JPH01240694A - 狭隙空間部分に対するメッキ方法 - Google Patents

狭隙空間部分に対するメッキ方法

Info

Publication number
JPH01240694A
JPH01240694A JP6509888A JP6509888A JPH01240694A JP H01240694 A JPH01240694 A JP H01240694A JP 6509888 A JP6509888 A JP 6509888A JP 6509888 A JP6509888 A JP 6509888A JP H01240694 A JPH01240694 A JP H01240694A
Authority
JP
Japan
Prior art keywords
tank
plating
plated
water
pretreatment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6509888A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0416556B2 (enExample
Inventor
Sadao Mizuguchi
水口　貞男
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HANAMI KAGAKU KK
Original Assignee
HANAMI KAGAKU KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by HANAMI KAGAKU KK filed Critical HANAMI KAGAKU KK
Priority to JP6509888A priority Critical patent/JPH01240694A/ja
Publication of JPH01240694A publication Critical patent/JPH01240694A/ja
Publication of JPH0416556B2 publication Critical patent/JPH0416556B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
JP6509888A 1988-03-18 1988-03-18 狭隙空間部分に対するメッキ方法 Granted JPH01240694A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6509888A JPH01240694A (ja) 1988-03-18 1988-03-18 狭隙空間部分に対するメッキ方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6509888A JPH01240694A (ja) 1988-03-18 1988-03-18 狭隙空間部分に対するメッキ方法

Publications (2)

Publication Number Publication Date
JPH01240694A true JPH01240694A (ja) 1989-09-26
JPH0416556B2 JPH0416556B2 (enExample) 1992-03-24

Family

ID=13277099

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6509888A Granted JPH01240694A (ja) 1988-03-18 1988-03-18 狭隙空間部分に対するメッキ方法

Country Status (1)

Country Link
JP (1) JPH01240694A (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6544585B1 (en) 1997-09-02 2003-04-08 Ebara Corporation Method and apparatus for plating a substrate
JP2008075103A (ja) * 2006-09-19 2008-04-03 Sumitomo Electric Ind Ltd 多孔質樹脂材料の形成方法
JP2013001996A (ja) * 2011-06-22 2013-01-07 Nippon Aleph Corp 袋状微細管のメッキ膜形成方法及びメッキ膜形成システム
JP2018104799A (ja) * 2016-12-28 2018-07-05 株式会社荏原製作所 基板を処理するための方法および装置
JP2021513608A (ja) * 2018-02-14 2021-05-27 スリーディー プラス 液相析出法によって電子モジュールの穴を金属化するためのプロセス

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5684498A (en) * 1979-12-11 1981-07-09 Seiko Epson Corp Plating method of cast product
JPS5684497A (en) * 1979-12-11 1981-07-09 Seiko Epson Corp Plating method of cast product
JPS5684499A (en) * 1979-12-11 1981-07-09 Seiko Epson Corp Plating method of cast product
JPS6125799A (ja) * 1984-07-12 1986-02-04 末崎　康永 料理用切断機

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5684498A (en) * 1979-12-11 1981-07-09 Seiko Epson Corp Plating method of cast product
JPS5684497A (en) * 1979-12-11 1981-07-09 Seiko Epson Corp Plating method of cast product
JPS5684499A (en) * 1979-12-11 1981-07-09 Seiko Epson Corp Plating method of cast product
JPS6125799A (ja) * 1984-07-12 1986-02-04 末崎　康永 料理用切断機

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6544585B1 (en) 1997-09-02 2003-04-08 Ebara Corporation Method and apparatus for plating a substrate
JP2008075103A (ja) * 2006-09-19 2008-04-03 Sumitomo Electric Ind Ltd 多孔質樹脂材料の形成方法
JP2013001996A (ja) * 2011-06-22 2013-01-07 Nippon Aleph Corp 袋状微細管のメッキ膜形成方法及びメッキ膜形成システム
JP2018104799A (ja) * 2016-12-28 2018-07-05 株式会社荏原製作所 基板を処理するための方法および装置
US11371155B2 (en) 2016-12-28 2022-06-28 Ebara Corporation Method and apparatus for processing a substrate
JP2021513608A (ja) * 2018-02-14 2021-05-27 スリーディー プラス 液相析出法によって電子モジュールの穴を金属化するためのプロセス

Also Published As

Publication number Publication date
JPH0416556B2 (enExample) 1992-03-24

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