JPH0420742B2 - - Google Patents
Info
- Publication number
- JPH0420742B2 JPH0420742B2 JP62105290A JP10529087A JPH0420742B2 JP H0420742 B2 JPH0420742 B2 JP H0420742B2 JP 62105290 A JP62105290 A JP 62105290A JP 10529087 A JP10529087 A JP 10529087A JP H0420742 B2 JPH0420742 B2 JP H0420742B2
- Authority
- JP
- Japan
- Prior art keywords
- acid
- polishing
- water
- wafer
- composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 235000012431 wafers Nutrition 0.000 claims description 38
- 238000005498 polishing Methods 0.000 claims description 35
- 239000000203 mixture Substances 0.000 claims description 33
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 21
- 150000002500 ions Chemical class 0.000 claims description 13
- 239000002245 particle Substances 0.000 claims description 12
- 229920000642 polymer Polymers 0.000 claims description 11
- 239000002738 chelating agent Substances 0.000 claims description 9
- 150000001875 compounds Chemical class 0.000 claims description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 9
- 239000003795 chemical substances by application Substances 0.000 claims description 7
- 229920002125 Sokalan® Polymers 0.000 claims description 3
- 229920000172 poly(styrenesulfonic acid) Polymers 0.000 claims description 3
- 239000004584 polyacrylic acid Substances 0.000 claims description 3
- 229940005642 polystyrene sulfonic acid Drugs 0.000 claims description 3
- URDCARMUOSMFFI-UHFFFAOYSA-N 2-[2-[bis(carboxymethyl)amino]ethyl-(2-hydroxyethyl)amino]acetic acid Chemical compound OCCN(CC(O)=O)CCN(CC(O)=O)CC(O)=O URDCARMUOSMFFI-UHFFFAOYSA-N 0.000 claims description 2
- SQDAZGGFXASXDW-UHFFFAOYSA-N 5-bromo-2-(trifluoromethoxy)pyridine Chemical compound FC(F)(F)OC1=CC=C(Br)C=N1 SQDAZGGFXASXDW-UHFFFAOYSA-N 0.000 claims description 2
- 229920001287 Chondroitin sulfate Polymers 0.000 claims description 2
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 claims description 2
- 229920002971 Heparan sulfate Polymers 0.000 claims description 2
- HTTJABKRGRZYRN-UHFFFAOYSA-N Heparin Chemical compound OC1C(NC(=O)C)C(O)OC(COS(O)(=O)=O)C1OC1C(OS(O)(=O)=O)C(O)C(OC2C(C(OS(O)(=O)=O)C(OC3C(C(O)C(O)C(O3)C(O)=O)OS(O)(=O)=O)C(CO)O2)NS(O)(=O)=O)C(C(O)=O)O1 HTTJABKRGRZYRN-UHFFFAOYSA-N 0.000 claims description 2
- 229920000288 Keratan sulfate Polymers 0.000 claims description 2
- JYXGIOKAKDAARW-UHFFFAOYSA-N N-(2-hydroxyethyl)iminodiacetic acid Chemical compound OCCN(CC(O)=O)CC(O)=O JYXGIOKAKDAARW-UHFFFAOYSA-N 0.000 claims description 2
- 229920002845 Poly(methacrylic acid) Polymers 0.000 claims description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims description 2
- 239000002253 acid Substances 0.000 claims description 2
- 229940059329 chondroitin sulfate Drugs 0.000 claims description 2
- 229920001577 copolymer Polymers 0.000 claims description 2
- -1 dextran sulfate Polymers 0.000 claims description 2
- 229960000633 dextran sulfate Drugs 0.000 claims description 2
- KXCLCNHUUKTANI-RBIYJLQWSA-N keratan Chemical compound CC(=O)N[C@@H]1[C@@H](O)C[C@@H](COS(O)(=O)=O)O[C@H]1O[C@@H]1[C@@H](O)[C@H](O[C@@H]2[C@H](O[C@@H](O[C@H]3[C@H]([C@@H](COS(O)(=O)=O)O[C@@H](O)[C@@H]3O)O)[C@H](NC(C)=O)[C@H]2O)COS(O)(=O)=O)O[C@H](COS(O)(=O)=O)[C@@H]1O KXCLCNHUUKTANI-RBIYJLQWSA-N 0.000 claims description 2
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 claims description 2
- 239000011976 maleic acid Substances 0.000 claims description 2
- MGFYIUFZLHCRTH-UHFFFAOYSA-N nitrilotriacetic acid Chemical compound OC(=O)CN(CC(O)=O)CC(O)=O MGFYIUFZLHCRTH-UHFFFAOYSA-N 0.000 claims description 2
- 229920001444 polymaleic acid Polymers 0.000 claims description 2
- 229920000137 polyphosphoric acid Polymers 0.000 claims description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 claims description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 2
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 claims 3
- 125000004429 atom Chemical group 0.000 description 15
- 229910052751 metal Inorganic materials 0.000 description 15
- 239000002184 metal Substances 0.000 description 15
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 11
- 125000004436 sodium atom Chemical group 0.000 description 8
- 229910052710 silicon Inorganic materials 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 239000000377 silicon dioxide Substances 0.000 description 5
- 239000008119 colloidal silica Substances 0.000 description 4
- 239000013078 crystal Substances 0.000 description 4
