JPH0427683B2 - - Google Patents
Info
- Publication number
- JPH0427683B2 JPH0427683B2 JP58005184A JP518483A JPH0427683B2 JP H0427683 B2 JPH0427683 B2 JP H0427683B2 JP 58005184 A JP58005184 A JP 58005184A JP 518483 A JP518483 A JP 518483A JP H0427683 B2 JPH0427683 B2 JP H0427683B2
- Authority
- JP
- Japan
- Prior art keywords
- light
- mark
- wafer
- mask
- alignment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000003287 optical effect Effects 0.000 claims description 84
- 230000004907 flux Effects 0.000 claims description 30
- 230000010287 polarization Effects 0.000 claims description 15
- 238000012937 correction Methods 0.000 claims description 6
- 230000015572 biosynthetic process Effects 0.000 claims description 5
- 238000000926 separation method Methods 0.000 claims description 3
- 230000001427 coherent effect Effects 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 28
- 238000001514 detection method Methods 0.000 description 27
- 238000000034 method Methods 0.000 description 10
- 239000013256 coordination polymer Substances 0.000 description 6
- 239000011521 glass Substances 0.000 description 5
- 210000001747 pupil Anatomy 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 239000005357 flat glass Substances 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 230000010355 oscillation Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000002123 temporal effect Effects 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
- G03F9/7023—Aligning or positioning in direction perpendicular to substrate surface
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Control Of Position Or Direction (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58005184A JPS59132126A (ja) | 1983-01-18 | 1983-01-18 | 位置合わせ装置 |
| US06/570,189 US4636626A (en) | 1983-01-14 | 1984-01-12 | Apparatus for aligning mask and wafer used in semiconductor circuit element fabrication |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58005184A JPS59132126A (ja) | 1983-01-18 | 1983-01-18 | 位置合わせ装置 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1234596A Division JPH02191314A (ja) | 1989-09-12 | 1989-09-12 | パターン検出装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59132126A JPS59132126A (ja) | 1984-07-30 |
| JPH0427683B2 true JPH0427683B2 (enrdf_load_stackoverflow) | 1992-05-12 |
Family
ID=11604142
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58005184A Granted JPS59132126A (ja) | 1983-01-14 | 1983-01-18 | 位置合わせ装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59132126A (enrdf_load_stackoverflow) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6262519A (ja) * | 1985-09-13 | 1987-03-19 | Canon Inc | 位置検出装置 |
-
1983
- 1983-01-18 JP JP58005184A patent/JPS59132126A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59132126A (ja) | 1984-07-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4636626A (en) | Apparatus for aligning mask and wafer used in semiconductor circuit element fabrication | |
| US5151750A (en) | Alignment apparatus | |
| US5004348A (en) | Alignment device | |
| JPH06188176A (ja) | ギャップ制御装置及びギャップ制御方法 | |
| JPH08167559A (ja) | アライメント方法及び装置 | |
| WO1998057362A1 (fr) | Capteur et procede servant a detecter la position de la surface d'un objet, dispositif d'alignement comportant ce capteur et procede servant a fabriquer ce dispositif d'alignement et procede servant a fabriquer des dispositifs au moyen de ce dispositif d'alignement | |
| JPH0455243B2 (enrdf_load_stackoverflow) | ||
| JPH05243118A (ja) | 位置検出方法及びそれを用いた位置検出装置 | |
| JPH05291110A (ja) | アライメントマーク検出方法及びアライメントマーク検出装置 | |
| JPH0429213B2 (enrdf_load_stackoverflow) | ||
| JP2906433B2 (ja) | 投影露光装置及び投影露光方法 | |
| JPH0427683B2 (enrdf_load_stackoverflow) | ||
| JP2808595B2 (ja) | 位置検出装置及び該装置を用いた投影露光装置 | |
| JPH02272305A (ja) | 位置合わせ装置及び位置合わせ方法 | |
| JP3199042B2 (ja) | 半導体装置の製造方法及び露光方法 | |
| JP7684163B2 (ja) | 計測装置 | |
| JPH07283110A (ja) | 走査露光装置 | |
| JPH09138110A (ja) | 回折格子を用いた位置合わせ方法およびその装置 | |
| JPS59132125A (ja) | 位置合わせ装置 | |
| JP2814521B2 (ja) | 位置検出装置 | |
| US4685805A (en) | Small gap measuring apparatus | |
| JPH11121351A (ja) | 焦点位置検出装置のビーム調整法 | |
| JPH0581358B2 (enrdf_load_stackoverflow) | ||
| JPH1126359A (ja) | 面位置検出装置、該装置を備えた露光装置、及び該装置を用いたデバイスの製造方法 | |
| JPH0469508A (ja) | 非接触式形状測定装置及び形状測定法 |