JP2003243792A - Connection structure of printed board - Google Patents

Connection structure of printed board

Info

Publication number
JP2003243792A
JP2003243792A JP2002041530A JP2002041530A JP2003243792A JP 2003243792 A JP2003243792 A JP 2003243792A JP 2002041530 A JP2002041530 A JP 2002041530A JP 2002041530 A JP2002041530 A JP 2002041530A JP 2003243792 A JP2003243792 A JP 2003243792A
Authority
JP
Japan
Prior art keywords
printed circuit
circuit board
wiring pattern
insertion openings
insertion holes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002041530A
Other languages
Japanese (ja)
Inventor
Kinwai Ryu
欽▲わい▼ 劉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2002041530A priority Critical patent/JP2003243792A/en
Publication of JP2003243792A publication Critical patent/JP2003243792A/en
Pending legal-status Critical Current

Links

Abstract

<P>PROBLEM TO BE SOLVED: To provide a connection structure for a printed board, in which the number of connection terminals are increased by dividing a connection part into a plurality of sub-parts without deteriorating the soldering reliability of the connection part of the printed boards. <P>SOLUTION: The structure comprises; a first printed board provided with a plurality of insertion holes and a plurality of first wiring patterns around the insertion holes; and a second printed board provided with a plurality of joints with second wiring patterns that are inserted into the insertion holes and connected to the first wiring patterns. A signal wiring pattern is formed around one of the insertion holes, a high-current wiring pattern is formed around one of the other insertion holes, and some patterns out of the first or the second wiring patterns are formed between the insertion holes. <P>COPYRIGHT: (C)2003,JPO

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】本発明は、プリント基板同士
を互いに直交させたかたちで接続するためのプリント基
板の接続構造に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board connection structure for connecting printed circuit boards to each other in a mutually orthogonal manner.

【0002】[0002]

【従来の技術】カメラに配置されるプリント基板は、カ
メラ本体と外装部材となるカバー若しくは各構造体との
隙間に配置されることが多い。特に、カメラの動作を制
御するためのシーケンスコントローラなどを搭載したプ
リント基板は、配置場所が必要となる。
2. Description of the Related Art A printed circuit board arranged in a camera is often arranged in a gap between a camera body and a cover or each structure serving as an exterior member. In particular, a printed circuit board on which a sequence controller for controlling the operation of the camera is mounted needs an arrangement place.

【0003】たとえばコンパクトカメラにあっては、携
帯や取り扱いをよくするためにカメラ全体の小型化を図
ることが要望されている。このため、このようなカメラ
では、カメラ内部への組込みプリント基板を、可能な限
り効率のよいレイアウト構成で、コンパクトに組込むこ
とが望まれている。
For example, in a compact camera, it is desired to reduce the size of the entire camera in order to facilitate portability and handling. For this reason, in such a camera, it is desired that a built-in printed circuit board inside the camera be compactly assembled with a layout configuration that is as efficient as possible.

【0004】また、近年ではカメラの機能が高度化して
おり、搭載される電気回路も複雑化しているために、プ
リント基板も複数に分けて組み込む場合が多くなってい
る。
Further, in recent years, the functions of cameras have become more sophisticated and the electric circuits to be mounted have become more complicated, so that the printed circuit board is often installed in a plurality of parts.

【0005】プリント基板同士を接続する方法として
は、例えば実公昭51−46622号公報に記載されて
いるものがある。この方法では、図4に示すように、少
なくとも1辺に位置決め用および片落ち防止用切除部
と、これら切除部に連接した大きさが異なる複数の脚片
とを有する小型プリント基板を用意し、これら各脚片に
対応して設けた取着孔を有するメインプリント基板に小
型プリント基板の係止斜面部を有する各脚片を圧入し
て、小型プリント基板をメインプリント基板に半田付け
前においても喰い付き固定するようにした。
As a method of connecting printed boards to each other, for example, there is a method described in Japanese Utility Model Publication No. 51-46622. In this method, as shown in FIG. 4, a small printed board having at least one side cutting portion for positioning and one-sided drop prevention and a plurality of leg pieces connected to these cutting portions and having different sizes is prepared. Even before soldering the small printed circuit board to the main printed circuit board by press-fitting each leg having the locking slope portion of the small printed circuit board into the main printed circuit board having the mounting holes provided corresponding to each of the leg printed circuit boards. I tried to fix it by eating.

