JPH042030U - - Google Patents

Info

Publication number
JPH042030U
JPH042030U JP1990042463U JP4246390U JPH042030U JP H042030 U JPH042030 U JP H042030U JP 1990042463 U JP1990042463 U JP 1990042463U JP 4246390 U JP4246390 U JP 4246390U JP H042030 U JPH042030 U JP H042030U
Authority
JP
Japan
Prior art keywords
semiconductor device
insulating film
electrodes
electrode
outer end
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1990042463U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990042463U priority Critical patent/JPH042030U/ja
Publication of JPH042030U publication Critical patent/JPH042030U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第１図〜第３図はこの考案をテープキヤリアパ
ツケージに適用した実施例を示し、第１図は接合
部分を樹脂封止する前の状態の平面図、第２図は
接合部分を樹脂封止した状態の断面図、第３図は
変形例を示す断面図、第４図は従来例を示す断面
図である。 １０……ＩＣチツプ、１１……絶縁性フイルム
、１２……配線リード、１３……フインガリード
、１４……パツド電極、１５……バンプ。

Claims (1)

  1. 【実用新案登録請求の範囲】 一面の端部に電極が配列された半導体装置と、 前記半導体装置よりも狭い幅で形成されて前記
    半導体装置上に配置された絶縁性フイルムと、 前記絶縁性フイルムに幅方向における内側から
    外側に向けて延設され、その外端側が前記電極に
    接合されたリードと、 からなる半導体装置の接続構造。
JP1990042463U 1990-04-23 1990-04-23 Pending JPH042030U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990042463U JPH042030U (ja) 1990-04-23 1990-04-23

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990042463U JPH042030U (ja) 1990-04-23 1990-04-23

Publications (1)

Publication Number Publication Date
JPH042030U true JPH042030U (ja) 1992-01-09

Family

ID=31554031

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990042463U Pending JPH042030U (ja) 1990-04-23 1990-04-23

Country Status (1)

Country Link
JP (1) JPH042030U (ja)

Similar Documents

Publication Publication Date Title
JPS5827935U (ja) 混成集積回路装置
JPH042030U (ja)
JPH0373444U (ja)
JPH01143128U (ja)
JPS63187330U (ja)
JPH0388350U (ja)
JPS6232550U (ja)
JPH0343738U (ja)
JPH0422244U (ja)
JPH0298635U (ja)
JPH0474461U (ja)
JPH01145140U (ja)
JPS5811246U (ja) 半導体装置
JPS62152442U (ja)
JPS59112954U (ja) 絶縁物封止半導体装置
JPS5811247U (ja) 半導体装置
JPH0341948U (ja)
JPS6263935U (ja)
JPH0167743U (ja)
JPH03101528U (ja)
JPS58187148U (ja) 半導体封止構造
JPS6260032U (ja)
JPH0281055U (ja)
JPS6144846U (ja) 半導体装置
JPS60133640U (ja) 半導体装置用中空パツケ−ジ