JPH0419712B2 - - Google Patents

Info

Publication number
JPH0419712B2
JPH0419712B2 JP56134118A JP13411881A JPH0419712B2 JP H0419712 B2 JPH0419712 B2 JP H0419712B2 JP 56134118 A JP56134118 A JP 56134118A JP 13411881 A JP13411881 A JP 13411881A JP H0419712 B2 JPH0419712 B2 JP H0419712B2
Authority
JP
Japan
Prior art keywords
silicon
forming
diaphragm
silicon wafer
tape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP56134118A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5835982A (ja
Inventor
Minoru Takahashi
Hitoshi Minorikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP56134118A priority Critical patent/JPS5835982A/ja
Publication of JPS5835982A publication Critical patent/JPS5835982A/ja
Publication of JPH0419712B2 publication Critical patent/JPH0419712B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D48/00—Individual devices not covered by groups H10D1/00 - H10D44/00
    • H10D48/50—Devices controlled by mechanical forces, e.g. pressure

Landscapes

  • Measuring Fluid Pressure (AREA)
  • Pressure Sensors (AREA)
  • Dicing (AREA)
JP56134118A 1981-08-28 1981-08-28 半導体圧力センサの製造方法 Granted JPS5835982A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56134118A JPS5835982A (ja) 1981-08-28 1981-08-28 半導体圧力センサの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56134118A JPS5835982A (ja) 1981-08-28 1981-08-28 半導体圧力センサの製造方法

Publications (2)

Publication Number Publication Date
JPS5835982A JPS5835982A (ja) 1983-03-02
JPH0419712B2 true JPH0419712B2 (en:Method) 1992-03-31

Family

ID=15120876

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56134118A Granted JPS5835982A (ja) 1981-08-28 1981-08-28 半導体圧力センサの製造方法

Country Status (1)

Country Link
JP (1) JPS5835982A (en:Method)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0697698B2 (ja) * 1985-09-25 1994-11-30 日本電気株式会社 圧力センサの製造方法
JPH0233948A (ja) * 1988-07-22 1990-02-05 Matsushita Electric Ind Co Ltd 光半導体装置の製造方法
KR20040011244A (ko) * 2002-07-30 2004-02-05 주식회사 비에스이 다이어프램이 형성된 반도체소자의 커팅방법
JP4905696B2 (ja) * 2007-04-09 2012-03-28 三菱電機株式会社 半導体装置の製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5644413B2 (en:Method) * 1973-05-12 1981-10-19
JPS5434752A (en) * 1977-08-24 1979-03-14 Nec Home Electronics Ltd Manufacture of semiconductor device
JPS562671A (en) * 1979-06-22 1981-01-12 Nissan Motor Co Ltd Manufacture of semiconductor diaphragm

Also Published As

Publication number Publication date
JPS5835982A (ja) 1983-03-02

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