【0006】[0006]

【発明が解決しようとする課題】しかしながら、カメラ
の機能高度化と電気回路の複雑化により、上記従来にお
いての小型プリント基板では、実装可能な面積が少な
く、構成部品の実装レイアウト自由度も低下し、すべて
の構成部品を実装するため、より数多くの小型プリント
基板が必要となり、プリント基板の効率の良いレイアウ
ト構成は困難であり、カメラの大型化とコストアップを
招くことになってしまう欠点があった。
However, due to the sophistication of the function of the camera and the complication of the electric circuit, the conventional small printed circuit board described above has a small mountable area, and the degree of freedom in the mounting layout of the components is also reduced. However, since all the components are mounted, a large number of small printed circuit boards are required, and it is difficult to make an efficient layout configuration of the printed circuit boards, which leads to an increase in the size and cost of the camera. It was

【0007】本出願に係る発明の目的は、カメラに配置
されているプリント基板同士の接続構造を向上、かつ、
カメラとプリント基板の大型化を防ぐことが可能である
ことを提供する。
An object of the invention according to the present application is to improve a connection structure between printed circuit boards arranged in a camera, and
It is possible to prevent the camera and the printed circuit board from increasing in size.

【0008】[0008]

【課題を解決するための手段】上記課題を解決するため
に、本発明における請求項1記載の発明は、複数の挿入
口と前記挿入口の周囲に複数の第1の配線パターンを有
する第1のプリント基板と、前記挿入口に挿入され前記
第1の配線パターンと半田接続可能な第2の配線パター
ンをもつ複数の接合部を有する第2のプリント基板とを
有し、複数の前記挿入口の中の少なくとも1つの挿入口
の周囲には信号用配線パターンを形成し、他の前記挿入
口の少なくとも1つには高電流用配線パターンを形成
し、前記複数の挿入口同士の間には前記第1あるいは第
2の配線パターンの一部のパターンを形成したこと。
In order to solve the above-mentioned problems, the invention according to claim 1 of the present invention has a plurality of insertion openings and a plurality of first wiring patterns around the insertion openings. A printed circuit board and a second printed circuit board having a plurality of joints having a second wiring pattern that is inserted into the insertion port and that can be soldered to the first wiring pattern. A wiring pattern for signals is formed around at least one of the insertion openings, a wiring pattern for high current is formed at at least one of the other insertion openings, and between the plurality of insertion openings. Forming a part of the first or second wiring pattern.

【0009】上記課題を解決するために、本発明におけ
る請求項2記載の発明は、挿入口と前記挿入口に挿入さ
れる接続部同士の長さは略一長さであること。
In order to solve the above-mentioned problems, in the invention according to claim 2 of the present invention, the length of the insertion opening and the connecting portions inserted into the insertion opening is approximately one.

【0010】よって、本発明によれば、プリント基板に
設けた複数の挿入口同士の間を利用して配線パターンの
引き回しを行い、プリント基板同士間の接続端子数と配
線は増やすことができ、プリント基板のレイアウトの効
率向上が可能である。
Therefore, according to the present invention, the wiring pattern can be laid out by utilizing between the plurality of insertion openings provided on the printed circuit board, and the number of connection terminals and wiring between the printed circuit boards can be increased. It is possible to improve the efficiency of the layout of the printed circuit board.

【0011】また、本発明によれば、プリント基板に設
けられた複数の挿入口の長さは略同一長さであることに
より、プリント基板全体のバランスと強度には損なわ
ず、実装時プリント基板の反りと外形変形を防ぐことが
可能となる。
Further, according to the present invention, since the plurality of insertion openings provided on the printed circuit board have substantially the same length, the balance and strength of the entire printed circuit board are not impaired, and the printed circuit board at the time of mounting is mounted. It is possible to prevent the warp and the outer shape deformation.

【0012】[0012]

【発明の実施の形態】(実施形態)図1から図3は、本
発明の実施形態であるプリント基板の接続構造を示して
いる。同図において、9は第1のプリント基板で、13
は第2のプリント基板である。第1のプリント基板9の
端部には、第2のプリント基板13の端部にある長さは
略同一長さの接合部14A、14Bを挿入させる挿入口
10A、10Bが形成されている。なお、図2(図1に
おけるA−A断面図)に示すように、挿入口の寸法L1
は、第2のプリント基板13の厚みより大きく設定され
ている。
DESCRIPTION OF THE PREFERRED EMBODIMENTS (Embodiment) FIGS. 1 to 3 show a printed circuit board connection structure according to an embodiment of the present invention. In the figure, 9 is a first printed circuit board, and 13
Is a second printed circuit board. At the end of the first printed board 9, insertion ports 10A and 10B for inserting the joints 14A and 14B at the end of the second printed board 13 and having substantially the same length are formed. Note that, as shown in FIG. 2 (a cross-sectional view taken along the line AA in FIG. 1), the dimension L1 of the insertion port is
Is set to be larger than the thickness of the second printed circuit board 13.

【0013】また、第2のプリント基板13の表および
裏面においては、一部が例えば昇圧用電気部品など充電
回路を含むストロボ回路の高電圧、高電流用配線パター
ン15Aと、信号など用配線パターン15Bが形成され
ており、これら高電圧、高電流用配線パターン15Aと
信号用配線パターン15Bの伸延したの先端部には一部
が高電圧、高電流用接続端子ランド16Aと、信号用接
続端子ランド16Bを有し、また、第1のプリント基板
9の表および裏面においては、一部が例えば昇圧用電気
部品など充電回路を含むストロボ回路の高電圧、高電流
用配線パターン配線パターン11Aと、信号など用配線
パターン11Bが形成されており、これら高電圧、高電
流用配線パターン11Aと信号用配線パターン11B
は、第1のプリント基板9に設けた挿入口10A、10
Bの周囲まで伸延して、第2のプリント基板13の一部
が高電圧、高電流用接続端子ランド16A、信号用接続
端子ランド16Bと対接する一部が高電圧、高電流用接
続端子ランド12Aと、信号用接続端子ランド12Bを
形成している。
Further, on the front and back surfaces of the second printed board 13, a wiring pattern 15A for high voltage and high current of a strobe circuit including a charging circuit such as a boosting electric part and a wiring pattern for signals etc. 15B is formed, and a part of the extended high voltage / high current wiring pattern 15A and the signal wiring pattern 15B has a high voltage / high current connection terminal land 16A and a signal connection terminal. The land 16B is provided, and on the front and back surfaces of the first printed circuit board 9, a part of the high voltage and high current wiring pattern wiring pattern 11A of a strobe circuit including a charging circuit such as a boosting electric component is provided. A wiring pattern 11B for signals and the like is formed, and the wiring pattern 11A for high voltage and high current and the wiring pattern 11B for signal are formed.
Are the insertion openings 10A and 10A provided on the first printed circuit board 9.
A part of the second printed circuit board 13 extending to the periphery of B is connected to the high voltage / high current connection terminal land 16A and the signal connection terminal land 16B, and a part of the second printed circuit board 13 is connected to the high voltage / high current connection terminal land. 12A and a signal connection terminal land 12B are formed.

【0014】また、カメラの機能高度化と電気回路の複
雑化に伴って、より効率の良いレイアウトができ、より
数多くの信号を接続できるように、第1のプリント基板
9に設けた挿入口10A、10B同士の間L2を利用し
て配線パターンの引き回しを行い。
Further, as the function of the camera becomes higher and the electric circuit becomes more complicated, the layout can be made more efficient and a larger number of signals can be connected. Wiring patterns are laid out using L2 between 10B.

【0015】したがって、第1のプリント基板9に設け
た挿入口10A、10B同士の間L2を利用して配線パ
ターンの引き回しを行いから、プリント基板同士間の接
続用端子ランド数を増やすことができ、かつ、配線パタ
ーンの引き回しに必要なスペースは新規追加することが
必要なく、第1のプリント基板9の表面側への配線パタ
ーン用出張り量L3も短くすることができ、プリント基
板全体のコンパクト化に実現可能となり、しかも、挿入
口同士の間L2はプリント基板の補強部としても使用が
できるので、電気部品の実装を行う時、第1のプリント
基板9が外部からの熱により外形変形と反りを防ぐにも
有効である。
Therefore, since the wiring pattern is routed by utilizing the space L2 between the insertion openings 10A and 10B provided on the first printed board 9, the number of connection terminal lands between the printed boards can be increased. Moreover, it is not necessary to newly add a space necessary for routing the wiring pattern, and the protrusion amount L3 for the wiring pattern on the front surface side of the first printed circuit board 9 can be shortened, so that the entire printed circuit board is compact. In addition, since the space L2 between the insertion ports can be used as a reinforcing portion of the printed circuit board, the external shape of the first printed circuit board 9 is deformed by heat from the outside when mounting the electric component. It is also effective in preventing warpage.

