JPH0428420U - - Google Patents
Info
- Publication number
- JPH0428420U JPH0428420U JP7032990U JP7032990U JPH0428420U JP H0428420 U JPH0428420 U JP H0428420U JP 7032990 U JP7032990 U JP 7032990U JP 7032990 U JP7032990 U JP 7032990U JP H0428420 U JPH0428420 U JP H0428420U
- Authority
- JP
- Japan
- Prior art keywords
- mount component
- surface mount
- adhesive
- contact
- pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims 2
- 230000001070 adhesive effect Effects 0.000 claims 2
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図Ａはこの考案に係る一実施例の表面実装
部品がパツドに接続されている状態を示す斜視図
、同図ＢおよびＣは同図Ａ，Ａ−Ａ面の断面図、
同図Ｄはこの考案の他の実施例を示すリード端子
の断面図、第２図Ａは従来の表面実装部品がパツ
ドに接続されている状態を示す斜視図、同図Ｂは
同図Ａ，Ｂ−Ｂ面の断面図である。
１……表面実装部品、３……リード端子、７…
…パツド、９……半田。
FIG. 1A is a perspective view showing a state in which a surface mount component according to an embodiment of this invention is connected to a pad, and FIGS. 1B and C are sectional views taken along A-A in FIG.
2D is a sectional view of a lead terminal showing another embodiment of this invention, FIG. 2A is a perspective view showing a conventional surface mount component connected to a pad, FIG. It is a sectional view of the BB plane. 1...Surface mount component, 3...Lead terminal, 7...
...Patsudo, 9...Solder.
Claims (1)
することによつてこのパツド上に固着される表面
実装部品において、 前記パツドとの接触面積を小さくし、パツド上
に付着される接着剤との接触面積が大きくなる形
状のリード端子を有したことを特徴とする表面実
装部品。[Claim for Utility Model Registration] In a surface mount component that is brought into contact with the surface of a printed wiring board and fixed on the pad by applying an adhesive, A surface mount component characterized by having a lead terminal shaped to increase the contact area with an adhesive to be attached.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7032990U JPH0428420U (en) | 1990-07-03 | 1990-07-03 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7032990U JPH0428420U (en) | 1990-07-03 | 1990-07-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0428420U true JPH0428420U (en) | 1992-03-06 |
Family
ID=31606399
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7032990U Pending JPH0428420U (en) | 1990-07-03 | 1990-07-03 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0428420U (en) |
-
1990
- 1990-07-03 JP JP7032990U patent/JPH0428420U/ja active Pending