JPH0428472U - - Google Patents

Info

Publication number
JPH0428472U
JPH0428472U JP6890490U JP6890490U JPH0428472U JP H0428472 U JPH0428472 U JP H0428472U JP 6890490 U JP6890490 U JP 6890490U JP 6890490 U JP6890490 U JP 6890490U JP H0428472 U JPH0428472 U JP H0428472U
Authority
JP
Japan
Prior art keywords
engaging part
electronic component
view
mounting device
electronic components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6890490U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP6890490U priority Critical patent/JPH0428472U/ja
Publication of JPH0428472U publication Critical patent/JPH0428472U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図aおよびbは本考案の第1実施例の回路
基板を示す斜視図および実装状態の断面図、第2
図aおよびbは第2実施例の回路基板を示す斜視
図および実装状態の断面図、第3図aおよびbは
第3実施例の回路基板を示す斜視図および実装状
態の断面図、第4図a,bおよびcは第4実施例
の例の電子部品の斜視図、回路基板の斜視図およ
び実装状態の断面図、第5図aおよびbは第5実
施例の実装状態の断面図およびその電子部品の変
形例を示す斜視図である。 1……桁材(係合部)、2……回路基板、3…
…ランド部(回路)、4……本体、5……リード
端子、6……導電材、7……枠体(係合部)、8
……凹部(係合部)、10……凹部(係合部)、
11……突起(係合部)。
1A and 1B are a perspective view and a sectional view of a circuit board according to a first embodiment of the present invention in a mounted state;
Figures a and b are a perspective view and a cross-sectional view of the circuit board of the second embodiment in a mounted state; Figures a and b are a perspective view and a cross-sectional view of the circuit board of the third embodiment; Figures a, b and c are a perspective view of an electronic component according to the fourth embodiment, a perspective view of a circuit board, and a cross-sectional view of the mounted state, and Figures a and b are a cross-sectional view of the mounted state of the fifth embodiment. It is a perspective view showing a modification of the electronic component. 1... Girder material (engaging part), 2... Circuit board, 3...
... Land part (circuit), 4 ... Main body, 5 ... Lead terminal, 6 ... Conductive material, 7 ... Frame (engaging part), 8
... recessed part (engaging part), 10 ... recessed part (engaging part),
11...Protrusion (engaging part).

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 電子部品のリード端子が接続される回路がパタ
ーン形成された回路基板の実装部位に凸状または
凹状の係合部を形成し、この係合部に電子部品の
本体の一部または全部を嵌め合わせて固定するこ
とを特徴とする電子部品の実装装置。
A convex or concave engaging part is formed on the mounting area of the circuit board on which a circuit to which the lead terminal of the electronic component is connected is patterned, and part or all of the main body of the electronic component is fitted into this engaging part. A mounting device for electronic components, characterized in that the mounting device fixes the electronic components by using
JP6890490U 1990-06-28 1990-06-28 Pending JPH0428472U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6890490U JPH0428472U (en) 1990-06-28 1990-06-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6890490U JPH0428472U (en) 1990-06-28 1990-06-28

Publications (1)

Publication Number Publication Date
JPH0428472U true JPH0428472U (en) 1992-03-06

Family

ID=31603750

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6890490U Pending JPH0428472U (en) 1990-06-28 1990-06-28

Country Status (1)

Country Link
JP (1) JPH0428472U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015087546A1 (en) * 2013-12-13 2015-06-18 三菱重工オートモーティブサーマルシステムズ株式会社 Affixing structure for electronic component

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015087546A1 (en) * 2013-12-13 2015-06-18 三菱重工オートモーティブサーマルシステムズ株式会社 Affixing structure for electronic component
US10149385B2 (en) 2013-12-13 2018-12-04 Mitsubishi Heavy Industries Thermal Systems, Ltd. Affixing structure for electronic component

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