JPH01245591A - Densely package substrate - Google Patents
Densely package substrateInfo
- Publication number
- JPH01245591A JPH01245591A JP7400388A JP7400388A JPH01245591A JP H01245591 A JPH01245591 A JP H01245591A JP 7400388 A JP7400388 A JP 7400388A JP 7400388 A JP7400388 A JP 7400388A JP H01245591 A JPH01245591 A JP H01245591A
- Authority
- JP
- Japan
- Prior art keywords
- electrodes
- conductive pads
- surface mount
- mount component
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 8
- 229910000679 solder Inorganic materials 0.000 claims abstract description 22
- 238000004806 packaging method and process Methods 0.000 abstract 4
- 239000012141 concentrate Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、フラットパッケージＩＣ等の表面実装部品の
実装に適した高密度実装基板に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a high-density mounting board suitable for mounting surface-mounted components such as flat package ICs.
第４図ｉａ）、 （ｂ）に示す従来の高密度実装基板１
は、絶縁基板２上に導電パターン３が形成されており、
この導電パターン３の端部には、表面実装部品４の複数
の電極５，５′と対応するように複数の４電バツド６が
形成されている。又、導電パターン３上にはオーバーコ
ートＪ１７が形成されている。Conventional high-density mounting board 1 shown in Fig. 4 ia) and (b)
A conductive pattern 3 is formed on an insulating substrate 2,
A plurality of four-conductor pads 6 are formed at the ends of the conductive pattern 3 so as to correspond to the plurality of electrodes 5 and 5' of the surface mount component 4. Further, an overcoat J17 is formed on the conductive pattern 3.
このような高密度実装基板ｌと表面実装部品４とを接続
するときには、導電パッド６上に略同寸法の半田ペース
ト層８を印刷により形成し、この半田ペースト層８上に
表面実装部品４の複数の電極５．５′を載置する。そし
てリフローにて、上記半田ペースト層８を溶融し、表面
実装部品４を固定するものであった。When connecting such a high-density mounting board l and the surface mount component 4, a solder paste layer 8 of approximately the same size is formed on the conductive pad 6 by printing, and the surface mount component 4 is placed on this solder paste layer 8. A plurality of electrodes 5.5' are placed. Then, the solder paste layer 8 was melted by reflow, and the surface mount component 4 was fixed.
しかし、従来の構造ではりフロー時に半田自体が流動す
るため、リフロー中に表面実装部品４が位置ずれしたま
ま実装されるものが多々あった。However, in the conventional structure, since the solder itself flows during reflow, the surface mount components 4 were often mounted with their position shifted during reflow.
本発明は、かかる事情に鑑みてなされたもので表面実装
部品４が位置ずれることなく搭載予定位置に正確に実装
される高密度実装基板を提供することを目的とする。The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a high-density mounting board on which surface-mounted components 4 are accurately mounted at the intended mounting position without being displaced.
上記問題点を解決するために本発明は、複数の電極を有
する表面実装部品の各電極を基板上に形成した複数の導
電パッド上に半田を介して載置し、半田をリフローさせ
て表面実装部品を、複数の導電パッドに電気的に接続し
て回路を構成する高密度実装基板において、半田のりフ
ロー時に流動化した半田の張力が、表面実装部品に作用
し、その合力により表面実装部品を搭載予定位置に正確
に実装できるように、表面実装部品の複数の電極と相対
向する複数の導電バンドのピッチを、表面実装部品の電
極のピッチとは異なるピッチによって、表面実装部品の
最端部の電極の内側と同−線上になるように配列したこ
とを要旨とするものである。In order to solve the above-mentioned problems, the present invention places each electrode of a surface mount component having a plurality of electrodes on a plurality of conductive pads formed on a substrate via solder, reflows the solder, and mounts the surface mount component. In high-density mounting boards where components are electrically connected to multiple conductive pads to form a circuit, the tension of the fluidized solder during solder paste flow acts on the surface mount components, and the resultant force causes the surface mount components to To ensure accurate mounting at the intended mounting position, the pitch of the multiple conductive bands that face the multiple electrodes of the surface mount component is set to a pitch different from the pitch of the electrodes of the surface mount component, so that the pitch of the conductive bands is set at the very edge of the surface mount component. The gist is that the electrodes are arranged on the same line as the inside of the electrode.
