JPH0418037B2 - - Google Patents
Info
- Publication number
- JPH0418037B2 JPH0418037B2 JP4955685A JP4955685A JPH0418037B2 JP H0418037 B2 JPH0418037 B2 JP H0418037B2 JP 4955685 A JP4955685 A JP 4955685A JP 4955685 A JP4955685 A JP 4955685A JP H0418037 B2 JPH0418037 B2 JP H0418037B2
- Authority
- JP
- Japan
- Prior art keywords
- masking tape
- crimping
- masking
- base material
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000000873 masking effect Effects 0.000 claims description 86
- 238000007747 plating Methods 0.000 claims description 28
- 238000000034 method Methods 0.000 claims description 23
- 238000002788 crimping Methods 0.000 claims description 19
- 230000000694 effects Effects 0.000 claims description 5
- 238000005520 cutting process Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 description 29
- 239000007788 liquid Substances 0.000 description 4
- 239000012790 adhesive layer Substances 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4955685A JPS61210197A (ja) | 1985-03-13 | 1985-03-13 | マスキングテ−プの貼付方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4955685A JPS61210197A (ja) | 1985-03-13 | 1985-03-13 | マスキングテ−プの貼付方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61210197A JPS61210197A (ja) | 1986-09-18 |
| JPH0418037B2 true JPH0418037B2 (OSRAM) | 1992-03-26 |
Family
ID=12834472
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4955685A Granted JPS61210197A (ja) | 1985-03-13 | 1985-03-13 | マスキングテ−プの貼付方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61210197A (OSRAM) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03219084A (ja) * | 1989-11-15 | 1991-09-26 | Fuji Plant Kogyo Kk | 部分メッキ用シール材、その製造方法、および部分メッキ方法 |
-
1985
- 1985-03-13 JP JP4955685A patent/JPS61210197A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61210197A (ja) | 1986-09-18 |
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