JPH0416556B2 - - Google Patents
Info
- Publication number
- JPH0416556B2 JPH0416556B2 JP63065098A JP6509888A JPH0416556B2 JP H0416556 B2 JPH0416556 B2 JP H0416556B2 JP 63065098 A JP63065098 A JP 63065098A JP 6509888 A JP6509888 A JP 6509888A JP H0416556 B2 JPH0416556 B2 JP H0416556B2
- Authority
- JP
- Japan
- Prior art keywords
- tank
- plating
- plated
- water
- treatment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Chemically Coating (AREA)
- Electroplating Methods And Accessories (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6509888A JPH01240694A (ja) | 1988-03-18 | 1988-03-18 | 狭隙空間部分に対するメッキ方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6509888A JPH01240694A (ja) | 1988-03-18 | 1988-03-18 | 狭隙空間部分に対するメッキ方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01240694A JPH01240694A (ja) | 1989-09-26 |
| JPH0416556B2 true JPH0416556B2 (enExample) | 1992-03-24 |
Family
ID=13277099
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6509888A Granted JPH01240694A (ja) | 1988-03-18 | 1988-03-18 | 狭隙空間部分に対するメッキ方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01240694A (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6544585B1 (en) | 1997-09-02 | 2003-04-08 | Ebara Corporation | Method and apparatus for plating a substrate |
| JP2008075103A (ja) * | 2006-09-19 | 2008-04-03 | Sumitomo Electric Ind Ltd | 多孔質樹脂材料の形成方法 |
| JP5820160B2 (ja) * | 2011-06-22 | 2015-11-24 | 株式会社日本アレフ | 袋状微細管のメッキ膜形成方法 |
| JP7067863B2 (ja) * | 2016-12-28 | 2022-05-16 | 株式会社荏原製作所 | 基板を処理するための方法および装置 |
| FR3077825B1 (fr) * | 2018-02-14 | 2020-02-28 | 3D Plus | Procede de metallisation de trous d'un module electronique par depot en phase liquide |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5684497A (en) * | 1979-12-11 | 1981-07-09 | Seiko Epson Corp | Plating method of cast product |
| JPS5684499A (en) * | 1979-12-11 | 1981-07-09 | Seiko Epson Corp | Plating method of cast product |
| JPS5684498A (en) * | 1979-12-11 | 1981-07-09 | Seiko Epson Corp | Plating method of cast product |
| JPS6125799A (ja) * | 1984-07-12 | 1986-02-04 | 末崎 康永 | 料理用切断機 |
-
1988
- 1988-03-18 JP JP6509888A patent/JPH01240694A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01240694A (ja) | 1989-09-26 |
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