JPH0416556B2 - - Google Patents

Info

Publication number
JPH0416556B2
JPH0416556B2 JP63065098A JP6509888A JPH0416556B2 JP H0416556 B2 JPH0416556 B2 JP H0416556B2 JP 63065098 A JP63065098 A JP 63065098A JP 6509888 A JP6509888 A JP 6509888A JP H0416556 B2 JPH0416556 B2 JP H0416556B2
Authority
JP
Japan
Prior art keywords
tank
plating
plated
water
treatment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP63065098A
Other languages
English (en)
Japanese (ja)
Other versions
JPH01240694A (ja
Inventor
Sadao Mizuguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HANAMI KAGAKU KK
Original Assignee
HANAMI KAGAKU KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by HANAMI KAGAKU KK filed Critical HANAMI KAGAKU KK
Priority to JP6509888A priority Critical patent/JPH01240694A/ja
Publication of JPH01240694A publication Critical patent/JPH01240694A/ja
Publication of JPH0416556B2 publication Critical patent/JPH0416556B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
JP6509888A 1988-03-18 1988-03-18 狭隙空間部分に対するメッキ方法 Granted JPH01240694A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6509888A JPH01240694A (ja) 1988-03-18 1988-03-18 狭隙空間部分に対するメッキ方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6509888A JPH01240694A (ja) 1988-03-18 1988-03-18 狭隙空間部分に対するメッキ方法

Publications (2)

Publication Number Publication Date
JPH01240694A JPH01240694A (ja) 1989-09-26
JPH0416556B2 true JPH0416556B2 (enExample) 1992-03-24

Family

ID=13277099

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6509888A Granted JPH01240694A (ja) 1988-03-18 1988-03-18 狭隙空間部分に対するメッキ方法

Country Status (1)

Country Link
JP (1) JPH01240694A (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6544585B1 (en) 1997-09-02 2003-04-08 Ebara Corporation Method and apparatus for plating a substrate
JP2008075103A (ja) * 2006-09-19 2008-04-03 Sumitomo Electric Ind Ltd 多孔質樹脂材料の形成方法
JP5820160B2 (ja) * 2011-06-22 2015-11-24 株式会社日本アレフ 袋状微細管のメッキ膜形成方法
JP7067863B2 (ja) * 2016-12-28 2022-05-16 株式会社荏原製作所 基板を処理するための方法および装置
FR3077825B1 (fr) * 2018-02-14 2020-02-28 3D Plus Procede de metallisation de trous d'un module electronique par depot en phase liquide

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5684497A (en) * 1979-12-11 1981-07-09 Seiko Epson Corp Plating method of cast product
JPS5684499A (en) * 1979-12-11 1981-07-09 Seiko Epson Corp Plating method of cast product
JPS5684498A (en) * 1979-12-11 1981-07-09 Seiko Epson Corp Plating method of cast product
JPS6125799A (ja) * 1984-07-12 1986-02-04 末崎 康永 料理用切断機

Also Published As

Publication number Publication date
JPH01240694A (ja) 1989-09-26

Similar Documents

Publication Publication Date Title
JP2004353048A (ja) めっき装置及びめっき方法
JPH0416556B2 (enExample)
JPH04250874A (ja) 液体導入装置
US20030051995A1 (en) Plating device and plating method
RU2117717C1 (ru) Способ нанесения цинкового покрытия и технологическая линия для его осуществления
JPH08187476A (ja) 洗浄方法及び装置
JP2004123398A (ja) 含浸処理方法及び装置
CN221908927U (zh) 一种实验检测用容器的酸浸泡清洗装置
JP2990144B2 (ja) プリント配線板のめっき装置
JPH0731942A (ja) 超音波洗浄方法及び装置
JP2006307299A (ja) マスクレスめっき装置
JPH06212494A (ja) 前処理及び電着塗装装置
JP4215869B2 (ja) 基板処理方法および基板処理装置
JPH11335896A (ja) ウエハメッキ装置
JP3936125B2 (ja) 感光体ドラム下端部の塗工液剥離装置
KR100931884B1 (ko) 불산을 이용한 디스플레이용 소형 유리판재의 표면처리방법 및 장치
JP2697433B2 (ja) 穴空き中空部材の化学処理方法
JP3661426B2 (ja) バレルめっき方法およびバレルめっき装置
JP2000160349A5 (enExample)
KR100840426B1 (ko) 기판처리장치 및 기판처리방법
JPH0669178A (ja) ガラス基板洗浄方法
KR100564799B1 (ko) 구리 전해도금 장치 및 그 방법
KR100695232B1 (ko) 기판을 세정하는 장치 및 방법
JPH04197478A (ja) 含浸孔質物品の洗浄方法
JP2005268287A (ja) 基板処理方法、基板処理装置および基板処理システム