition for an area array package |
JP2005158966A (en) * | 2003-11-25 | 2005-06-16 | Kyocera Corp | Wiring board |
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JP3833426B2 (en) | 2006-10-11 |
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