JPS61236132A - ワイヤボンデイング装置におけるボンデイング方法 - Google Patents

ワイヤボンデイング装置におけるボンデイング方法

Info

Publication number
JPS61236132A
JPS61236132A JP60077657A JP7765785A JPS61236132A JP S61236132 A JPS61236132 A JP S61236132A JP 60077657 A JP60077657 A JP 60077657A JP 7765785 A JP7765785 A JP 7765785A JP S61236132 A JPS61236132 A JP S61236132A
Authority
JP
Japan
Prior art keywords
slide block
bonding
dead center
contact
capillary
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60077657A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0428135B2 (enExample
Inventor
Akihiro Yamamoto
章博 山本
Yutaka Makino
豊 牧野
Noriyuki Inagaki
典之 稲垣
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP60077657A priority Critical patent/JPS61236132A/ja
Publication of JPS61236132A publication Critical patent/JPS61236132A/ja
Publication of JPH0428135B2 publication Critical patent/JPH0428135B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8512—Aligning
    • H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP60077657A 1985-04-12 1985-04-12 ワイヤボンデイング装置におけるボンデイング方法 Granted JPS61236132A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60077657A JPS61236132A (ja) 1985-04-12 1985-04-12 ワイヤボンデイング装置におけるボンデイング方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60077657A JPS61236132A (ja) 1985-04-12 1985-04-12 ワイヤボンデイング装置におけるボンデイング方法

Publications (2)

Publication Number Publication Date
JPS61236132A true JPS61236132A (ja) 1986-10-21
JPH0428135B2 JPH0428135B2 (enExample) 1992-05-13

Family

ID=13639952

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60077657A Granted JPS61236132A (ja) 1985-04-12 1985-04-12 ワイヤボンデイング装置におけるボンデイング方法

Country Status (1)

Country Link
JP (1) JPS61236132A (enExample)

Also Published As

Publication number Publication date
JPH0428135B2 (enExample) 1992-05-13

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term