【0016】このようにそれぞれ形成された第1および
第2のプリント基板9、13同士を接続するには、ま
ず、第1のプリント基板9の挿入口10A、10Bに第
2のプリント基板13の接合部14A、14Bを貫通挿
入させる。これにより、第2のプリント基板13の一部
が高電圧、高電流用接続端子ランド16Aと信号用接続
端子ランド16Bは、第1のプリント基板9に設けた一
部が高電圧、高電流用接続端子ランド12Aと信号用接
続端子ランド12Bに対応する位置に位置決めされる。
次に、これら接続用端子ランド12A、12B、16
A、16Bを半田付けして電気的導通される。
To connect the first and second printed circuit boards 9 and 13 formed in this way, first, the second printed circuit board 13 should be inserted into the insertion openings 10A and 10B of the first printed circuit board 9. The joining portions 14A and 14B are inserted through. As a result, part of the second printed circuit board 13 has high voltage and high current connection terminal lands 16A and signal connection terminal lands 16B that are provided on the first printed circuit board 9 for high voltage and high current. It is positioned at a position corresponding to the connection terminal land 12A and the signal connection terminal land 12B.
Next, these connection terminal lands 12A, 12B, 16
A and 16B are soldered and electrically connected.

【0017】[0017]

【発明の効果】以上説明したように、請求項1から請求
項3に記載した本発明によれば、プリント基板9に設け
た長さは略同一長さである挿入口10A、10B同士の
間L2を利用して配線パターンを形成されたことによ
り、プリント基板の表面側に突出する長さL3を短くす
ることができ、かつ、いままで以上な接続用端子数を増
やすことも可能であり、それを対応する必要な配線パタ
ーンの引き回しも可能により、複数のプリント基板同士
の半田付け信頼性は損なわず、プリント基板全体のコン
パクト化することができる。
As described above, according to the present invention described in claims 1 to 3, the lengths provided on the printed circuit board 9 are substantially the same between the insertion openings 10A and 10B. Since the wiring pattern is formed using L2, the length L3 protruding toward the front surface of the printed circuit board can be shortened, and the number of connecting terminals can be increased more than ever before. Since the necessary wiring pattern can be routed correspondingly, the reliability of soldering of the plurality of printed boards is not impaired, and the entire printed board can be made compact.

【図面の簡単な説明】[Brief description of drawings]

【図1】 本発明の実施形態であるプリント基板の接続
状態の説明図である。
FIG. 1 is an explanatory diagram of a connected state of a printed circuit board that is an embodiment of the present invention.

【図2】 本発明の実施形態であるプリント基板の接続
状態の説明図である。
FIG. 2 is an explanatory diagram of a connection state of a printed circuit board that is an embodiment of the present invention.

【図3】 本発明の実施形態であるプリント基板の接続
状態における断面図である。
FIG. 3 is a cross-sectional view of a printed circuit board according to an embodiment of the present invention in a connected state.

【図4】 従来プリント基板の接続状態の説明図であ
る。
FIG. 4 is an explanatory diagram of a connected state of a conventional printed circuit board.

