JPH0427171Y2 - - Google Patents
Info
- Publication number
- JPH0427171Y2 JPH0427171Y2 JP12232287U JP12232287U JPH0427171Y2 JP H0427171 Y2 JPH0427171 Y2 JP H0427171Y2 JP 12232287 U JP12232287 U JP 12232287U JP 12232287 U JP12232287 U JP 12232287U JP H0427171 Y2 JPH0427171 Y2 JP H0427171Y2
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- hybrid integrated
- lead
- terminal pins
- terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005452 bending Methods 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 3
- 239000004020 conductor Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12232287U JPH0427171Y2 (fr) | 1987-08-10 | 1987-08-10 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12232287U JPH0427171Y2 (fr) | 1987-08-10 | 1987-08-10 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6426854U JPS6426854U (fr) | 1989-02-15 |
JPH0427171Y2 true JPH0427171Y2 (fr) | 1992-06-30 |
Family
ID=31370143
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12232287U Expired JPH0427171Y2 (fr) | 1987-08-10 | 1987-08-10 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0427171Y2 (fr) |
-
1987
- 1987-08-10 JP JP12232287U patent/JPH0427171Y2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS6426854U (fr) | 1989-02-15 |
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