JP3410199B2 - Device for preventing bridging of connection member, semiconductor integrated circuit having the same, and mounting substrate - Google Patents

Description

Detailed Description of the Invention

[0001]

[Table of Contents] The present invention will be described in the following order. Industrial applications Conventional technology (Figs. 7 and 8) Problems to be Solved by the Invention (FIGS. 9 to 11) Means for Solving the Problems (FIGS. 1 and 3) Action (Figs. 1 and 3) Example (FIGS. 1 to 6) The invention's effect

[0002]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a bridging prevention device for a connecting member, a semiconductor integrated circuit having the same, and a mounting board, and is suitable for application when, for example, a chip part is connected to a conductor pattern formed on the board. It is something.

[0003]

2. Description of the Related Art Conventionally, in order to cope with an increase in the number of terminals, there is a device in which an integrated circuit is directly connected to a substrate in a bare chip. As shown in FIG. 7, a flip chip bonding type semiconductor integrated circuit chip (hereinafter referred to as a chip) 1 has electrodes 2 formed in a line on the outer peripheral portion.
On the electrode 2, a bump 3 in which a metal material such as solder is raised in a substantially spherical shape is formed in advance.

On a substrate 4 made of alumina or the like, lands 5 made of a substantially square copper pattern are formed in a line so as to have the same pitch as the electrode 2 of the chip 1 and a predetermined gear. The bumps 6 are also previously formed on this land 5.
Is formed. After that, the chip 1 is placed on the substrate 4 with the electrode 2 side facing downward and the electrode 2 and the land 5 aligned with each other. Subsequently, the upper and lower bumps 3 and 6 are heated and fluidized to be integrated. After this, when cooled, FIG.
As shown in, the chip 1 and the substrate 4 are electrically and physically connected.

[0005]

By the way, in the flip chip bonding method described above, as shown in FIG. 9, when the gap D1 between the lands 5 is sufficiently large, when the upper and lower bumps 3 and 6 are melted, they are adjacent to each other. The bumps 3 and 6 on the land 5 are not in contact with each other.

However, when the pitch between the lands 5 is narrow and therefore the gear D1 is narrow, as shown in FIG. 10, when the bumps 3 and 6 are fluidized, the bumps 3 are formed by the solder protruding from the adjacent lands 5. In Nos. 6 and 6, there was a problem that the risk of bridging increased.

Also, as shown in FIG. 11, if a rectangular land 8 whose longitudinal direction is oriented in a direction perpendicular to the direction in which the bumps 6 are arranged is formed beforehand, excess solder is applied when the bumps 3 and 6 are heated and fluidized. Flows in the longitudinal direction of the land 8,
It is possible to prevent the bumps 3 and 6 on the adjacent lands 8 from bridging each other. However, in this method, when the bumps 6 are formed on the lands 8 in advance, the solder is
Will flow in the longitudinal direction. For this reason, the bumps 6 are formed in different shapes, and there is a drawback in that connection failure may occur when the chips 1 are connected.

The present invention has been made in consideration of the above points, and when connecting a chip component to a substrate, a bridge of connecting members which can prevent adjacent bumps from bridging each other with an extra connecting member. The present invention intends to propose a leakage prevention device, a semiconductor integrated circuit having the same, and a mounting board.

[0009]

In order to solve the above problems, in the present invention, the conductive material is arranged in a line on the substrate 11 with the first gear D1 interposed therebetween.
A plurality of lands 5 to which conductive connecting members are attached respectively
Then, the connecting member guiding means 17 formed adjacent to the land 5 and in a direction substantially orthogonal to the arrangement direction of the lands 5 was provided on the substrate 11. The second gear D2 between the connecting member guiding means 17 and the land 5 is set narrower than the first gear D1 and the connecting member guiding means 17 is formed such that a part of the surface of the substrate 11 is concave. The guide groove is formed such that the bottom surface of the guide groove becomes deeper as it goes away from the land.