本発明によると、加熱により半田をリフローさせた時に
、表面実装部品の各電極に相対向する導電パッドの中心
方向に半田が表面張力により集まりこの張力が表面実装
部品に作用する。そして、この表面実装部品に作用する
力の合力によって表面実装部品を移動させる。According to the present invention, when the solder is reflowed by heating, the solder gathers toward the center of the conductive pad facing each electrode of the surface mount component due to surface tension, and this tension acts on the surface mount component. The surface mount component is then moved by the resultant force acting on the surface mount component.
以下、本発明の実施例を図面を参照して説明する。本発
明に係わる高密度実装基板は、第１図に示すようにセラ
ミック基（反あるいは、ガラスエポキシ基板等の絶縁基
板２上に導電パターン３、導電パッド６、及びオーバー
コート層７が形成されている。上記導電パッド６は、表
面実装部品４の電極５．５′のピッチとは異なるピッチ
によって、表面実装部品４の同一配列方向の最端部の電
極５′の内側と同一線上になるように形成しである。Embodiments of the present invention will be described below with reference to the drawings. As shown in FIG. 1, the high-density mounting board according to the present invention has a conductive pattern 3, a conductive pad 6, and an overcoat layer 7 formed on an insulating substrate 2 such as a ceramic base (or a glass epoxy board). The conductive pad 6 has a pitch different from that of the electrodes 5.5' of the surface mount component 4, so that it is on the same line as the inside of the electrode 5' at the end of the surface mount component 4 in the same arrangement direction. It is formed.
これら導電パッド６は、表面実装部品４の電極５゜５′
の幅よりもやや広く設定しである。さらに導電パターン
３上にはオーバーコート層７が形成すれており、以上の
構造により高密度実装基板ｌが構成されている。These conductive pads 6 are connected to the electrodes 5゜5' of the surface mount component 4.
It is set slightly wider than the width of the . Further, an overcoat layer 7 is formed on the conductive pattern 3, and the above structure constitutes a high-density mounting board 1.
上記の構成において、高密度実装基板ｌに表面実装部品
４を設ける時には、先ず導電パッド６上にこれと略同寸
法の半田ペースト層８を印刷により形成する。次いで上
記半田ペースト層８に相対向する表面実装部品４の電極
５．５′を載置する。In the above configuration, when providing the surface mount component 4 on the high-density mounting board 1, a solder paste layer 8 having approximately the same dimensions as the conductive pad 6 is first formed by printing on the conductive pad 6. Next, the electrodes 5.5' of the surface mount component 4 facing each other are placed on the solder paste layer 8.
そして上記半田ペーストＮ８をリフローにて溶融し、上
記電極５．５′と導電パッド６とを接続して、表面実装
部品４を固定する。この時には、半田ペースト層８の溶
融した半田は、第２図に示すように、表面張力によって
矢印で示すように、導電パッド６の中心に集まるように
移動する。この力が、電極５，５′にそれぞれ矢印Ｆ及
びＦ′で示す方向に作用する。そして、Ｆ、Ｆ’の合力
が、表面実装部品４に矢印Ｆ＃で示す方向に作用し、バ
ランスのとれた位置すなわち適切な位置に固定される。Then, the solder paste N8 is melted by reflow, and the electrodes 5 and 5' are connected to the conductive pads 6, thereby fixing the surface mount component 4. At this time, as shown in FIG. 2, the molten solder in the solder paste layer 8 moves to the center of the conductive pad 6 as shown by the arrow due to surface tension. This force acts on the electrodes 5, 5' in the directions indicated by arrows F and F', respectively. Then, the resultant force of F and F' acts on the surface mount component 4 in the direction indicated by the arrow F#, and the surface mount component 4 is fixed at a balanced position, that is, an appropriate position.
第３図及び式（１）に、前記実施例の複数の導電パッド
のピッチを求める一式を示す。FIG. 3 and equation (1) show a set for determining the pitch of the plurality of conductive pads in the above embodiment.
Ｐ ： 導電パッドのピッチ
Ｎ ： 表面実装部品の同一配列方向の電極数ｘｌ ：
上記電極のピッチ
ｘ２ ： 上記電極の幅
ｙ ： 導電パッドの幅
〔発明の効果〕
本発明の高密度実装基板は以上のように絶縁基板上にお
ける複数の導電パッドの各々に形成された半田ペースト
層がリフローする時、半田の張力によって搭載部品が搭
載位置に確実に実装される効果がある。P: Pitch of conductive pads N: Number of electrodes in the same arrangement direction of surface mount components xl:
Pitch x2 of the above electrodes: Width y of the above electrodes: Width of the conductive pads [Effects of the Invention] As described above, the high-density mounting board of the present invention has a solder paste layer formed on each of a plurality of conductive pads on an insulating substrate. When reflowing, the tension of the solder has the effect of ensuring that the mounted components are mounted at the mounting position.
