JPH0423322Y2 - - Google Patents

Info

Publication number
JPH0423322Y2
JPH0423322Y2 JP532186U JP532186U JPH0423322Y2 JP H0423322 Y2 JPH0423322 Y2 JP H0423322Y2 JP 532186 U JP532186 U JP 532186U JP 532186 U JP532186 U JP 532186U JP H0423322 Y2 JPH0423322 Y2 JP H0423322Y2
Authority
JP
Japan
Prior art keywords
conductive path
insulating film
substrates
bent
integrated circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP532186U
Other languages
English (en)
Japanese (ja)
Other versions
JPS62118438U (de
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP532186U priority Critical patent/JPH0423322Y2/ja
Publication of JPS62118438U publication Critical patent/JPS62118438U/ja
Application granted granted Critical
Publication of JPH0423322Y2 publication Critical patent/JPH0423322Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Wire Bonding (AREA)
JP532186U 1986-01-17 1986-01-17 Expired JPH0423322Y2 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP532186U JPH0423322Y2 (de) 1986-01-17 1986-01-17

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP532186U JPH0423322Y2 (de) 1986-01-17 1986-01-17

Publications (2)

Publication Number Publication Date
JPS62118438U JPS62118438U (de) 1987-07-28
JPH0423322Y2 true JPH0423322Y2 (de) 1992-05-29

Family

ID=30786795

Family Applications (1)

Application Number Title Priority Date Filing Date
JP532186U Expired JPH0423322Y2 (de) 1986-01-17 1986-01-17

Country Status (1)

Country Link
JP (1) JPH0423322Y2 (de)

Also Published As

Publication number Publication date
JPS62118438U (de) 1987-07-28

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