JPH01123359U - - Google Patents
Info
- Publication number
- JPH01123359U JPH01123359U JP1988020150U JP2015088U JPH01123359U JP H01123359 U JPH01123359 U JP H01123359U JP 1988020150 U JP1988020150 U JP 1988020150U JP 2015088 U JP2015088 U JP 2015088U JP H01123359 U JPH01123359 U JP H01123359U
- Authority
- JP
- Japan
- Prior art keywords
- circuit device
- fixed
- device chip
- circumference
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05554—Shape in top view being square
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は一実施例を示す平面図、第２図Ａ、同
図Ｂは同実施例におけるワイヤボンデイング動作
を示す平面図、第３図及び第４図はそれぞれ従来
のパツケージを示す平面図である。 ３……ＩＣチツプ、４……パツド、１１……パ
ツケージ、１２……リードフレーム。
図Ｂは同実施例におけるワイヤボンデイング動作
を示す平面図、第３図及び第４図はそれぞれ従来
のパツケージを示す平面図である。 ３……ＩＣチツプ、４……パツド、１１……パ
ツケージ、１２……リードフレーム。
Claims (1)
- リードフレームのボンデイング位置が円周上に
、かつ、等間隔に配置されており、前記円周の円
の内側に半導体集積回路装置チツプが固定される
領域が設けられており、固定された半導体集積回
路装置チツプのパツドと前記リードフレームのボ
ンデイング位置の間にワイヤボンデイングが施こ
されるパツケージ。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988020150U JPH01123359U (ja) | 1988-02-17 | 1988-02-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988020150U JPH01123359U (ja) | 1988-02-17 | 1988-02-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01123359U true JPH01123359U (ja) | 1989-08-22 |
Family
ID=31236276
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988020150U Pending JPH01123359U (ja) | 1988-02-17 | 1988-02-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01123359U (ja) |
-
1988
- 1988-02-17 JP JP1988020150U patent/JPH01123359U/ja active Pending