- 239000004744 fabric Substances 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 230000005686 electrostatic field Effects 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 239000002002 slurry Substances 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 2
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 125000001453 quaternary ammonium group Chemical group 0.000 description 2
- QPCDCPDFJACHGM-UHFFFAOYSA-N N,N-bis{2-[bis(carboxymethyl)amino]ethyl}glycine Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(=O)O)CCN(CC(O)=O)CC(O)=O QPCDCPDFJACHGM-UHFFFAOYSA-N 0.000 description 1
- 239000000908 ammonium hydroxide Substances 0.000 description 1
- 229920006318 anionic polymer Polymers 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005247 gettering Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 229960003330 pentetic acid Drugs 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 238000001004 secondary ion mass spectrometry Methods 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62105290A JPS63272460A (ja) | 1987-04-28 | 1987-04-28 | ウエハ−用研磨剤組成物 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62105290A JPS63272460A (ja) | 1987-04-28 | 1987-04-28 | ウエハ−用研磨剤組成物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63272460A JPS63272460A (ja) | 1988-11-09 |
| JPH0420742B2 true JPH0420742B2 (ko) | 1992-04-06 |
Family
ID=14403554
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62105290A Granted JPS63272460A (ja) | 1987-04-28 | 1987-04-28 | ウエハ−用研磨剤組成物 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63272460A (ko) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008532329A (ja) * | 2005-03-07 | 2008-08-14 | チェイル インダストリーズ インコーポレイテッド | シリコンウエハの表面品質を改善する研磨用スラリー組成物、及びそれを用いたシリコンウエハの研磨方法 |
| US10460947B2 (en) | 2014-12-15 | 2019-10-29 | Shin-Etsu Handotai Co., Ltd. | Method for polishing silicon wafer |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AU2080999A (en) * | 1997-12-23 | 1999-07-12 | Akzo Nobel N.V. | A composition for chemical mechanical polishing |
| JP3810588B2 (ja) * | 1998-06-22 | 2006-08-16 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
| WO2000013217A1 (fr) | 1998-08-31 | 2000-03-09 | Hitachi Chemical Company, Ltd. | Liquide abrasif pour le polissage de metaux et procede correspondant |
| TWI267549B (en) * | 1999-03-18 | 2006-12-01 | Toshiba Corp | Aqueous dispersion, aqueous dispersion for chemical mechanical polishing used for manufacture of semiconductor devices, method for manufacture of semiconductor devices, and method for formation of embedded wiring |
| JP2008155368A (ja) * | 1999-06-23 | 2008-07-10 | Jsr Corp | 研磨用組成物、および研磨方法 |
| JP3440419B2 (ja) | 2001-02-02 | 2003-08-25 | 株式会社フジミインコーポレーテッド | 研磨用組成物およびそれを用いた研磨方法 |
| JP4912592B2 (ja) * | 2002-11-08 | 2012-04-11 | 株式会社フジミインコーポレーテッド | 研磨用組成物及びその使用方法 |
| JP4814502B2 (ja) | 2004-09-09 | 2011-11-16 | 株式会社フジミインコーポレーテッド | 研磨用組成物及びそれを用いた研磨方法 |
| TW200619368A (en) * | 2004-10-28 | 2006-06-16 | Nissan Chemical Ind Ltd | Polishing composition for silicon wafer |
| US20090127501A1 (en) * | 2005-05-27 | 2009-05-21 | Nissan Chemical Industries, Ltd. | Polishing Composition for Silicon Wafer |
| US8278219B2 (en) | 2006-12-04 | 2012-10-02 | Nomura Micro Science Co., Ltd. | Method for purifying chemical added with chelating agent |
| JP7379789B2 (ja) | 2020-03-02 | 2023-11-15 | 株式会社タイテム | コロイダルシリカスラリー |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3328141A (en) * | 1966-02-28 | 1967-06-27 | Tizon Chemical Corp | Process for polishing crystalline silicon |
| JPS6287242A (ja) * | 1985-05-29 | 1987-04-21 | Nippon Shokubai Kagaku Kogyo Co Ltd | 安定な金属酸化物系ゾル組成物 |
-
1987
- 1987-04-28 JP JP62105290A patent/JPS63272460A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3328141A (en) * | 1966-02-28 | 1967-06-27 | Tizon Chemical Corp | Process for polishing crystalline silicon |
| JPS6287242A (ja) * | 1985-05-29 | 1987-04-21 | Nippon Shokubai Kagaku Kogyo Co Ltd | 安定な金属酸化物系ゾル組成物 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008532329A (ja) * | 2005-03-07 | 2008-08-14 | チェイル インダストリーズ インコーポレイテッド | シリコンウエハの表面品質を改善する研磨用スラリー組成物、及びそれを用いたシリコンウエハの研磨方法 |
| US10460947B2 (en) | 2014-12-15 | 2019-10-29 | Shin-Etsu Handotai Co., Ltd. | Method for polishing silicon wafer |
| DE112015005277B4 (de) | 2014-12-15 | 2024-05-02 | Shin-Etsu Handotai Co., Ltd. | Verfahren zum Polieren von Siliciumwafern |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63272460A (ja) | 1988-11-09 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term | ||
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080406 Year of fee payment: 16 |