[0010]

Operation: The land 5 is adjacent to the land 5 on the substrate 11.
The connecting member guiding means 17 in which the gear D2 for the land 5 is set narrower than the mutual gear D1 is arranged in a direction substantially orthogonal to the mutual arrangement direction, and the connecting member guiding means 17 is arranged on the surface of the substrate 11. Part of the bumps 3 and 6 is formed in a concave shape, and the bottom surface thereof becomes deeper as it goes away from the land, so that the excess connection member of the bumps 3 and 6 reaches the adjacent bumps 3 and 6. Then, the connecting member guiding means 17 is reached and guided. This can prevent the adjacent bumps 3 and 6 from being short-circuited to each other by an extra connecting member.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described in detail below with reference to the drawings.

In FIG. 1 in which parts corresponding to those in FIG. 7 are designated by the same reference numerals, reference numeral 10 indicates a soldering portion on the side of the substrate 11 for connecting the chip 1 as a whole by flip chip bonding. In the soldering portion 10, lands 5 each having a substantially square copper pattern are formed in a line on the substrate 11 as in the conventional case. In addition to this, the soldering part 1
In No. 0, a rectangular solder guiding groove 12 in which a part of the surface of the substrate 11 is formed in a concave shape is formed near each land 5.

The solder guiding groove 12 is formed in a direction orthogonal to the arrangement direction of the lands 5 when viewed from the lands 5. The solder guiding groove 12 has a long side formed in a direction orthogonal to the arrangement direction of the lands 5 and a short side formed to have the same length as the facing sides of the lands 5. The bottom surface 12A of the solder guiding groove 12 is formed parallel to the surface of the substrate 11.

Further, the solder guide groove 12 is provided with a parallel gap D2 between itself and the land 5. This gear D2 is formed to be much smaller than the gear D1 of each land 5. As a result, excess solder that has been fluidized during soldering of the substrate 11 and the chip 1 reaches the solder guiding groove 12 before flowing out horizontally before coming into contact with the bumps 6 on the adjacent lands 5. Has been done.

In the above structure, when the bumps 6 are formed on the lands 5 in advance, the solder adjusted to a predetermined amount is attached to each of the lands 5. As a result, the solder stops within the boundary of the upper surface of the square land 5 due to surface tension. Therefore, the bump 6 does not flow out of the land 5 and is formed into a substantially spherical shape similar to the conventional one. After that, as shown in FIG. 2, the chip 1 is placed on the substrate 11 with the bumps 3 and 6 aligned with each other. Subsequently, the upper and lower bumps 3 and 6 are heated and melted.

At this time, as shown in FIG. 3, when the melted bumps 3 and 6 are projected from the land 5, extra solder not necessary for connection among the melted bumps 3 and 6 is
Before contacting the adjacent bumps 3 and 6, the solder guiding groove 1
It reaches 2 and flows in by gravity. Therefore, the adjacent bumps 3 and 6 are prevented from bridging each other with extra solder.

According to the above structure, the gear D2 for the land 5 is arranged on the substrate 11 in the direction adjacent to the land 5 and substantially orthogonal to the arrangement direction of the lands 5, as compared with the gear D1 of the lands 5. Narrowly set solder guide groove 1
As a result of arranging 2, when the bumps 3 and 6 are projected from the land 5, excess solder of the bumps 3 and 6 reaches the solder guiding groove 12 before reaching the adjacent bumps 3 and 6. Flows by gravity. This can prevent adjacent bumps 3 and 6 from bridging each other with extra solder.

When the bumps 6 are formed on the lands 5 in advance, the bumps 6 are formed on the long lands 8 by forming the substantially square lands 5 on the substrate 11 as in the conventional case. The solder flow can be prevented and the bumps 6 having a substantially uniform shape can be formed.

In the above embodiment, the case where the bottom surface 12A of the solder guiding groove 12 is formed parallel to the surface of the substrate 11 has been described, but the present invention is not limited to this, and as shown in FIG. , The solder guiding groove 17 of the soldering portion 15
May be formed in a slide shape. Also in this case, the same effect as described above can be obtained.

