JPH04240058A - 工作物のバレル研磨装置群による研磨方法および研磨システム - Google Patents

工作物のバレル研磨装置群による研磨方法および研磨システム

Info

Publication number
JPH04240058A
JPH04240058A JP3014673A JP1467391A JPH04240058A JP H04240058 A JPH04240058 A JP H04240058A JP 3014673 A JP3014673 A JP 3014673A JP 1467391 A JP1467391 A JP 1467391A JP H04240058 A JPH04240058 A JP H04240058A
Authority
JP
Japan
Prior art keywords
polishing
workpiece
group
data
equipment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3014673A
Other languages
English (en)
Japanese (ja)
Inventor
Hisamine Kobayashi
久峰 小林
Tomihiro Ishiguro
石黒　富廣
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tipton Manufacturing Corp
Original Assignee
Tipton Manufacturing Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tipton Manufacturing Corp filed Critical Tipton Manufacturing Corp
Priority to JP3014673A priority Critical patent/JPH04240058A/ja
Priority to TW081106019A priority patent/TW249770B/zh
Priority to TW080102901A priority patent/TW201714B/zh
Priority to KR1019910006500A priority patent/KR920014564A/ko
Priority to DE4128374A priority patent/DE4128374A1/de
Publication of JPH04240058A publication Critical patent/JPH04240058A/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06Q—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR
    • G06Q10/00—Administration; Management
    • G06Q10/08—Logistics, e.g. warehousing, loading or distribution; Inventory or stock management
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q41/00—Combinations or associations of metal-working machines not directed to a particular result according to classes B21, B23, or B24

Landscapes

  • Engineering & Computer Science (AREA)
  • Business, Economics & Management (AREA)
  • Economics (AREA)
  • Mechanical Engineering (AREA)
  • Operations Research (AREA)
  • Tourism & Hospitality (AREA)
  • Human Resources & Organizations (AREA)
  • Marketing (AREA)
  • Development Economics (AREA)
  • Quality & Reliability (AREA)
  • Strategic Management (AREA)
  • Entrepreneurship & Innovation (AREA)
  • Physics & Mathematics (AREA)
  • General Business, Economics & Management (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • General Factory Administration (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Multi-Process Working Machines And Systems (AREA)
JP3014673A 1991-01-14 1991-01-14 工作物のバレル研磨装置群による研磨方法および研磨システム Pending JPH04240058A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP3014673A JPH04240058A (ja) 1991-01-14 1991-01-14 工作物のバレル研磨装置群による研磨方法および研磨システム
TW081106019A TW249770B (enExample) 1991-01-14 1991-04-15
TW080102901A TW201714B (enExample) 1991-01-14 1991-04-15
KR1019910006500A KR920014564A (ko) 1991-01-14 1991-04-23 공작물의 연마방법 및 연마시스템
DE4128374A DE4128374A1 (de) 1991-01-14 1991-08-27 Verfahren und vorrichtung zur oberflaechenbehandlung von werkstuecken

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3014673A JPH04240058A (ja) 1991-01-14 1991-01-14 工作物のバレル研磨装置群による研磨方法および研磨システム

Publications (1)

Publication Number Publication Date
JPH04240058A true JPH04240058A (ja) 1992-08-27

Family

ID=11867741

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3014673A Pending JPH04240058A (ja) 1991-01-14 1991-01-14 工作物のバレル研磨装置群による研磨方法および研磨システム

Country Status (4)

Country Link
JP (1) JPH04240058A (enExample)
KR (1) KR920014564A (enExample)
DE (1) DE4128374A1 (enExample)
TW (2) TW249770B (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0740239A (ja) * 1993-08-02 1995-02-10 Sony Corp 研削研磨装置及び方法
JP2004106156A (ja) * 2002-09-20 2004-04-08 Tipton Mfg Corp 渦流バレル研磨システム
JP2017189826A (ja) * 2016-04-11 2017-10-19 株式会社鉄研 バレル研磨工程を備えた金属製品の製造方法

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4218818A1 (de) * 1992-06-06 1993-12-09 Mueller Weingarten Maschf Transporteinrichtung
JPH0722490A (ja) * 1993-06-30 1995-01-24 Mitsubishi Electric Corp ロット自動編成装置及び方法
DE19722536A1 (de) * 1996-08-22 1998-02-26 Truetzschler Gmbh & Co Kg Kannenfördersystem zwischen zwei im Arbeitsgang aufeinanderfolgenden Strecken
IT1293614B1 (it) 1996-08-22 1999-03-08 Truetzschler & Co Dispositivo per il trasporto e l'approntamento di vasi,in particolare fra due stiratoi consecutivi nel ciclo di lavorazione
US7829941B2 (en) 2006-01-24 2010-11-09 Alpha & Omega Semiconductor, Ltd. Configuration and method to form MOSFET devices with low resistance silicide gate and mesa contact regions

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0740239A (ja) * 1993-08-02 1995-02-10 Sony Corp 研削研磨装置及び方法
JP2004106156A (ja) * 2002-09-20 2004-04-08 Tipton Mfg Corp 渦流バレル研磨システム
JP2017189826A (ja) * 2016-04-11 2017-10-19 株式会社鉄研 バレル研磨工程を備えた金属製品の製造方法

Also Published As

Publication number Publication date
TW201714B (enExample) 1993-03-11
TW249770B (enExample) 1995-06-21
KR920014564A (ko) 1992-08-25
DE4128374A1 (de) 1992-07-16

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