JPH0419316B2 - - Google Patents

Info

Publication number
JPH0419316B2
JPH0419316B2 JP60115280A JP11528085A JPH0419316B2 JP H0419316 B2 JPH0419316 B2 JP H0419316B2 JP 60115280 A JP60115280 A JP 60115280A JP 11528085 A JP11528085 A JP 11528085A JP H0419316 B2 JPH0419316 B2 JP H0419316B2
Authority
JP
Japan
Prior art keywords
gold plating
gold
lead
present
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60115280A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61276992A (ja
Inventor
Masao Nakazawa
Yoshiro Nishama
Shinichi Wakabayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP11528085A priority Critical patent/JPS61276992A/ja
Priority to US06/845,522 priority patent/US4717459A/en
Publication of JPS61276992A publication Critical patent/JPS61276992A/ja
Publication of JPH0419316B2 publication Critical patent/JPH0419316B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Electroplating And Plating Baths Therefor (AREA)
JP11528085A 1985-05-30 1985-05-30 電解金めつき液 Granted JPS61276992A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP11528085A JPS61276992A (ja) 1985-05-30 1985-05-30 電解金めつき液
US06/845,522 US4717459A (en) 1985-05-30 1986-03-28 Electrolytic gold plating solution

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11528085A JPS61276992A (ja) 1985-05-30 1985-05-30 電解金めつき液

Publications (2)

Publication Number Publication Date
JPS61276992A JPS61276992A (ja) 1986-12-06
JPH0419316B2 true JPH0419316B2 (enrdf_load_stackoverflow) 1992-03-30

Family

ID=14658748

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11528085A Granted JPS61276992A (ja) 1985-05-30 1985-05-30 電解金めつき液

Country Status (1)

Country Link
JP (1) JPS61276992A (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2944041B2 (ja) * 1989-08-21 1999-08-30 富士通株式会社 半導体装置の製造方法
JP5559455B2 (ja) * 2007-06-29 2014-07-23 日本高純度化学株式会社 電解金めっき液及びそれを用いて得られた金皮膜

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2355581C3 (de) * 1973-11-07 1979-07-12 Deutsche Gold- Und Silber-Scheideanstalt Vormals Roessler, 6000 Frankfurt Galvanisches Glanzgoldbad mit hoher Abscheidungsgeschwindigkeit
JPS5324898A (en) * 1976-08-20 1978-03-08 Iyasaka Sangiyou Kk Automatic envelope sealing machine

Also Published As

Publication number Publication date
JPS61276992A (ja) 1986-12-06

Similar Documents

Publication Publication Date Title
TWI475134B (zh) Ｐｄ及Ｐｄ－Ｎｉ電解液
US4246077A (en) Non-cyanide bright silver electroplating bath therefor, silver compounds and method of making silver compounds
DE69905295T2 (de) Nichtelektrolytische goldplattierungs-zusammensetzungen und verfahren zur verwendung
JP2645701B2 (ja) パラジウム合金めっき組成物、及びめっき方法
JPH1121693A (ja) 錫−銀合金めっき浴及びめっき物
US4144141A (en) Ammonia free palladium deposition using aminoacetic acid
DE2723910C2 (de) Zusatzgemisch und dessen Verwendung für Bäder zur elektrolytischen Abscheidung von Gold oder Goldlegierungen
KR100933337B1 (ko) 도금 조성물
EP0304315B1 (en) Bath for electrolytic deposition of a gold-copper-zinc alloy
DE2506467C2 (de) Bad und Verfahren zur galvanischen Abscheidung von Palladium-Nickel-Legierungen
JPH06104914B2 (ja) 地色ないし光沢のある銅・スズ合金被膜を電着させるためのアルカリ性シアン化物浴
JPS59143084A (ja) 改良金硫化物めつき浴
US4252618A (en) Method of electroplating tin and alkaline electroplating bath therefor
JPH09302498A (ja) 錫−銀合金電気めっき浴
JPH0419316B2 (enrdf_load_stackoverflow)
US4717459A (en) Electrolytic gold plating solution
DE112005001074T5 (de) Galvanisierlösung für eutektische Gold-Zinn-Legierung
JP2014047394A (ja) ノンシアン系金‐パラジウム合金めっき液及びめっき方法
JP2768498B2 (ja) 亜鉛一鉄合金電着用水性アルカリ浴及びこれを用いる亜鉛一鉄合金の電着法
JPH0419315B2 (enrdf_load_stackoverflow)
EP0188386A2 (en) Gold electroplating bath
JP2011168837A (ja) 無電解金めっき液及びそれを用いて得られた金皮膜
JPS613896A (ja) 金色被膜形成用電気めつき浴
EP0384679B1 (en) Electrolytic deposition of gold-containing alloys
JP3824770B2 (ja) 錫−銀合金電気めっき浴

Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term