JPH04277689A - Manufacture of printed wiring board - Google Patents

Abstract

PURPOSE:To prevent the positional divergence between an inspection pin to be positioned by a positioning hole and a minute pin and prevent the contact error of the inspection pin by removing the divergence between the position of the pad and the positioning hole. CONSTITUTION:Conductive layers are made on both sides of an insulating substrate 1, and wiring, a pad, and hole position patterns 11a, 11b, and 11c are provided. Next, positioning holes 13a, 13b, and 13c are provided according to the respective centers of the hole position patterns 11a, 11b, and 11c.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a printed wiring board, and more particularly to a method for manufacturing a printed wiring board having a high-density wiring pattern.

0002

2. Description of the Related Art In a conventional printed wiring board, as shown in FIG. 5(a), through holes 3 and positioning holes 4 are formed in a copper-clad laminate in which copper foil 2 is provided on both sides of an insulating substrate 1.

Next, as shown in FIG. 5(b), a conductive layer 5 is formed by plating a copper layer over the entire surface of the insulating substrate 1.

Next, as shown in FIGS. 5(c) and 5(d),
After selectively forming an etching resist layer on both sides of the conductive layer 5, the conductive layer 5 is etched using the etching resist layer as a mask.
, and the copper foil 2 to form the wiring 6, the etching resist layer is peeled off and the insulating substrate 1 is removed.
A solder resist layer was formed on desired portions of both sides of the printed wiring board.

FIG. 6 is a partially enlarged plan view for explaining a conventional printed wiring board.

As shown in FIG. 6, when the wiring pattern is misaligned with the through hole 3 and the positioning hole, the position of the pad 12 also becomes misaligned with the positioning hole.

[0007]

[Problems to be Solved by the Invention] In recent years, with the advancement of printed wiring board surface mounting technology and the miniaturization of mounted components, pads have become smaller and the pad pitch has become smaller. Current electrical inspection equipment for wiring patterns can correct positional deviations by pattern recognition only on the top surface, but on the bottom surface, inspection pins are placed based on the positioning holes, so the inspection pins and circuits are easily misaligned. The position of the pattern cannot be corrected, and as shown in FIG. 6, poor contact between the test pins 20 and especially the pads 12 is likely to occur, resulting in a problem that the efficiency of electrical testing of the wiring pattern is reduced.

[0008]

[Means for Solving the Problems] The method for manufacturing a printed wiring board of the present invention includes selectively forming through holes in a copper-clad laminate having copper foil provided on both sides of an insulating substrate, and plating the surface including the through holes. a step of forming a conductive layer by a method, a step of patterning the conductive layer to form a hole position pattern for forming wiring and positioning holes, and a step of forming a positioning hole in alignment with the center of the hole position pattern. It consists of:

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be explained with reference to the drawings.

1(a) to 1(d) and FIG. 2 are sectional views and plan views showing the steps of the first embodiment of the present invention.

First, as shown in FIG. 1(a), through holes 3 are selectively provided in a copper-clad laminate in which copper foils 2 are provided on both sides of an insulating substrate 1.

Next, as shown in FIG. 1B, a conductive layer 5 such as a copper layer is formed on the surface of the copper foil 2 including the side walls of the through holes 3 by plating.

Next, as shown in FIG. 1(c), an etching resist layer is formed and patterned on the surface of the conductive layer 5 on both sides of the copper-clad laminate, and the conductive layer 5 and the conductive layer 5 are patterned using the etching resist layer as a mask. After sequentially etching away the copper foil 2, the etching resist layer is peeled off and removed, as shown in FIG. 1(c).
Hole position pattern 11a for forming positioning holes as shown in FIG.
, 11b, 11c and wiring 6 are formed.

Next, as shown in FIG. 2, positioning holes 13a, 13b, 13c are formed by a hole punching machine with pattern recognition in alignment with the centers of the hole position patterns 11a, 11b, 11c.
are provided to constitute a printed wiring board.

FIG. 3 is a partially enlarged plan view for explaining the first embodiment of the present invention.

As shown in FIG. 3, even if the relative position of the through hole 3 and the wiring 6 are formed deviating from the design value, the positioning hole is formed to match the center of the hole position pattern, so the positioning is easy. Stable contact can be obtained by eliminating misalignment between the test pin 20 and the pad 12, the contact position of which is set by the hole.

FIG. 4 is a partially enlarged plan view showing a second embodiment of the present invention.

As shown in FIG. 4, after the hole position pattern 11a shown in FIG. 1(d) is formed by the same process as in the first embodiment, a solder resist film is selectively applied to the surface including the hole position pattern 11a. form 15. Here, the positional shift of the solder resist film 15 occurs and the hole position pattern 11a
is partially covered with the solder resist film 15, but by forming the positioning hole 13a at the center of the hole position pattern 11a in the part exposed from the solder resist film 15, both the wiring and the solder resist film 15 are covered. There is an advantage that a printed wiring board can be constructed that is corrected by taking into account the positional deviation.

[0019]

Effects of the Invention As explained above, the present invention processes the positioning holes on the printed wiring board based on the hole position pattern after the wiring pattern is formed, so even if there is a misalignment between the through hole and the wiring pattern, the wiring pattern's electrical This has the effect of eliminating misalignment between the test pins and pads during electrical testing, allowing stable contact to be obtained, and improving the reliability of electrical testing.

[Brief explanation of the drawing]

FIG. 1 is a sectional view and a plan view showing the order of steps for explaining a first embodiment of the present invention.

FIG. 2 is a sectional view and a plan view showing the order of steps for explaining the first embodiment of the present invention.

FIG. 3 is a partially enlarged plan view for explaining the first embodiment of the present invention.

FIG. 4 is a partially enlarged plan view for explaining a second embodiment of the present invention.

FIG. 5 is a cross-sectional view and a plan view showing the order of steps for explaining a conventional printed wiring board manufacturing method.

FIG. 6 is a partially enlarged plan view for explaining a conventional printed wiring board.

[Explanation of symbols]

1 Insulating substrate 2 Copper foil 3 Through hole 4 Positioning hole 5 Conductive layer 6 Wiring 11a, 11b, 11c Hole position pattern 12
Pads 13a, 13b, 13c Positioning holes 15
Solder resist film 20 Inspection pin position

Claims (1)

[Claims] 1. A step of selectively forming through holes in a copper-clad laminate in which copper foil is provided on both sides of an insulating substrate, and forming a conductive layer on the surface including the through holes by a plating method;
A printed wiring board comprising the steps of patterning the conductive layer to form a hole position pattern for forming wiring and positioning holes, and forming positioning holes in alignment with the center of the hole position pattern. Production method.