JPH0429584Y2 - - Google Patents
Info
- Publication number
- JPH0429584Y2 JPH0429584Y2 JP1984117968U JP11796884U JPH0429584Y2 JP H0429584 Y2 JPH0429584 Y2 JP H0429584Y2 JP 1984117968 U JP1984117968 U JP 1984117968U JP 11796884 U JP11796884 U JP 11796884U JP H0429584 Y2 JPH0429584 Y2 JP H0429584Y2
- Authority
- JP
- Japan
- Prior art keywords
- circuit pattern
- iron foil
- circuit board
- electromagnetic shielding
- coating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 24
- 239000011247 coating layer Substances 0.000 claims description 7
- 239000010410 layer Substances 0.000 claims description 5
- 239000000463 material Substances 0.000 description 7
- 239000010408 film Substances 0.000 description 6
- 239000011888 foil Substances 0.000 description 6
- 239000002345 surface coating layer Substances 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000012787 coverlay film Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11796884U JPS6134762U (ja) | 1984-07-31 | 1984-07-31 | 電磁シ−ルド機能を有するフレキシブル回路基板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11796884U JPS6134762U (ja) | 1984-07-31 | 1984-07-31 | 電磁シ−ルド機能を有するフレキシブル回路基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6134762U JPS6134762U (ja) | 1986-03-03 |
JPH0429584Y2 true JPH0429584Y2 (zh) | 1992-07-17 |
Family
ID=30676857
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11796884U Granted JPS6134762U (ja) | 1984-07-31 | 1984-07-31 | 電磁シ−ルド機能を有するフレキシブル回路基板 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6134762U (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011043442A1 (ja) * | 2009-10-07 | 2011-04-14 | 太平洋セメント株式会社 | 腐食センサ |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02113392U (zh) * | 1989-02-24 | 1990-09-11 | ||
JP4588108B1 (ja) * | 2009-10-07 | 2010-11-24 | 太平洋セメント株式会社 | 腐食センサ装置、腐食センサ装置の製造方法、腐食検出方法、センサおよびセンサの製造方法 |
WO2014192490A1 (ja) | 2013-05-28 | 2014-12-04 | タツタ電線株式会社 | 形状保持フィルム、及びこの形状保持フィルムを備えた形状保持型フレキシブル配線板 |
JP6949453B2 (ja) * | 2015-07-24 | 2021-10-13 | 大日本印刷株式会社 | 電磁波シールド積層材および電磁波シールド回路基板 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5750872B2 (zh) * | 1975-03-12 | 1982-10-29 | ||
JPS5755973B2 (zh) * | 1977-05-11 | 1982-11-27 | ||
JPS5842962B2 (ja) * | 1977-10-25 | 1983-09-22 | 日本ビクター株式会社 | 自動利得制御方式 |
JPS596861B2 (ja) * | 1975-05-19 | 1984-02-15 | オオツカセイヤク カブシキガイシヤ | 5−〔(2−ハロゲノ−1−ヒドロキシ)アルキル〔カルボスチリル誘導体の製造法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5750872U (zh) * | 1980-09-06 | 1982-03-24 | ||
JPS5755973U (zh) * | 1980-09-18 | 1982-04-01 | ||
JPS5842962U (ja) * | 1981-09-16 | 1983-03-23 | 株式会社日立製作所 | 複合プリント板 |
JPS596861U (ja) * | 1982-07-07 | 1984-01-17 | 松下電器産業株式会社 | 配線基板 |
-
1984
- 1984-07-31 JP JP11796884U patent/JPS6134762U/ja active Granted
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5750872B2 (zh) * | 1975-03-12 | 1982-10-29 | ||
JPS596861B2 (ja) * | 1975-05-19 | 1984-02-15 | オオツカセイヤク カブシキガイシヤ | 5−〔(2−ハロゲノ−1−ヒドロキシ)アルキル〔カルボスチリル誘導体の製造法 |
JPS5755973B2 (zh) * | 1977-05-11 | 1982-11-27 | ||
JPS5842962B2 (ja) * | 1977-10-25 | 1983-09-22 | 日本ビクター株式会社 | 自動利得制御方式 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011043442A1 (ja) * | 2009-10-07 | 2011-04-14 | 太平洋セメント株式会社 | 腐食センサ |
Also Published As
Publication number | Publication date |
---|---|
JPS6134762U (ja) | 1986-03-03 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4684916A (en) | Chip resistor | |
JP2004511107A (ja) | 干渉放射線に対して遮蔽された印刷回路基板の製造方法 | |
EP0929208A3 (en) | A flexible chemically-milled circuit assembly with multiple conductor layers and method of making same | |
GB2212669A (en) | A printed circuit substrate | |
JPH0429584Y2 (zh) | ||
US4479991A (en) | Plastic coated laminate | |
USH650H (en) | Double sided circuit board and a method for its manufacture | |
JP2002033556A (ja) | 可撓性回路基板 | |
JPS6127697A (ja) | 片面プリント配線基板とその製造法 | |
JPH0514437B2 (zh) | ||
JPH0644667B2 (ja) | シ−ルド付可撓性プリント回路基板 | |
JPH0238472Y2 (zh) | ||
JPH07111371A (ja) | フレキシブルプリント基板 | |
JPH05243738A (ja) | フレキシブル・リジッド・プリント配線板 | |
JPH0521901Y2 (zh) | ||
JPH0199289A (ja) | 配線板及びその製造法 | |
JPH09252174A (ja) | フレキシブル回路配線板 | |
JPS6336598A (ja) | 配線板の製造方法 | |
JPS6448492A (en) | Manufacture of flexible printed wiring board | |
JPH021920Y2 (zh) | ||
JPH0648953Y2 (ja) | シ−ルド付フレキシブル配線板 | |
JP2603097B2 (ja) | プリント配線板の製造方法 | |
JPH0727643Y2 (ja) | フレキシブル・リジッド・プリント配線板 | |
JPS6214717Y2 (zh) | ||
JPH0717166Y2 (ja) | 多層フレキシブルプリント配線板 |