In the above embodiment, the gear D
However, the present invention is not limited to this, and when the bumps 6 are formed in advance, the solder stops within the boundary of the upper surface of the square land 5 due to surface tension, so that the gear tape D2 is eliminated. Is also good.

Further, in the above-mentioned embodiment, the case where the surface of the solder guiding groove 12 is not treated to improve the wettability with the solder has been described, but the present invention is not limited to this, and the surface of the solder guiding groove is not limited to this. Alternatively, a member such as a copper pattern that improves wettability with solder may be provided.

Further, in the above-mentioned embodiment, the case has been described in which the excess solder for connection passes over the parallel gap D2 and flows into the solder guiding groove 12.
The present invention is not limited to this, and excess solder may easily flow into the solder guiding groove by forming the shape of the end surface of the land on the side of the solder guiding groove other than a straight line.

As shown in FIG. 5, the soldering portion 19 is
The land 5 of a substantially square shape is formed on the substrate 20 as in the conventional case.
And the solder guide groove 21 is formed on the land 5.
It is formed without providing a gear gap between and. Further, a through hole (here, a semi-cylindrical shape) 22 is opened between the land 5 and the solder guiding groove 21. When the melted bumps are projected from the land as a result of this, excess solder is provided on the bottom surface 21A of the solder guiding groove 21 through the through hole 22 and has a good wettability, such as a copper pattern.
It is designed to easily flow into 3.

Further, in the above-described embodiment, the case where the solder guiding groove 12 is provided for guiding the excessive solder to the connection has been described, but the present invention is not limited to this, and the extra solder may be formed by means other than the groove. May be guided. For example, as shown in FIG. 6, in the soldering portion 25, a square solder guiding land 27 having a copper pattern is formed on the substrate 26 near the square land 5. Land 5
The gear D3 between the solder guiding land 27 and the solder guiding land 27 is formed narrower than the gear D1 between the lands 5. When the melted bump protrudes from the land by this, the excess solder flows into the solder guiding land 27 having higher wettability than the substrate 11 before bridging with the adjacent bump.

Further, in the above embodiment, the land 5
Has been described as having a substantially square shape, and the rectangular solder guiding groove 12 and the square solder guiding land 27 are formed near the land 5, but the present invention is not limited to this, and the shape of the solder guiding groove is not rectangular. The shape of the solder induction land may be a shape other than a square. It can also be applied to the case where the land is formed into a substantially circular shape. Also in this case, the bumps can be formed into a substantially spherical shape. Further, it can be applied to the case of forming a solder guiding groove or a solder guiding land having a shape along the substantially circular land.

In the above-described embodiments, the case where the chip 1 is connected by solder has been described, but the present invention is not limited to this, and in the case of connecting a single chip component other than the semiconductor integrated circuit such as a resistor or a capacitor. Alternatively, the invention can be applied to the case of guiding a fluidized extra connection member of a bump made of a connection member other than solder.

[0027]

As described above, according to the present invention, the gear gap for the land is set narrower than the gear gap for the lands in the direction adjacent to the lands and substantially orthogonal to the arrangement direction of the lands on the substrate. By disposing the connecting member guiding means, the connecting member guiding means is formed by forming a part of the surface of the substrate in a concave shape, and the bottom surface becomes deeper as the distance from the land increases. When protruding from the land, the extra connection member of the bump reaches and is guided to the connection member guiding means before reaching the adjacent bump. As a result, it is possible to realize a bridging prevention device for connecting members, which can prevent adjacent bumps from being short-circuited by an extra connecting member.

[Brief description of drawings]

FIG. 1 is a schematic diagram showing a structure of a soldering portion on a board side according to an embodiment of a bridging prevention device for a connecting member according to the present invention.

FIG. 2 is a schematic diagram showing a state of upper and lower bumps before melting.

FIG. 3 is a schematic diagram showing a state in which excessive solder in a melted bump has flowed into a solder guide groove.

FIG. 4 is a schematic diagram showing a structure of a soldering portion on a board side according to another embodiment.