【符号の説明】[Explanation of symbols]

1 小型プリント基板 2、3 取着穴 4、5 切除部 6、7 脚片 8 メインプリント基板 9 第1のプリント基板 10A、10B 挿入口 11A 一部が高電圧、高電流用配線パターン 11B 信号用配線パターン 12A 一部が高電圧、高電流用接続端子ランド 12B 信号用接続端子ランド 13 第2のプリント基板 14A、14B 接合部 15A 一部が高電圧、高電流用配線パターン 15B 信号用配線パターン 16A 一部が高電圧、高電流用接続端子ランド 16B 信号用接続端子ランド L1 挿入口の寸法 L2 挿入口同士の間 L3 出張り量 1 Small printed circuit board 2, 3 mounting holes 4, 5 excision part 6, 7 leg pieces 8 Main printed circuit board 9 First printed circuit board 10A, 10B insertion slot 11A Part of wiring pattern for high voltage and high current 11B signal wiring pattern 12A Part of high voltage, high current connection terminal land 12B signal connection terminal land 13 Second printed circuit board 14A, 14B joint 15A Part of wiring pattern for high voltage and high current 15B signal wiring pattern 16A Part of connection terminal land for high voltage and high current 16B signal connection terminal land L1 insertion slot dimensions Between the L2 insertion ports L3 protrusion amount

───────────────────────────────────────────────────── フロントページの続き Fターム(参考) 5E077 BB31 BB38 CC16 DD01 JJ21 5E338 BB17 CC01 CC04 CD11 EE23 EE27 5E344 AA08 AA12 BB02 BB06 CC05 CC07 CC23 DD02 DD15 EE13 EE26 EE30    ─────────────────────────────────────────────────── ─── Continued front page    F-term (reference) 5E077 BB31 BB38 CC16 DD01 JJ21                 5E338 BB17 CC01 CC04 CD11 EE23                       EE27                 5E344 AA08 AA12 BB02 BB06 CC05                       CC07 CC23 DD02 DD15 EE13                       EE26 EE30

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】復数の挿入口と前記挿入口の周囲に複数の
第1の配線パターンを有する第1のプリント基板と、前
記挿入口に挿入され前記第1の配線パターンと半田接続
可能な第2の配線パターンをもつ複数の接合部を有する
第2のプリント基板とを有し、複数の前記挿入口の中の
少なくとも1つの挿入口の周囲には信号用配線パターン
を形成し、他の前記挿入口の少なくとも1つには高電流
用配線パターンを形成し、前記複数の挿入口同士の間に
は前記第1あるいは第2の配線パターンの一部のパター
ンを形成したことを特徴とするプリント基板の接続構
造。
1. A first printed circuit board having a plurality of insertion openings and a plurality of first wiring patterns around the insertion openings, and a solder connection with the first wiring patterns inserted into the insertion openings. A second printed circuit board having a plurality of joints having a second wiring pattern, wherein a signal wiring pattern is formed around at least one of the plurality of insertion openings, and A high current wiring pattern is formed in at least one of the insertion openings, and a part of the first or second wiring pattern is formed between the plurality of insertion openings. Printed circuit board connection structure.
【請求項2】請求項1に記載の前記挿入口と前記挿入口
に挿入される前記接続部同士の長さは略一長さであるこ
とを特徴とするプリント基板の接続構造。
2. The printed circuit board connecting structure according to claim 1, wherein the insertion opening and the connecting portion inserted into the insertion opening are substantially one in length.
JP2002041530A 2002-02-19 2002-02-19 Connection structure of printed board Pending JP2003243792A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002041530A JP2003243792A (en) 2002-02-19 2002-02-19 Connection structure of printed board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002041530A JP2003243792A (en) 2002-02-19 2002-02-19 Connection structure of printed board

Publications (1)

Publication Number Publication Date
JP2003243792A true JP2003243792A (en) 2003-08-29

Family

ID=27781914

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002041530A Pending JP2003243792A (en) 2002-02-19 2002-02-19 Connection structure of printed board

Country Status (1)

Country Link
JP (1) JP2003243792A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7713092B2 (en) 2005-06-22 2010-05-11 Samsung Electronics Co., Ltd. Backlight assembly, display device having the same, and method thereof
JP2019097263A (en) * 2017-11-20 2019-06-20 日本電産コパル株式会社 Actuator, lens drive motor and electronic apparatus

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7713092B2 (en) 2005-06-22 2010-05-11 Samsung Electronics Co., Ltd. Backlight assembly, display device having the same, and method thereof
JP2019097263A (en) * 2017-11-20 2019-06-20 日本電産コパル株式会社 Actuator, lens drive motor and electronic apparatus
JP7175603B2 (en) 2017-11-20 2022-11-21 日本電産コパル株式会社 Actuators, lens drive motors and electronics

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