JPH0418468B2 - - Google Patents

Info

Publication number
JPH0418468B2
JPH0418468B2 JP60245113A JP24511385A JPH0418468B2 JP H0418468 B2 JPH0418468 B2 JP H0418468B2 JP 60245113 A JP60245113 A JP 60245113A JP 24511385 A JP24511385 A JP 24511385A JP H0418468 B2 JPH0418468 B2 JP H0418468B2
Authority
JP
Japan
Prior art keywords
case
corners
silicone gel
semiconductor device
present
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60245113A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62104145A (ja
Inventor
Yoshio Takagi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP60245113A priority Critical patent/JPS62104145A/ja
Publication of JPS62104145A publication Critical patent/JPS62104145A/ja
Publication of JPH0418468B2 publication Critical patent/JPH0418468B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W76/47—
    • H10W72/07551—
    • H10W72/50—
    • H10W72/5445—
    • H10W72/5473—
    • H10W72/5524—
    • H10W72/926—
    • H10W72/932—

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP60245113A 1985-10-31 1985-10-31 半導体装置 Granted JPS62104145A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60245113A JPS62104145A (ja) 1985-10-31 1985-10-31 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60245113A JPS62104145A (ja) 1985-10-31 1985-10-31 半導体装置

Publications (2)

Publication Number Publication Date
JPS62104145A JPS62104145A (ja) 1987-05-14
JPH0418468B2 true JPH0418468B2 (cg-RX-API-DMAC10.html) 1992-03-27

Family

ID=17128814

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60245113A Granted JPS62104145A (ja) 1985-10-31 1985-10-31 半導体装置

Country Status (1)

Country Link
JP (1) JPS62104145A (cg-RX-API-DMAC10.html)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3638746B2 (ja) * 1997-01-30 2005-04-13 東レ・ダウコーニング・シリコーン株式会社 電気・電子部品封止・充填用シリコーンゲル組成物およびシリコーンゲル
JP3765444B2 (ja) * 1997-07-10 2006-04-12 東レ・ダウコーニング株式会社 電気・電子部品封止・充填用シリコーンゲル組成物およびシリコーンゲル
JP4081611B2 (ja) 2003-11-19 2008-04-30 株式会社豊田自動織機 半導体装置
CN106103594B (zh) 2014-01-27 2019-06-28 陶氏东丽株式会社 有机硅凝胶组合物
JP6728374B2 (ja) 2016-09-26 2020-07-22 デュポン・東レ・スペシャルティ・マテリアル株式会社 積層体、その製造方法および電子部品の製造方法
US11279827B2 (en) 2016-09-26 2022-03-22 Dow Toray Co., Ltd. Curing reactive silicone gel and use thereof
WO2018079678A1 (ja) 2016-10-31 2018-05-03 東レ・ダウコーニング株式会社 積層体および電子部品の製造方法
WO2018186165A1 (ja) 2017-04-06 2018-10-11 東レ・ダウコーニング株式会社 液状硬化性シリコーン接着剤組成物、その硬化物およびその用途
CN111247183A (zh) 2017-09-11 2020-06-05 陶氏东丽株式会社 具有自由基反应性的硅酮弹性体硬化物及其用途

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56167552U (cg-RX-API-DMAC10.html) * 1980-05-15 1981-12-11
JPS58121652A (ja) * 1981-12-11 1983-07-20 Fuji Electric Co Ltd 混成集積回路装置

Also Published As

Publication number Publication date
JPS62104145A (ja) 1987-05-14

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