FIG. 5 is a schematic diagram showing a configuration of a soldering portion on a board side according to another embodiment.

FIG. 6 is a schematic diagram showing a structure of a soldering portion on a board side according to another embodiment.

FIG. 7 is a schematic diagram showing a configuration of a conventional soldering portion on a substrate side and shapes of upper and lower bumps at the time of alignment.

FIG. 8 is a schematic diagram showing the shapes of upper and lower bumps when they are melted and integrated.

FIG. 9 is a schematic diagram showing the shapes of lands and bumps on a substrate.

FIG. 10 is a schematic diagram showing a fused and bridged bump.

FIG. 11 is a schematic diagram showing that bumps formed on rectangular lands have different shapes.

[Explanation of symbols]

1 ... Semiconductor integrated circuit chip, 2 ... Electrode, bump 3 ...
... 4, 11, 16, 20, 26 ... substrate, 5, 8 ...
Land, 6 ... Bump, 10, 15, 19, 25 ... Soldering part, 12, 17, 21 ... Solder guide groove, 12
A, 21A ... bottom, 22 ... through hole, 27 ...
Solder induction land, D1, D2, D3 ... Gear cup.

─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Natsuya Ishikawa 6-735 Kita-Shinagawa, Shinagawa-ku, Tokyo Sony Corporation (72) Inventor Mutsu Ito 6-7 Kita-Shinagawa, Shinagawa-ku, Tokyo No. 35 in Sony Corporation (56) References JP-A-5-327196 (JP, A) Actual development 5-4545 (JP, U) (58) Fields investigated (Int.Cl. ⁷ , DB name) H05K 3/34 H01L 21/60 H01L 23/12

Claims (6)

(57) [Claims] 1. On a substrate, a first gear gap is provided between the substrates.
Made of conductive material arranged in a row,
Multiple lands to which connection members are attached, Arrangement of the land adjacent to the land and on the board.
Connecting member guide hand formed in a direction substantially orthogonal to the row direction
With steps, Second gear cup between the connecting member guiding means and the land
Is narrower than the first gearCage, The connecting member guiding means has a concave part of the surface of the substrate.
The guide groove is formed on the bottom of the guide groove.
Is formed so that it becomes deeper as it moves away from the
A bridging prevention device for a connecting member. 2. The land and the guide groove have an extra connection.
This it is attached in inducing material that induces a said connecting member
The bridging prevention device for a connecting member according to claim 1, wherein: 3. The connection member on the bottom surface is redundant for connection.
A contract characterized by being provided with an induction material for inducing
The bridging prevention device for a connecting member according to claim 1 . 4. The connecting member guiding means is provided on the substrate,
Made of inductive material to guide the extra above connecting member into the connection
2. The method according to claim 1, further comprising a guided land.
Bridging prevention device for connecting members. 5.On the board, mutually via the first gear
Made of conductive material arranged in a row,
A plurality of lands to which the connecting members are attached, Arrangement of the land adjacent to the land and on the board.
Connecting member guide hand formed in a direction substantially orthogonal to the row direction
Step With Second gear cup between the connecting member guiding means and the land
Is set narrower than the first gear, The connecting member guiding means has a concave part of the surface of the substrate.
The guide groove is formed on the bottom of the guide groove.
Is formed so that it becomes deeper as it moves away from the
A semi-conductor having a bridging prevention device for a connecting member, characterized in that
Body integrated circuit. 6.On the board, mutually via the first gear
Made of conductive material arranged in a row,
A plurality of lands to which the connecting members are attached, Arrangement of the land adjacent to the land and on the board.
Connecting member guide hand formed in a direction substantially orthogonal to the row direction
Step With Second gear cup between the connecting member guiding means and the land
Is set narrower than the first gear, The connecting member guiding means has a concave part of the surface of the substrate.
The guide groove is formed on the bottom of the guide groove.
Is formed so that it becomes deeper as it moves away from the
Mounting having a bridging prevention device for a connecting member characterized by
substrate.