JPH0420375B2 - - Google Patents

Info

Publication number
JPH0420375B2
JPH0420375B2 JP60279578A JP27957885A JPH0420375B2 JP H0420375 B2 JPH0420375 B2 JP H0420375B2 JP 60279578 A JP60279578 A JP 60279578A JP 27957885 A JP27957885 A JP 27957885A JP H0420375 B2 JPH0420375 B2 JP H0420375B2
Authority
JP
Japan
Prior art keywords
protrusion
conductive
protrusions
resin
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60279578A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62138234A (ja
Inventor
Tamio Ooi
Mutsumi Yoshida
Koichi Kondo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Aisin Corp
Original Assignee
Aisin Seiki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aisin Seiki Co Ltd filed Critical Aisin Seiki Co Ltd
Priority to JP27957885A priority Critical patent/JPS62138234A/ja
Publication of JPS62138234A publication Critical patent/JPS62138234A/ja
Publication of JPH0420375B2 publication Critical patent/JPH0420375B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/56—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using mechanical means or mechanical connections, e.g. form-fits
    • B29C65/562—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using mechanical means or mechanical connections, e.g. form-fits using extra joining elements, i.e. which are not integral with the parts to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
    • B29K2995/0003—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular electrical or magnetic properties, e.g. piezoelectric
    • B29K2995/0005—Conductive

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
JP27957885A 1985-12-12 1985-12-12 導電性樹脂成形品の組付部の構造 Granted JPS62138234A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP27957885A JPS62138234A (ja) 1985-12-12 1985-12-12 導電性樹脂成形品の組付部の構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP27957885A JPS62138234A (ja) 1985-12-12 1985-12-12 導電性樹脂成形品の組付部の構造

Publications (2)

Publication Number Publication Date
JPS62138234A JPS62138234A (ja) 1987-06-22
JPH0420375B2 true JPH0420375B2 (enrdf_load_stackoverflow) 1992-04-02

Family

ID=17612931

Family Applications (1)

Application Number Title Priority Date Filing Date
JP27957885A Granted JPS62138234A (ja) 1985-12-12 1985-12-12 導電性樹脂成形品の組付部の構造

Country Status (1)

Country Link
JP (1) JPS62138234A (enrdf_load_stackoverflow)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2257305A (en) * 1991-06-28 1993-01-06 Delco Electronics Corp Esd-protected cover for electronic components and method of making the same
DE10111646B4 (de) * 2000-05-16 2008-10-02 Heidelberger Druckmaschinen Ag Abgeschirmtes Schaltschrankgehäuse
JP4747833B2 (ja) * 2005-12-26 2011-08-17 沖電気工業株式会社 板金部材の結合構造および自動取引装置
JP6390900B2 (ja) * 2014-09-12 2018-09-19 株式会社デンソー シールドケース

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5517519U (enrdf_load_stackoverflow) * 1978-07-20 1980-02-04
JPS5870600A (ja) * 1981-10-21 1983-04-27 アイシン精機株式会社 多孔体複合樹脂による電波シ−ルド成形体

Also Published As

Publication number Publication date
JPS62138234A (ja) 1987-06-22

Similar Documents

Publication Publication Date Title
US4113981A (en) Electrically conductive adhesive connecting arrays of conductors
US5261826A (en) Device for contacting shielded conductors
JPH09289360A (ja) 配線板とその製造方法
JPS5899001A (ja) マイクロ波電子装置用のハウジング
EP1006766A2 (de) Elektronische Vorrichtung
JPH0420375B2 (enrdf_load_stackoverflow)
DE69839204T2 (de) Leitfähiges Elastomer zur Pfropfung auf ein elastisches Substrat
US20020019078A1 (en) Semiconductor package and method of manufacturing semiconductor package
JP2011159544A (ja) 給電構造
JP7712108B2 (ja) 電子制御装置
JPH0563034B2 (enrdf_load_stackoverflow)
JP2504486B2 (ja) 混成集積回路構造
JPH0644131Y2 (ja) 基板用スペーサー
JPS6215979Y2 (enrdf_load_stackoverflow)
JPS6325755Y2 (enrdf_load_stackoverflow)
JP2002223046A (ja) シールド付きフレキシブル基板
JPH03127899A (ja) 導電部材の筐体への取り付け構造
JPS5947405B2 (ja) 導電性ゴム
JPS6011402B2 (ja) 異方導電性シ−ト
JPS6292830A (ja) 導電処理を施した導電性樹脂成形品
JPH0316294Y2 (enrdf_load_stackoverflow)
JPH078208Y2 (ja) サ−マルヘツド
JPH0241821Y2 (enrdf_load_stackoverflow)
JP2000278837A (ja) ケーブルの接続構造
JP2002026204A (ja) 熱伝導材，電磁波シールド構造，及び熱伝導材の製造方法

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees