JPH0419821Y2 - - Google Patents
Info
- Publication number
- JPH0419821Y2 JPH0419821Y2 JP7496986U JP7496986U JPH0419821Y2 JP H0419821 Y2 JPH0419821 Y2 JP H0419821Y2 JP 7496986 U JP7496986 U JP 7496986U JP 7496986 U JP7496986 U JP 7496986U JP H0419821 Y2 JPH0419821 Y2 JP H0419821Y2
- Authority
- JP
- Japan
- Prior art keywords
- product
- waste material
- electronic components
- board
- reflow
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000002699 waste material Substances 0.000 claims description 20
- 239000003973 paint Substances 0.000 claims description 8
- 239000011888 foil Substances 0.000 claims description 7
- 229910000679 solder Inorganic materials 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 239000011889 copper foil Substances 0.000 description 5
- 238000005476 soldering Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003779 heat-resistant material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7496986U JPH0419821Y2 (enrdf_load_stackoverflow) | 1986-05-19 | 1986-05-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7496986U JPH0419821Y2 (enrdf_load_stackoverflow) | 1986-05-19 | 1986-05-19 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62186453U JPS62186453U (enrdf_load_stackoverflow) | 1987-11-27 |
| JPH0419821Y2 true JPH0419821Y2 (enrdf_load_stackoverflow) | 1992-05-06 |
Family
ID=30920682
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7496986U Expired JPH0419821Y2 (enrdf_load_stackoverflow) | 1986-05-19 | 1986-05-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0419821Y2 (enrdf_load_stackoverflow) |
-
1986
- 1986-05-19 JP JP7496986U patent/JPH0419821Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62186453U (enrdf_load_stackoverflow) | 1987-11-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5262594A (en) | Multilayer rigid-flex printed circuit boards for use in infrared reflow oven and method for assembling same | |
| JPS6390890A (ja) | プリント基板 | |
| JP3634473B2 (ja) | プリント配線板 | |
| JPS6022538Y2 (ja) | チツプ型ヒユ−ズ | |
| JPH0419821Y2 (enrdf_load_stackoverflow) | ||
| JPS5946119B2 (ja) | 可撓性印刷配線板の接続方法 | |
| JP2961859B2 (ja) | 多層セラミック基板 | |
| JP3820825B2 (ja) | Ptcサーミスタ | |
| JP2547861B2 (ja) | サーマルヘッドの製造方法 | |
| JPS60175480A (ja) | プリント基板への部品取付装置 | |
| JP4733253B2 (ja) | プリント配線板 | |
| JPH03219689A (ja) | メタルコアプリント配線板 | |
| JP2728996B2 (ja) | 多端子接続構造 | |
| JP3872600B2 (ja) | 電子回路ユニットの取付方法 | |
| JP2706981B2 (ja) | プリント配線板 | |
| JP2000124587A (ja) | 電子回路ユニットのプリント基板への取付構造、並びに電子回路ユニットのプリント基板への取付方法 | |
| JPH03289101A (ja) | チップ抵抗器 | |
| JPH0666058U (ja) | フレキシブルプリント基板 | |
| JPS62147671A (ja) | フラットケーブルの端子接続方法 | |
| JPH07211994A (ja) | 面実装ハイブリッドic | |
| JPH03215902A (ja) | 角板型チップ抵抗器 | |
| JPS6142880B2 (enrdf_load_stackoverflow) | ||
| JPH05167214A (ja) | プリント基板 | |
| JPH02278786A (ja) | 回路基板 | |
| JPH08250841A (ja) | 表面実装部品の接合構造 |