JPH0428135B2 - - Google Patents
Info
- Publication number
- JPH0428135B2 JPH0428135B2 JP60077657A JP7765785A JPH0428135B2 JP H0428135 B2 JPH0428135 B2 JP H0428135B2 JP 60077657 A JP60077657 A JP 60077657A JP 7765785 A JP7765785 A JP 7765785A JP H0428135 B2 JPH0428135 B2 JP H0428135B2
- Authority
- JP
- Japan
- Prior art keywords
- bonding
- slide block
- dead center
- contact
- capillary
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
- H10W72/07141—Means for applying energy, e.g. ovens or lasers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07521—Aligning
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60077657A JPS61236132A (ja) | 1985-04-12 | 1985-04-12 | ワイヤボンデイング装置におけるボンデイング方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60077657A JPS61236132A (ja) | 1985-04-12 | 1985-04-12 | ワイヤボンデイング装置におけるボンデイング方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61236132A JPS61236132A (ja) | 1986-10-21 |
| JPH0428135B2 true JPH0428135B2 (enExample) | 1992-05-13 |
Family
ID=13639952
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60077657A Granted JPS61236132A (ja) | 1985-04-12 | 1985-04-12 | ワイヤボンデイング装置におけるボンデイング方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61236132A (enExample) |
-
1985
- 1985-04-12 JP JP60077657A patent/JPS61236132A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61236132A (ja) | 1986-10-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4603802A (en) | Variation and control of bond force | |
| KR950000515B1 (ko) | 탭테이프에의 반도체소자 접합방법 및 초음파 본딩장치 | |
| JP3094374B2 (ja) | ワイヤボンダ用フレーム固定装置 | |
| JPH0428135B2 (enExample) | ||
| JPH02231736A (ja) | ワイヤボンデイング方法 | |
| JP2558717B2 (ja) | ワイヤボンディング装置 | |
| JP2578932B2 (ja) | ダイボンディング装置 | |
| JPH01199443A (ja) | ワイヤボンデイング装置 | |
| JP2001127097A (ja) | ボンディング装置及びその制御方法 | |
| JPH0431179B2 (enExample) | ||
| JP2575066B2 (ja) | 半導体組立装置 | |
| JP2602886B2 (ja) | インナーリードボンディング装置及びインナーリードボンディング方法 | |
| JPH04317343A (ja) | ボンデイング装置 | |
| JPS6229897B2 (enExample) | ||
| JP2523657B2 (ja) | ワイヤボンディング方法 | |
| JP3625934B2 (ja) | パラレルシーム接合方法及びパラレルシーム接合装置 | |
| JPH05131386A (ja) | ダイハンドリング部コレツト上下機構 | |
| JP2676446B2 (ja) | ワイヤボンディング方法 | |
| JP3189402B2 (ja) | バンプ形成方法 | |
| JP2950724B2 (ja) | ワイヤボンディング装置および該装置を用いたワークタッチ検出方法 | |
| JP2627429B2 (ja) | 記録装置におけるペン昇降装置 | |
| JPS63136536A (ja) | ワイヤボンデイング方法 | |
| JP2940259B2 (ja) | ボンディング方法 | |
| JPH07151800A (ja) | 比抵抗測定装置 | |
| JP2007080970A (ja) | 部品実装装置 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |