JPH0444292A - Printed wiring board and its manufacture - Google Patents

Printed wiring board and its manufacture

Info

Publication number
JPH0444292A
JPH0444292A JP14864190A JP14864190A JPH0444292A JP H0444292 A JPH0444292 A JP H0444292A JP 14864190 A JP14864190 A JP 14864190A JP 14864190 A JP14864190 A JP 14864190A JP H0444292 A JPH0444292 A JP H0444292A
Authority
JP
Japan
Prior art keywords
pad
wiring board
printed wiring
hole
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14864190A
Other languages
Japanese (ja)
Inventor
Akiyoshi Kadoya
角屋 明由
Yukihiro Taniguchi
幸弘 谷口
Ryozo Sato
良三 佐藤
Nobuo Hamaoka
浜岡 伸夫
Naoya Matsuzaki
松崎 直弥
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP14864190A priority Critical patent/JPH0444292A/en
Publication of JPH0444292A publication Critical patent/JPH0444292A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452Solder masks
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007Surface contacts, e.g. bumps
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42Plated through-holes or plated via connections
    • H05K3/425Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/428Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates having a metal pattern

Landscapes

  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE:To improve the reliability of connection by installing a spotting device with projected shape or recessed shape on a pad for mounting parts, thereby preventing from dislocation of packaging parts on the surface of a printed wiring board. CONSTITUTION:A prescribed mask pattern is formed with the use of a dry film, etc., and a land 2' for surface packaging is formed by applying selective etching. Then, a through-hole land 11 and a pad 2 are removed, and an epoxy solder resist 3 with chemical copper plating resistance if formed, by printing, on the zone etched in prior process and other circuit pattern. After that, a resist pattern 7, which has chemical copper plating resistance and capability to strip plating, is selectively formed with precision of less than + 30mum on the pad 2 in exposed condition as a frame surround ing the pad 2 by using exposure method. Next, a conductor 8 is formed in the recessed part 1 of the pad 2 and a through hole 9 by applying chemical copper plating with a coating thickness of 30 to 50mum. By eliminating the plated resist pattern 7 with solution for stripping, it is made possible to manufacture a printed wiring board incor porating a frame-type pad with a recessed part 1 measuring 50 to 120mum in width and 30 to 50mum in height in the pad 2. The height and width of the recessed part 1 shall be within the range from 10 to 200mum each.

Description

【発明の詳細な説明】 [産業上の利用分野コ 本発明は、表面実装部品搭載用プリント配Ii板および
その製造方法に関する。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a printed wiring board for mounting surface-mounted components and a method for manufacturing the same.

[従来の技術] 従来の表面実装部品搭載用プリント配線板におけるパッ
ドの形状は、例えば第10図に断面斜視図を示すように
平坦な形状となっていた。搭載部品の位置ずれを防止す
るために、パッド2間のソルダーレジスト3による隔絶
パターン12をパッドより高くするという手段や、図面
は省略するが基材1に凹部を設は搭載部品の本体を位置
決めする等の手段が用いられていた。
[Prior Art] The shape of a pad in a conventional printed wiring board for mounting surface-mounted components is flat, as shown in a cross-sectional perspective view in FIG. 10, for example. In order to prevent the position of the mounted components from shifting, there is a method of making the isolation pattern 12 formed by the solder resist 3 between the pads 2 higher than the pads, and, although not shown in the drawing, a recess is formed in the base material 1 to position the main body of the mounted component. Methods such as doing this were used.

なお、この種の表面実装部品搭載用プリント配線板に関
するものには例えば特開平1−217994号公報等を
挙げることができる。
For example, Japanese Patent Laid-Open No. 1-217994 can be cited as an example of a printed wiring board for mounting surface-mounted components of this type.

[発明が解決しようとする課題] 上記従来技術は、パッド間のソルダーレジストを高くす
るために、多数回塗布を行ったり、パッド間にパターン
を設けたりする必要があった。前者は工程が増加してし
まうという問題、後者は高密度化に対応しきれないとい
う問題があった。
[Problems to be Solved by the Invention] In the above-mentioned conventional technology, in order to increase the height of the solder resist between the pads, it was necessary to perform coating multiple times or provide a pattern between the pads. The former has the problem of increasing the number of steps, and the latter has the problem of not being able to cope with higher density.

さらには、ソルダーレジストをガイドとした場合にはガ
イドの位置がパッドより外側になってしまうため精度良
く位置決めできないという問題があった。
Furthermore, when a solder resist is used as a guide, there is a problem that accurate positioning cannot be performed because the guide is located outside the pad.

また、基材に凹部を設ける方法では、加工に多大な工程
数を要する、部品の本体とリードの精度を厳しくしない
と位置決めできない、リード曲がり等を吸収できない、
凹部に配線パターンを配置できないため高密度化に適し
ていない等の問題があった。
In addition, the method of forming recesses in the base material requires a large number of processing steps, cannot be positioned without strict precision between the main body of the component and the lead, and cannot absorb bending of the lead.
Since wiring patterns cannot be placed in the recessed portions, there are problems such as not being suitable for high density.

本発明の目的は、上記従来の問題点を解消することにあ
り、その第1の目的は表面実装部品の位置ずれを防止し
接続信頼性の高いプリント配線板を、そして第2の目的
はその製造方法を、それぞれ提供することにある。
The purpose of the present invention is to solve the above-mentioned conventional problems, and the first purpose is to provide a printed wiring board that prevents displacement of surface-mounted components and has high connection reliability. The objective is to provide manufacturing methods for each.

18題を解決するための手段] 上記本発明の第1の目的は、 (1)0部品搭載用パッドを備えた表面実装部品搭載用
プリント配線板であって、前記パッドに凹凸形状の位置
決め手段を配設して成るプリント配線板により、また (2)、上記パッドが、その周縁に連続した凸部を有し
、その内部主面が凹部を形成する額縁型パッドから成る
上記(1)記載のプリント配線板により、また、 (3)、上記パッドの凹部内壁面に粗面化して成る上記
(2)記載のプリント配線板により、また、(4)、上
記パッドが、その周縁に連続した凸部を形成し、その内
部主面が下地の絶縁基材が露出した無底部を形成する額
縁型パッドから成る上記(1)記載のプリント配線板に
より、また、(5)、上記パッドの凹部内に半田を充填
して成る上記(2)乃至(4)何れか記載のプリント配
線板により、また、 (6)、上記パッドの額縁を形成する凸部高さを10〜
200μm、幅10〜200μmとした額縁型パッドと
した上記(1)乃至(5)何れか記載のプリント配線板
により、そしてまた、 (7)、上記パッド凹部内壁面の粗面化の程度を5〜3
0μmの凹凸として成る上記(3)記載のプリント配線
板により、達成される。
Means for Solving Problem 18] The first object of the present invention is (1) a printed wiring board for mounting surface mount components, which is provided with a pad for mounting zero components, the pad having a positioning means having an uneven shape; (2) The above pad is a frame-shaped pad having a continuous convex portion on its periphery and a concave portion formed on its inner principal surface, according to (1) above. (3) The printed wiring board according to (2) above, in which the inner wall surface of the concave portion of the pad is roughened, and (4) The pad has a continuous peripheral edge. By the printed wiring board according to (1) above, which comprises a picture frame-type pad which forms a convex part and whose inner main surface forms a bottomless part where an underlying insulating base material is exposed, and (5), a concave part of the pad. The printed wiring board according to any one of (2) to (4) above is filled with solder, and (6) the height of the convex portion forming the frame of the pad is 10 to 10.
By using the printed wiring board according to any one of (1) to (5) above, which is a frame-shaped pad having a width of 200 μm and a width of 10 to 200 μm, and (7), the degree of roughening of the inner wall surface of the pad recess is 5. ~3
This is achieved by the printed wiring board described in (3) above, which has concavities and convexities of 0 μm.

上記本発明の第2の目的は、 (8)0両面鋼張り絶縁基板の所定位置にスルーホール
を形成する工程と、前記スルーホール内を含みめっき用
触媒を付与する工程と、前記スルーホール内に付与され
た触媒を保持した状態で前記スルーホールの開口部にラ
ンドを残し、部品搭載パッドとそれに接続された導体回
路パターンを所定のマスクを介してエツチングにより形
成する工程と、少なくとも前記スルーホールランドとパ
ッド上を除き基板上にソルダーレジストからなる絶縁層
を印刷形成する工程と、前記パッドの周縁を露出した状
態でその主面にレジストマスクを形成する工程と、無電
解銅めっき処理により前記パッドの周縁とスルーホール
内に銅を析出せしめ、めっき導体層を形成し前記パッド
の周縁にめっき導体層からなる凸部を形成する工程と、
前記レジストマスクを除去する工程とを有して成る上記
(1)もしくは(2)記載のプリント配線板の製造方法
により、そしてまた、 (9)、上記両面網張り絶縁基板の所定位置にスルーホ
ールを形成する工程と、前記スルーホール内を含みめっ
き用触媒を付与する工程と、前記スルーホール内に付与
された触媒を保持した状態で前記スルーホールの開口部
にランドを残し、部品搭載の額縁型無底部を有するパッ
ドとそれに接続された導体回路パターンを所定のマスク
を介してエツチングにより形成する工程と、少なくとも
前記スルーホールランドとパッド領域上を除き基板上に
ソルダーレジストからなる絶縁層を印刷形成する工程と
、無電解銅めっき処理により前記パッドとスルーホール
内に銅を析出せしめ、めっき導体層を形成する工程とを
有して成る上記(4)記載のプリント配線板の製造方法
により、達成される。
The second object of the present invention is to: (8) form a through hole at a predetermined position of a double-sided steel-clad insulating substrate; a step of applying a plating catalyst including the inside of the through hole; and a step of applying a plating catalyst to the inside of the through hole. a step of forming a component mounting pad and a conductor circuit pattern connected thereto by etching through a predetermined mask, leaving a land at the opening of the through hole while holding a catalyst applied to the through hole; A step of printing an insulating layer made of solder resist on the substrate except on the lands and pads, a step of forming a resist mask on the main surface with the periphery of the pad exposed, and an electroless copper plating process. depositing copper on the periphery of the pad and in the through hole to form a plated conductor layer, and forming a convex portion made of the plated conductor layer on the periphery of the pad;
By the method for manufacturing a printed wiring board according to (1) or (2) above, which comprises the step of removing the resist mask, and (9) forming through holes at predetermined positions in the double-sided mesh insulating substrate. a step of applying a plating catalyst including the inside of the through hole, and a step of forming a picture frame on which parts are mounted by leaving a land at the opening of the through hole while holding the catalyst applied in the through hole. A step of forming a pad having a bottomless part of the mold and a conductive circuit pattern connected thereto by etching through a predetermined mask, and printing an insulating layer made of solder resist on the substrate except at least on the through hole land and the pad area. By the method for producing a printed wiring board according to (4) above, the method includes the steps of: achieved.

[作用コ 表面実装用パッドに設けた凹凸は搭載する部品リードの
ガイドとなり、部品の位置ずれを防止できるのでこれに
よる接続不良を防止することができる6パツドの凹部に
、はんだペーストをすり切れに充填することにより、は
んだの供給量を一定化できるので、はんだの可不足によ
るはんだブリッジ、はんだ未接続等を防止でき接続信頼
性を向上できる。
[Operation: The concavities and convexities provided on the surface mounting pads act as guides for the component leads to be mounted, and prevent component misalignment, thereby preventing connection failures.6 The concave portions of the pads serve as guides for the component leads to be mounted, and this prevents connection failures. By filling, the amount of solder supplied can be made constant, so it is possible to prevent solder bridging, unconnected solder, etc. due to insufficient solder, and improve connection reliability.

また、パッドの表面に微小な凹凸を設けることにより、
はんだの接触面積を増加させることができるので、はん
だの接着力が向上し接続信頼性を向上できる。
In addition, by providing minute irregularities on the surface of the pad,
Since the contact area of the solder can be increased, the adhesive strength of the solder can be improved and the connection reliability can be improved.

[実施例コ 以下1本発明の一実施例を図面を用いて説明する。[Example code] An embodiment of the present invention will be described below with reference to the drawings.

実施例1゜ 第1図は、本発明による表面実装部品搭載用プリント配
線板におけるパッド周辺部の平面図を示したものである
Embodiment 1 FIG. 1 is a plan view of the area around a pad in a printed wiring board for mounting surface mount components according to the present invention.

そして第2図は第1図の1−1断面図である。FIG. 2 is a sectional view taken along line 1-1 of FIG.

この例では輻0.6〜0.65m+の表面実装用パッド
2において、パッド2の周囲には幅50〜120μm。
In this example, in the surface mounting pad 2 with a radius of 0.6 to 0.65 m+, the width around the pad 2 is 50 to 120 μm.

高さ30〜50μmの凸部1を形成し、底部20を有す
る額縁型パッドとした。また、凸部1の外周には、ソル
ダーレジスト3を形成した。
A frame-shaped pad was formed with a convex portion 1 having a height of 30 to 50 μm and having a bottom portion 20. Further, a solder resist 3 was formed on the outer periphery of the convex portion 1.

第3図は、このプリント配線板に表面実装部品を搭載し
、そのリード4をパッド2にはんだ付け5した後の断面
図を示したものである。
FIG. 3 shows a cross-sectional view after surface mount components are mounted on this printed wiring board and the leads 4 are soldered 5 to the pads 2.

この部品のリード4は、凸部1をガイドとしてパッドの
外側に出ることはないので位置ずれを防止することがで
きた。また、リード曲がり等を矯正した状態ではんだ付
けを行うこともできた。
Since the leads 4 of this component do not come out of the pad using the convex portion 1 as a guide, positional shift can be prevented. Furthermore, soldering could be performed with lead bends and the like corrected.

以上により正常なフィレット形状をしたけんだ5を形成
でき、位置ずれによる接続不良を著しく低減することが
できた。
As a result of the above, it was possible to form the fold 5 having a normal fillet shape, and to significantly reduce connection failures due to positional deviations.

なお、この例のプリント配線板の製造方法については、
後の実施例3にて詳述する。
Regarding the manufacturing method of the printed wiring board in this example,
This will be explained in detail later in Example 3.

実施例2゜ 次に第2の実施例の断面図を第4図に示す。Example 2゜ Next, a sectional view of the second embodiment is shown in FIG.

なお、この図は前記実施例1の第3図に対応するもので
あるが、第3図ではパッド2に底部20を有していたが
、この第4図においては底部20が無く、絶縁基材6が
露呂している。
Note that this figure corresponds to FIG. 3 of the first embodiment, but in FIG. 3, the pad 2 had a bottom 20, but in this FIG. Material 6 is exposed.

つまり本実施例は表面実装パッド2を凸部1のみで額縁
状に構成したもので実施例1と同様の効果が得られた。
In other words, in this example, the surface mount pad 2 was constructed in a frame shape with only the convex portion 1, and the same effect as in Example 1 was obtained.

実施例3゜ 次に第5図に示した工程図を用いて実施例1の製造方法
を説明する。
Example 3 Next, the manufacturing method of Example 1 will be explained using the process diagram shown in FIG.

第5図(a)に示すように、絶縁基材6と銅箔2′から
なる両面銅張積層板に所定のスルーホール9を設け、穴
内に無電解銅めっき用の触媒付与を行った。
As shown in FIG. 5(a), a predetermined through hole 9 was provided in a double-sided copper-clad laminate consisting of an insulating base material 6 and a copper foil 2', and a catalyst for electroless copper plating was applied inside the hole.

次に第5図(b)に示すように、ドライフィルム等を用
いて所定のマスクパターンを形成し、選択エツチングを
行い表面実装用ランド2を形成した。
Next, as shown in FIG. 5(b), a predetermined mask pattern was formed using a dry film or the like, and selective etching was performed to form lands 2 for surface mounting.

次に第5図(C)に示すように、スルーホールランド】
1とパッド2とを除き前記工程でエツチングされた領域
及びその他の回路パターン上に耐化学銅めっき性を有す
るエポキシ系のソルダーレジスト3を印刷法等の手段に
より形成した。
Next, as shown in Figure 5 (C), the through-hole land]
An epoxy-based solder resist 3 having resistance to chemical copper plating was formed by a printing method or the like on the area etched in the above process and other circuit patterns except for the pads 1 and 2.

なお、この際、パッド2の外周には所定の溝10を設け
てソルダーレジスト3を形成したが、この溝は必ずしも
必要なものでない。印刷時にパッド2上にレジスト3が
載らないようにすることが重要で、そのために裕度を持
たせた印刷パターンとした結果この溝は生じたものであ
る。
Note that, at this time, although a predetermined groove 10 was provided on the outer periphery of the pad 2 to form the solder resist 3, this groove is not necessarily necessary. It is important to prevent the resist 3 from being placed on the pad 2 during printing, and this groove was created as a result of creating a printing pattern with a margin for this purpose.

その後に、第5図(d)に示すように、耐化学銅めっき
性を有し、めっき後に剥離可能なめっきレジストパター
ン7を露光法を用いて±30μm以下の精度でパッド2
の上にその周囲を額縁状に露出させた状態で選択的に形
成した。
Thereafter, as shown in FIG. 5(d), a plating resist pattern 7 that is resistant to chemical copper plating and can be peeled off after plating is applied to the pad 2 using an exposure method with an accuracy of ±30 μm or less.
It was selectively formed on top of the frame with its periphery exposed like a picture frame.

このように精度よく連続した縁を形成することが重要で
あり、これを越えた場合は、凸部を片側にしか形成でき
なかった。
It is important to form a continuous edge with such precision; if this is exceeded, the convex portion can only be formed on one side.

次に第5図(e)に示すように、化学銅めっきを30〜
50μm施すことによりパッド2の凸部1およびスルー
ホール9内に導体8を形成した。
Next, as shown in Figure 5(e), chemical copper plating is applied to
A conductor 8 was formed within the convex portion 1 of the pad 2 and the through hole 9 by applying a thickness of 50 μm.

最後に第5図(f)に示すように、第5図(d)で設け
ためっきレジスト7を剥離液(例えば塩化メチレン)で
除去することによりパッド2に幅50〜120μm、高
さ30〜50μmの凸部を有する額縁型パッドを有する
プリント配線板を製造した。
Finally, as shown in FIG. 5F, the plating resist 7 provided in FIG. A printed wiring board having a frame-shaped pad having a convex portion of 50 μm was manufactured.

この製造方法によれば容易に凸部1を形成することがで
きる。
According to this manufacturing method, the convex portion 1 can be easily formed.

なお、前記実施例2の第4図に示したパッド2の形成方
法について詳細説明は省略するが、第5図(b)のエツ
チング処理時にパッド2のパターン形状を第5図(d)
のレジスト7相当部分がエツチングされて額縁状の底空
きの状態とすればよい。
Although a detailed explanation of the method for forming the pad 2 shown in FIG. 4 of Example 2 will be omitted, the pattern shape of the pad 2 was changed as shown in FIG. 5(d) during the etching process shown in FIG. 5(b).
The portion corresponding to the resist 7 may be etched to form a picture frame-like empty bottom.

実施例4゜ 次に第4の実施例を第6図、第7図を用いて説明する。Example 4゜ Next, a fourth embodiment will be explained using FIGS. 6 and 7.

第6図は、表面実装用バンド2の凹部表面に研磨等の手
段を用いて5μm程度の凹凸を形成した平面図である。
FIG. 6 is a plan view of the concave surface of the surface mounting band 2 in which irregularities of about 5 μm are formed using means such as polishing.

第7図は、これに部品のり一ド4をはんだ付け5した後
の■−■線断面図である。
FIG. 7 is a cross-sectional view taken along the line ■--■ after the component glue 4 has been soldered 5 thereto.

はんだ5とパッド2の接触面積が増大しているため接着
力が実施例1より約1.5倍向上した。これにより接続
信頼性を向上させることができた。
Since the contact area between the solder 5 and the pad 2 was increased, the adhesive strength was improved by about 1.5 times compared to Example 1. This made it possible to improve connection reliability.

実施例5゜ 次に第5の実施例を第8図を用いて説明する。Example 5゜ Next, a fifth embodiment will be explained using FIG. 8.

実施例1で述べたものと同一形状のパッド2において、
はんだペースト5を凸部1と平坦になるように凹部平坦
部20に充填した。これによりはんだペースト5の供給
量は常に均一化できた。従来のスクリーン印刷法では基
板表面の突起等に大きく左右されていたが、本実施例で
は影響されないのではんだ過不足による不良を著しく低
減できた。
In the pad 2 having the same shape as that described in Example 1,
Solder paste 5 was filled into the flat part 20 of the concave part so as to be flush with the convex part 1. As a result, the amount of solder paste 5 supplied could always be made uniform. Conventional screen printing methods are largely affected by protrusions on the surface of the substrate, but in this embodiment, defects due to excess or deficiency of solder can be significantly reduced since this is not affected.

なお、実施例2の第4図についても同様で、ここでは図
面を省略するがバンド2の凹部にはんだペースト5を充
填することにより実施例5と同様の結果を得ることがで
きる。
The same applies to FIG. 4 of Example 2, and although the drawing is omitted here, the same result as Example 5 can be obtained by filling the recessed portion of band 2 with solder paste 5.

実施例6゜ 次に第6の実施例について第9図の断面図を用いて説明
する。表面実装部品のり一ド4に凹部を、パッド2に凸
部1を設は両者がかみ合う構造とした。これにより位置
ずれ防止効果をさらに向上させることができた。
Embodiment 6 Next, a sixth embodiment will be explained using the sectional view of FIG. 9. A concave portion is provided on the surface mount component glue 4, and a convex portion 1 is provided on the pad 2, so that the two engage with each other. This made it possible to further improve the positional shift prevention effect.

部品リード4にも凹凸を設け、パッド2の凹凸とかみ合
わせることにより位置ずれ防止の効果を向上させること
ができる。
By providing unevenness on the component lead 4 and interlocking with the unevenness on the pad 2, the effect of preventing misalignment can be improved.

[発明の効果コ 本発明によれば、部品の位置ずれを著しく防止できるの
でそれに起因する接続不良を飛躍的に低減することがで
きる。
[Effects of the Invention] According to the present invention, misalignment of components can be significantly prevented, and connection failures caused by this can be dramatically reduced.

また、パッドの四部表面を粗面化することにより、はん
だの接着力を従来の約1.5倍まで向上できるので接続
信頼性を著しく向上させることができる。
Further, by roughening the surfaces of the four parts of the pad, the solder adhesion strength can be improved to about 1.5 times that of the conventional one, so that connection reliability can be significantly improved.

さらにまた、パッドの凹部にはんだペーストを予め充填
しておくことにより、その供給量を均一化できるのでは
んだブリッジやはんだ未接続等のペーストの過不足に起
因する接続不良を著しく低減することができる。
Furthermore, by filling the concave portions of the pads with solder paste in advance, the amount of solder paste supplied can be made uniform, which can significantly reduce connection failures caused by too much or too little paste, such as solder bridges and unsoldered connections. .

また1部品リードとパッドとのかみ合わせ構造とするこ
とにより位置ずれを一層防止することができる。
Furthermore, by using a structure in which one component lead and a pad are interlocked, positional displacement can be further prevented.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明プリント回路板の一実施例を示す平面図
、第2図は第1図のI−1線断面図、第3図は部品リー
ドをはんだ付けした状態を示す断面図、第4図は本発明
の他の一実施例を示す同しく部品リードをはんだ付けし
た状態を示す断面図。 第5図は本発明プリント回路板の一製造工程例を示す工
程断面図、第6図はパッド凹部表面を粗面化したさらに
異なる実施例の平面図、第7図は第6図の■−■線断面
図で部品搭載接続後の断面図。 第8図はパッドの凹部にはんだペーストを充填した一実
施例を示す断面図、第9図はバットと部品リードに噛み
合わせ構造を持たせた他の実施例となる断面図、そして
第10図は従来の面付は実装プリント板の断面斜視図で
ある。 〈符号の説明〉 1・・・パッドの凹凸部、 2・・・表面実装用パッド、 2′・・・銅箔、 3・・・ソルダーレジスト、 4・・一部品リード、 5・・・はんだ、 6・・・#!縁縁材材 7・・・レジストマスク、 8・・・銅めっき、 9・・スルーホール、 10・・溝、 11・・スルーホールランド、 2o・・・底部6
FIG. 1 is a plan view showing an embodiment of the printed circuit board of the present invention, FIG. 2 is a sectional view taken along line I-1 in FIG. FIG. 4 is a sectional view showing another embodiment of the present invention, also showing a state in which component leads are soldered. FIG. 5 is a process cross-sectional view showing an example of the manufacturing process of the printed circuit board of the present invention, FIG. 6 is a plan view of yet another embodiment in which the surface of the pad recess is roughened, and FIG. 7 is a - ■A line cross-sectional view after parts are mounted and connected. FIG. 8 is a sectional view showing an embodiment in which the concave portion of the pad is filled with solder paste, FIG. 9 is a sectional view showing another embodiment in which the butt and component lead have an interlocking structure, and FIG. 10 is a cross-sectional perspective view of a conventional imprinted printed circuit board. <Explanation of symbols> 1... Pad unevenness, 2... Surface mounting pad, 2'... Copper foil, 3... Solder resist, 4... One component lead, 5... Solder , 6...#! Edge material 7...Resist mask, 8...Copper plating, 9...Through hole, 10...Groove, 11...Through hole land, 2o...Bottom 6

