JPH0167743U - - Google Patents

Info

Publication number
JPH0167743U
JPH0167743U JP1987162769U JP16276987U JPH0167743U JP H0167743 U JPH0167743 U JP H0167743U JP 1987162769 U JP1987162769 U JP 1987162769U JP 16276987 U JP16276987 U JP 16276987U JP H0167743 U JPH0167743 U JP H0167743U
Authority
JP
Japan
Prior art keywords
pad
metal layer
conductive path
container
integrated circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987162769U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987162769U priority Critical patent/JPH0167743U/ja
Publication of JPH0167743U publication Critical patent/JPH0167743U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】
第１図ａ，ｂは本考案の第１の実施例を示す平
面図及びＡ部拡大図、第２図は本考案の第２の実
施例の主要部を示す平面図、第３図は従来の集積
回路用パツケージの一例を示す平面図である。 １……容器、２……半導体チツプ、３……ボン
デイング用パツド、４……パツド、５，６……ワ
イヤ、７……パツド、８……導通路。

Claims (1)

    【実用新案登録請求の範囲】
  1. セラミツク製の容器と、該容器の中央部に設け
    られた半導体チツプ固着用金属層と、該金属層の
    周囲に設けられたボンデイング用パツドと、前記
    容器に取付けられた外部引出し用リード線と、該
    リード線と前記パツドとを接続する導通路とを有
    する集積回路用パツケージにおいて、前記金属層
    の辺に沿う方向の前記パツド寸法が前記導通路よ
    り大きく設定され、かつ隣のパツドまたは導通路
    と接触しない間隔で少なくとも二列をなして形成
    されていることを特徴とする集積回路用パツケー
    ジ。
JP1987162769U 1987-10-23 1987-10-23 Pending JPH0167743U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987162769U JPH0167743U (ja) 1987-10-23 1987-10-23

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987162769U JPH0167743U (ja) 1987-10-23 1987-10-23

Publications (1)

Publication Number Publication Date
JPH0167743U true JPH0167743U (ja) 1989-05-01

Family

ID=31446896

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987162769U Pending JPH0167743U (ja) 1987-10-23 1987-10-23

Country Status (1)

Country Link
JP (1) JPH0167743U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0372640A (ja) * 1989-08-11 1991-03-27 Fujitsu Ltd 半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0372640A (ja) * 1989-08-11 1991-03-27 Fujitsu Ltd 半導体装置

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