JPH0428135B2 - - Google Patents

Info

Publication number
JPH0428135B2
JPH0428135B2 JP60077657A JP7765785A JPH0428135B2 JP H0428135 B2 JPH0428135 B2 JP H0428135B2 JP 60077657 A JP60077657 A JP 60077657A JP 7765785 A JP7765785 A JP 7765785A JP H0428135 B2 JPH0428135 B2 JP H0428135B2
Authority
JP
Japan
Prior art keywords
bonding
slide block
dead center
contact
capillary
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60077657A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61236132A (ja
Inventor
Akihiro Yamamoto
Yutaka Makino
Noryuki Inagaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP60077657A priority Critical patent/JPS61236132A/ja
Publication of JPS61236132A publication Critical patent/JPS61236132A/ja
Publication of JPH0428135B2 publication Critical patent/JPH0428135B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/071Connecting or disconnecting
    • H10W72/0711Apparatus therefor
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/071Connecting or disconnecting
    • H10W72/0711Apparatus therefor
    • H10W72/07141Means for applying energy, e.g. ovens or lasers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/071Connecting or disconnecting
    • H10W72/075Connecting or disconnecting of bond wires
    • H10W72/07521Aligning

Landscapes

  • Wire Bonding (AREA)
JP60077657A 1985-04-12 1985-04-12 ワイヤボンデイング装置におけるボンデイング方法 Granted JPS61236132A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60077657A JPS61236132A (ja) 1985-04-12 1985-04-12 ワイヤボンデイング装置におけるボンデイング方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60077657A JPS61236132A (ja) 1985-04-12 1985-04-12 ワイヤボンデイング装置におけるボンデイング方法

Publications (2)

Publication Number Publication Date
JPS61236132A JPS61236132A (ja) 1986-10-21
JPH0428135B2 true JPH0428135B2 (enExample) 1992-05-13

Family

ID=13639952

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60077657A Granted JPS61236132A (ja) 1985-04-12 1985-04-12 ワイヤボンデイング装置におけるボンデイング方法

Country Status (1)

Country Link
JP (1) JPS61236132A (enExample)

Also Published As

Publication number Publication date
JPS61236132A (ja) 1986-10-21

Similar Documents

Publication Publication Date Title
US4603802A (en) Variation and control of bond force
KR950000515B1 (ko) 탭테이프에의 반도체소자 접합방법 및 초음파 본딩장치
JP3094374B2 (ja) ワイヤボンダ用フレーム固定装置
JPH0428135B2 (enExample)
JPH02231736A (ja) ワイヤボンデイング方法
JP2558717B2 (ja) ワイヤボンディング装置
JP2578932B2 (ja) ダイボンディング装置
JPH01199443A (ja) ワイヤボンデイング装置
JP2001127097A (ja) ボンディング装置及びその制御方法
JPH0431179B2 (enExample)
JP2575066B2 (ja) 半導体組立装置
JP2602886B2 (ja) インナーリードボンディング装置及びインナーリードボンディング方法
JPH04317343A (ja) ボンデイング装置
JPS6229897B2 (enExample)
JP2523657B2 (ja) ワイヤボンディング方法
JP3625934B2 (ja) パラレルシーム接合方法及びパラレルシーム接合装置
JPH05131386A (ja) ダイハンドリング部コレツト上下機構
JP2676446B2 (ja) ワイヤボンディング方法
JP3189402B2 (ja) バンプ形成方法
JP2950724B2 (ja) ワイヤボンディング装置および該装置を用いたワークタッチ検出方法
JP2627429B2 (ja) 記録装置におけるペン昇降装置
JPS63136536A (ja) ワイヤボンデイング方法
JP2940259B2 (ja) ボンディング方法
JPH07151800A (ja) 比抵抗測定装置
JP2007080970A (ja) 部品実装装置

Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term