Claims (9)

【特許請求の範囲】[Claims] 1.部品搭載用パッドを備えた表面実装部品搭載用プリ
ント配線板であって、前記パッドに凹凸形状の位置決め
手段を配設して成るプリント配線板。
1. 1. A printed wiring board for mounting surface-mounted components, which is equipped with pads for mounting components, the printed wiring board comprising positioning means having an uneven shape arranged on the pads.
2.上記パッドが、その周縁に連続した凸部を有し、そ
の内部主面が凹部を形成する額縁型パッドから成る請求
項1記載のプリント配線板。
2. 2. The printed wiring board according to claim 1, wherein the pad is a frame-shaped pad having a continuous convex portion on its periphery and a concave portion formed on its inner principal surface.
3.上記パッドの凹部内壁面を粗面化して成る請求項2
記載のプリント配線板。
3. Claim 2, wherein the inner wall surface of the recess of the pad is roughened.
The printed wiring board described.
4.上記パッドが、その周縁に連続した凸部を形成し、
その内部主面が下地の絶縁基材が露出した無底部を形成
する額縁型パッドから成る請求項1記載のプリント配線
板。
4. The pad forms a continuous convex portion on its periphery,
2. The printed wiring board according to claim 1, wherein the internal principal surface comprises a frame-shaped pad forming a bottomless portion with an underlying insulating base material exposed.
5.上記パッドの凹部内に半田を充填して成る請求項2
乃至4何れか記載のプリント配線板。
5. Claim 2, wherein the concave portion of the pad is filled with solder.
4. The printed wiring board according to any one of 4 to 4.
6.上記パッドの額縁を形成する凸部高さを10〜20
0μm、幅10〜200μmとした額縁型パッドとした
請求項1乃至5何れか記載のプリント配線板。
6. The height of the convex part forming the frame of the above pad is 10 to 20
6. The printed wiring board according to claim 1, wherein the printed wiring board is a frame-shaped pad having a width of 0 .mu.m and a width of 10 to 200 .mu.m.
7.上記パッド凹部内壁面の粗面化の程度を5〜30μ
mの凹凸として成る請求項3記載のプリント配線板。
7. The degree of roughening of the inner wall surface of the pad recess is 5 to 30 μm.
4. The printed wiring board according to claim 3, wherein the printed wiring board has an unevenness of m.
8.両面銅張り絶縁基板の所定位置にスルーホールを形
成する工程と、前記スルーホール内を含みめっき用触媒
を付与する工程と、前記スルーホール内に付与された触
媒を保持した状態で前記スルーホールの開口部にランド
を残し、部品搭載パッドとそれに接続された導体回路パ
ターンを所定のマスクを介してエッチングにより形成す
る工程と、少なくとも前記スルーホールランドとパッド
上を除き基板上にソルダーレジストからなる絶縁層を印
刷形成する工程と、前記パッドの周縁を露出した状態で
その主面にレジストマスクを形成する工程と、無電解銅
めっき処理により前記パッドの周縁とスルーホール内に
銅を析出せしめ、めっき導体層を形成し前記パッドの周
縁にめっき導体層からなる凸部を形成する工程と、前記
レジストマスクを除去する工程とを有して成る請求項1
もしくは2記載のプリント配線板の製造方法。
8. A step of forming a through hole at a predetermined position of a double-sided copper-clad insulating substrate, a step of applying a plating catalyst including the inside of the through hole, and a step of applying a plating catalyst to the through hole while holding the catalyst applied in the through hole. A process of leaving a land in the opening and forming a component mounting pad and a conductive circuit pattern connected thereto by etching through a predetermined mask, and an insulation made of solder resist on the board except at least on the through-hole land and the pad. a step of printing a layer, a step of forming a resist mask on the main surface with the periphery of the pad exposed, and a step of depositing copper on the periphery of the pad and in the through hole by electroless copper plating, and plating. Claim 1 comprising the steps of forming a conductor layer and forming a convex portion made of a plated conductor layer around the periphery of the pad, and removing the resist mask.
Or the method for manufacturing a printed wiring board according to 2.
9.上記両面銅張り絶縁基板の所定位置にスルーホール
を形成する工程と、前記スルーホール内を含みめっき用
触媒を付与する工程と、前記スルーホール内に付与され
た触媒を保持した状態で前記スルーホールの開口部にラ
ンドを残し、部品搭載の額縁型無底部を有するパッドと
それに接続された導体回路パターンを所定のマスクを介
してエッチングにより形成する工程と、少なくとも前記
スルーホールランドとパッド領域上を除き基板上にソル
ダーレジストからなる絶縁層を印刷形成する工程と、無
電解銅めっき処理により前記パッドとスルーホール内に
銅を析出せしめ、めっき導体層を形成する工程とを有し
て成る請求項4記載のプリント配線板の製造方法。
9. a step of forming a through hole at a predetermined position of the double-sided copper-clad insulating substrate; a step of applying a plating catalyst including the inside of the through hole; and a step of applying a plating catalyst to the inside of the through hole; a step of leaving a land in the opening of the through hole and forming a pad having a frame-shaped bottomless part on which the component is mounted and a conductor circuit pattern connected thereto by etching through a predetermined mask; Claim comprising the steps of: printing an insulating layer made of solder resist on the substrate, and depositing copper in the pads and through holes by electroless copper plating to form a plated conductor layer. 4. The method for manufacturing a printed wiring board according to 4.
JP14864190A 1990-06-08 1990-06-08 Printed wiring board and its manufacture Pending JPH0444292A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14864190A JPH0444292A (en) 1990-06-08 1990-06-08 Printed wiring board and its manufacture

