JPH0426546B2 - - Google Patents

Info

Publication number
JPH0426546B2
JPH0426546B2 JP60128729A JP12872985A JPH0426546B2 JP H0426546 B2 JPH0426546 B2 JP H0426546B2 JP 60128729 A JP60128729 A JP 60128729A JP 12872985 A JP12872985 A JP 12872985A JP H0426546 B2 JPH0426546 B2 JP H0426546B2
Authority
JP
Japan
Prior art keywords
inner lead
bump
electrode
bonding
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60128729A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61287138A (ja
Inventor
Yoshifumi Kitayama
Yukio Maeda
Yoshio Tsunesumi
Tsutomu Tsunoda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP60128729A priority Critical patent/JPS61287138A/ja
Publication of JPS61287138A publication Critical patent/JPS61287138A/ja
Publication of JPH0426546B2 publication Critical patent/JPH0426546B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/072—
    • H10W72/07236—
    • H10W72/701—

Landscapes

  • Wire Bonding (AREA)
JP60128729A 1985-06-13 1985-06-13 半導体装置 Granted JPS61287138A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60128729A JPS61287138A (ja) 1985-06-13 1985-06-13 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60128729A JPS61287138A (ja) 1985-06-13 1985-06-13 半導体装置

Publications (2)

Publication Number Publication Date
JPS61287138A JPS61287138A (ja) 1986-12-17
JPH0426546B2 true JPH0426546B2 (cg-RX-API-DMAC10.html) 1992-05-07

Family

ID=14992003

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60128729A Granted JPS61287138A (ja) 1985-06-13 1985-06-13 半導体装置

Country Status (1)

Country Link
JP (1) JPS61287138A (cg-RX-API-DMAC10.html)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3829538A1 (de) * 1988-08-31 1990-03-08 Siemens Ag Verfahren zum verbinden eines halbleiterchips mit einem substrat
US5504375A (en) * 1992-03-02 1996-04-02 International Business Machines Corporation Asymmetric studs and connecting lines to minimize stress

Also Published As

Publication number Publication date
JPS61287138A (ja) 1986-12-17

Similar Documents

Publication Publication Date Title
JPH11176887A (ja) 半導体装置およびその製造方法
JP2004056138A (ja) パッケージ組立体においてリードフレームを接合する方法、チップ積層パッケージの製造方法及びチップ積層パッケージ
JP2980495B2 (ja) 半導体装置の製造方法
JPH0426546B2 (cg-RX-API-DMAC10.html)
JP2000277557A (ja) 半導体装置
JP3129272B2 (ja) 半導体装置とその製造装置および製造方法
JPH06333974A (ja) 集積回路のボンディングパッド構造
JPH02237119A (ja) バンプ電極形成方法
JPH05267385A (ja) ワイヤーボンディング装置
JPH09293752A (ja) 基板接続構造
JP2005101165A (ja) フリップチップ実装構造及びその実装用基板及び製造方法
JP2000307016A (ja) 半導体装置、半導体モジュール及びその製造方法
JP2005197488A (ja) 突起電極及びボンディングキャピラリ並びに半導体チップ
JP2655458B2 (ja) Ｔａｂ型半導体装置
JPH0428241A (ja) 半導体装置の製造方法
JPS63107154A (ja) 樹脂封止型半導体装置
JP3389712B2 (ja) Ｉｃチップのバンプ形成方法
JPH0310670Y2 (cg-RX-API-DMAC10.html)
JP2941479B2 (ja) 半導体装置
JPS61125028A (ja) 半導体装置
JPH0218956A (ja) 半導体装置用リードフレーム
JPS634658A (ja) 電子装置
JP2998179B2 (ja) フィルムキャリア型半導体装置の製造方法
KR20040000934A (ko) 티씨피 리드의 범프 접합부 구조
JPH04299544A (ja) フィルムキャリヤ半導体装置の製造方法