JPH04229648A - 所定のエミッタ領域を有するトランジスタおよびその製作方法 - Google Patents
所定のエミッタ領域を有するトランジスタおよびその製作方法Info
- Publication number
- JPH04229648A JPH04229648A JP3210424A JP21042491A JPH04229648A JP H04229648 A JPH04229648 A JP H04229648A JP 3210424 A JP3210424 A JP 3210424A JP 21042491 A JP21042491 A JP 21042491A JP H04229648 A JPH04229648 A JP H04229648A
- Authority
- JP
- Japan
- Prior art keywords
- emitter electrode
- electrode region
- region
- conductivity type
- predetermined
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D10/00—Bipolar junction transistors [BJT]
- H10D10/01—Manufacture or treatment
- H10D10/051—Manufacture or treatment of vertical BJTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/01—Manufacture or treatment
- H10D84/0107—Integrating at least one component covered by H10D12/00 or H10D30/00 with at least one component covered by H10D8/00, H10D10/00 or H10D18/00, e.g. integrating IGFETs with BJTs
- H10D84/0109—Integrating at least one component covered by H10D12/00 or H10D30/00 with at least one component covered by H10D8/00, H10D10/00 or H10D18/00, e.g. integrating IGFETs with BJTs the at least one component covered by H10D12/00 or H10D30/00 being a MOS device
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/01—Manufacture or treatment
- H10D84/02—Manufacture or treatment characterised by using material-based technologies
- H10D84/03—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology
- H10D84/038—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology using silicon technology, e.g. SiGe
-
- H10P76/40—
Landscapes
- Bipolar Transistors (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US55977790A | 1990-07-30 | 1990-07-30 | |
| US559777 | 1990-07-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04229648A true JPH04229648A (ja) | 1992-08-19 |
Family
ID=24234978
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3210424A Pending JPH04229648A (ja) | 1990-07-30 | 1991-07-29 | 所定のエミッタ領域を有するトランジスタおよびその製作方法 |
Country Status (2)
| Country | Link |
|---|---|
| EP (1) | EP0469840A2 (OSRAM) |
| JP (1) | JPH04229648A (OSRAM) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011007699A1 (ja) * | 2009-07-13 | 2011-01-20 | ミツミ電機株式会社 | 半導体装置の製造方法及び半導体集積回路装置 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110676252B (zh) * | 2019-09-12 | 2022-05-13 | 北京时代民芯科技有限公司 | 一种抗瞬时辐射加固的集成电路版图结构 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5460579A (en) * | 1977-10-24 | 1979-05-16 | Hitachi Ltd | Semiconductor device |
| JPS6010642A (ja) * | 1983-06-29 | 1985-01-19 | Mitsubishi Electric Corp | 半導体装置の製造方法 |
| JPS6020571A (ja) * | 1983-07-15 | 1985-02-01 | Hitachi Ltd | 半導体装置 |
| JPS63142672A (ja) * | 1986-12-05 | 1988-06-15 | Hitachi Ltd | 半導体装置 |
| JPH021931A (ja) * | 1988-06-09 | 1990-01-08 | Fujitsu Ltd | 半導体装置の製造方法 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0622238B2 (ja) * | 1985-10-02 | 1994-03-23 | 沖電気工業株式会社 | バイポ−ラ型半導体集積回路装置の製造方法 |
| DE3680520D1 (de) * | 1986-03-22 | 1991-08-29 | Itt Ind Gmbh Deutsche | Verfahren zum herstellen einer monolithisch integrierten schaltung mit mindestens einem bipolaren planartransistor. |
| EP0278619B1 (en) * | 1987-01-30 | 1993-12-08 | Texas Instruments Incorporated | Integrated bipolar and CMOS transistor fabrication process |
-
1991
- 1991-07-29 JP JP3210424A patent/JPH04229648A/ja active Pending
- 1991-07-29 EP EP91306949A patent/EP0469840A2/en not_active Withdrawn
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5460579A (en) * | 1977-10-24 | 1979-05-16 | Hitachi Ltd | Semiconductor device |
| JPS6010642A (ja) * | 1983-06-29 | 1985-01-19 | Mitsubishi Electric Corp | 半導体装置の製造方法 |
| JPS6020571A (ja) * | 1983-07-15 | 1985-02-01 | Hitachi Ltd | 半導体装置 |
| JPS63142672A (ja) * | 1986-12-05 | 1988-06-15 | Hitachi Ltd | 半導体装置 |
| JPH021931A (ja) * | 1988-06-09 | 1990-01-08 | Fujitsu Ltd | 半導体装置の製造方法 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011007699A1 (ja) * | 2009-07-13 | 2011-01-20 | ミツミ電機株式会社 | 半導体装置の製造方法及び半導体集積回路装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP0469840A3 (OSRAM) | 1995-02-01 |
| EP0469840A2 (en) | 1992-02-05 |
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