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14864190A JPH0444292A (en) 1990-06-08 1990-06-08 Printed wiring board and its manufacture

Publications (1)

Publication Number Publication Date
JPH0444292A true JPH0444292A (en) 1992-02-14

Family

ID=15457340

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14864190A Pending JPH0444292A (en) 1990-06-08 1990-06-08 Printed wiring board and its manufacture

Country Status (1)

Country Link
JP (1) JPH0444292A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09148721A (en) * 1995-11-21 1997-06-06 Kofu Nippon Denki Kk Pad for surface mounting component
US6985335B2 (en) 2001-10-11 2006-01-10 Hitachi Global Storage Technologies Netherlands B.V. Integrated lead suspension and method of construction

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09148721A (en) * 1995-11-21 1997-06-06 Kofu Nippon Denki Kk Pad for surface mounting component
US6985335B2 (en) 2001-10-11 2006-01-10 Hitachi Global Storage Technologies Netherlands B.V. Integrated lead suspension and method of construction
US6989969B2 (en) 2001-10-11 2006-01-24 Hitachi Global Storage Technologies Netherlands B.V. Integrated lead suspension and method of construction
US7137189B2 (en) 2001-10-11 2006-11-21 Hitachi Global Storage Technologies Netherlands B.V. Method of constructing an integrated lead suspension
US7137188B2 (en) 2001-10-11 2006-11-21 Hitachi Global Storage Technologies Netherlands B.V. Method of constructing an integrated lead suspension
US7168154B2 (en) 2001-10-11 2007-01-30 Hitachi Global Storage Technologies Netherlands Bv Method of constructing an integrated lead suspension

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