第１図は本発明の一実施例を示す平面図、第２図は第１
図に示した導電パッド６の要部拡大平面図である。第３
図は本発明の一実施例を示す平面図である。第４図のｆ
ａ＋と（ｂｌは従来例を示す平面図とこの平面図におけ
るＡ−Ａ矢視断面図である。
■・・・高密度実装基板
２・・・絶縁基板
３・・・導電パターン
４・・・実装部品
５・・・電極
５′・・端部電極
６・・・４電パツド
７・・・オーバーコート層
８・・・半田ペースト層
以上
出願人 セイコー京葉工業株式会社
代理人 セイコー電子工業株式会社
Ｆ“
末！！明の笑泥例
第 ｌ 図
木絶明の実施Ｉ＋Ｊを示す菰尺図
第２１￥ｌｌ
第３図
７３．３
従１ヒイ９’Ｊどり５壬と面Ｃン］
第４図ＣＱ）
従来例の断面図
第４図（ｂ）Fig. 1 is a plan view showing one embodiment of the present invention, and Fig. 2 is a plan view showing an embodiment of the present invention.
FIG. 3 is an enlarged plan view of a main part of the conductive pad 6 shown in the figure. Third
The figure is a plan view showing one embodiment of the present invention. f in Figure 4
a+ and (bl are a plan view showing a conventional example and a sectional view taken along the line A-A in this plan view. ■... High-density mounting board 2... Insulating substrate 3... Conductive pattern 4... Mounted parts 5...Electrode 5'...End electrode 6...4-electrode pad 7...Overcoat layer 8...Solder paste layer and above Applicant Seiko Keiyo Kogyo Co., Ltd. Agent Seiko Electronics Co., Ltd. F" End!! Ming's Laughing Example No. 1 Diagram showing implementation I+J of Tsuki Zemei No. 21\ll Fig. 3 73.3 Ju 1 Hii 9'J Dori 5 Mi to Men C] No. 4 Figure CQ) Cross-sectional view of conventional example Figure 4 (b)
Claims (1)
ドを基板に形成し、前記表面実装部品を前記複数の導電
パッド上に半田を介して載置し、半田をリフローさせて
前記複数の導電パッドに電気的に接続して回路を構成す
る高密度実装基板において、 前記複数の導電パッドの最端部パッドの内側が、前記表
面実装部品の前記複数の電極の最端部の電極の内側と同
一線上にあることを特徴とする高密度実装基板。[Claims] A plurality of conductive pads facing the plurality of electrodes of a surface mount component are formed on a substrate, the surface mount component is placed on the plurality of conductive pads via solder, and the solder is reflowed. In a high-density mounting board that is electrically connected to the plurality of conductive pads to form a circuit, the innermost end pad of the plurality of conductive pads is the innermost end of the plurality of electrodes of the surface mount component. A high-density mounting board characterized by being on the same line as the inside of the electrode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7400388A JPH01245591A (en) | 1988-03-28 | 1988-03-28 | Densely package substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7400388A JPH01245591A (en) | 1988-03-28 | 1988-03-28 | Densely package substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01245591A true JPH01245591A (en) | 1989-09-29 |
Family
ID=13534463
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7400388A Pending JPH01245591A (en) | 1988-03-28 | 1988-03-28 | Densely package substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01245591A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006104032A1 (en) * | 2005-03-29 | 2006-10-05 | Murata Manufacturing Co., Ltd. | Electronic part mounting structure |
-
1988
- 1988-03-28 JP JP7400388A patent/JPH01245591A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006104032A1 (en) * | 2005-03-29 | 2006-10-05 | Murata Manufacturing Co., Ltd. | Electronic part mounting structure |
| JPWO2006104032A1 (en) * | 2005-03-29 | 2008-09-04 | 株式会社村田製作所 | Electronic component mounting structure |
| JP4618298B2 (en) * | 2005-03-29 | 2011-01-26 | 株式会社村田製作所 | Electronic component mounting structure |
| US8039758B2 (en) | 2005-03-29 | 2011-10-18 | Murata Manufacturing Co., Ltd. | Mounting structure for electronic component |
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