JPH0416556B2 - - Google Patents
Info
- Publication number
- JPH0416556B2 JPH0416556B2 JP63065098A JP6509888A JPH0416556B2 JP H0416556 B2 JPH0416556 B2 JP H0416556B2 JP 63065098 A JP63065098 A JP 63065098A JP 6509888 A JP6509888 A JP 6509888A JP H0416556 B2 JPH0416556 B2 JP H0416556B2
- Authority
- JP
- Japan
- Prior art keywords
- tank
- plating
- plated
- water
- treatment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000007747 plating Methods 0.000 claims description 88
- 239000007788 liquid Substances 0.000 claims description 51
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 36
- 238000002203 pretreatment Methods 0.000 claims description 29
- 238000000034 method Methods 0.000 claims description 17
- 238000004140 cleaning Methods 0.000 claims description 5
- 238000005266 casting Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 230000004913 activation Effects 0.000 description 2
- 238000005238 degreasing Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
Landscapes
- Chemically Coating (AREA)
- Electroplating Methods And Accessories (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、例えば、適宜半導体のピンが嵌入さ
れるようなプリント基盤の極小穴や、集積回路の
基盤の極小穴等の如き適宜狭〓空間部分にメツキ
処理が確実に施せるようにした狭〓空間部分に対
するメツキ方法に関する。DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) The present invention can be applied to any suitable narrow hole, such as a very small hole in a printed circuit board into which a semiconductor pin is fitted, or a very small hole in an integrated circuit board. This invention relates to a plating method for a narrow space part, which allows the plating process to be applied to the space part reliably.
（従来の技術）
従来、一般的なメツキ処理としては、例えば、
被メツキ物を適宜洗浄液に浸漬した後（脱脂、脱
錆、活性化）、水洗を行つて、メツキの前処理を
行つている。しかも、これらは、例えば、適宜洗
浄槽（脱脂槽、脱錆槽、活性化槽）と水槽を夫々
設け、これらの槽内に被メツキ物を順次浸漬する
ことにより行つている。そして、この前処理が済
んだ被メツキ物をメツキ浴のメツキ液に浸漬する
ことによりメツキ処理が行われている。(Prior art) Conventionally, general plating processing includes, for example,
After the object to be plated is immersed in an appropriate cleaning solution (degreasing, derusting, activation), it is washed with water to perform pretreatment for plating. Moreover, these processes are carried out by, for example, appropriately providing cleaning tanks (degreasing tank, derusting tank, activation tank) and water tanks, and sequentially immersing the object to be plated into these tanks. The plating process is performed by immersing the pre-treated object in a plating solution in a plating bath.
ところが、このようなメツキ手段では、例え
ば、略0.3mm以下の小孔や袋穴の如き極小穴や幅
の狭い溝等の適宜狭〓空間部分に空気が残り、こ
の空気によつて狭〓空間部分に処理液が充填され
ず、充分な前処理が行い難い難点や、狭〓空間部
分にメツキ液が充填されず、メツキ処理が確実に
施し難い難点等があつた。 However, with such plating means, air remains in appropriately narrow spaces such as small holes of approximately 0.3 mm or less, blind holes, narrow grooves, etc., and this air causes the narrow spaces to be closed. There were problems such as the problem that the treatment liquid was not filled in the area and it was difficult to perform sufficient pretreatment, and the plating liquid was not filled in the narrow space area and it was difficult to perform the plating process reliably.
そのため、これらの難点等が解消すべく、特開
昭56−84499号公報、特開昭56−84498号公報、特
開昭56−84497号公報に記載されているような鋳
造品のメツキ方法等が発明されるようになつた。
これらは、メツキを施す際にメツキ液中に鋳造品
を浸漬し、メツキ液を適宜減圧（或いは、真空に
よる減圧）して、鋳造品とメツキ液との間に残留
している空気をメツキ液中に放出することによ
り、確実なるメツキ処理が施せるようにしたもの
である。 Therefore, in order to solve these difficulties, methods for plating cast products as described in JP-A-56-84499, JP-A-56-84498, and JP-A-56-84497 have been developed. began to be invented.
When plating these products, the casting is immersed in the plating liquid, and the pressure of the plating liquid is appropriately reduced (or the pressure is reduced by vacuum), and the air remaining between the casting and the plating liquid is removed from the plating liquid. By discharging it into the interior, reliable plating processing can be performed.
（発明が解決しようとする課題）
ところが、最近の適宜半導体のピンが嵌入され
るような極小穴を備えたプリント基盤や、集積回
路の基盤等にあつては、更なる小型化や集積化が
図られる傾向にあり、これに伴つて基盤自体が小
型化、多層化されるようになり、これら基盤に形
成される極小穴の如き狭〓空間部分もより小さく
且つ複雑な形状となつてきている。そのため、前
述のような手段では、未だ適宜狭〓空間部分の空
気を確実に取り除くことができず、確実なるメツ
キ処理が施し難い難点があつた。(Problem to be Solved by the Invention) However, in recent years, printed circuit boards with extremely small holes into which semiconductor pins can be inserted, and integrated circuit boards, etc., require further miniaturization and integration. Along with this, the substrates themselves have become smaller and multi-layered, and the narrow spaces such as tiny holes formed in these substrates are also becoming smaller and more complex in shape. . Therefore, with the above-mentioned means, it is still not possible to properly remove the air from the narrow space, and it is difficult to perform a reliable plating process.
すなわち、メツキを施す際にメツキ液中に鋳造
品を浸漬してから、メツキ液を適宜減圧（或い
は、真空による減圧）するため、メツキ液中に鋳
造品を浸漬したときに、既に鋳造品の狭〓空間部
分に空気が取り残されるようになり、メツキ液の
表面張力等の影響もあつて、この取り残された空
気を取り除くのは容易ではなかつた。特に、狭〓
空間部分が袋状小穴等の場合で、しかも、その開
口方向が下向き（或いは、斜め下向き）に設けら
れているような場合等は、その内部に取り残され
た空気をメツキ液の適宜減圧（或いは、真空によ
る減圧）だけで取り除くのは殆ど不可能であつ
た。 In other words, when plating, the casting is immersed in the plating liquid and then the pressure of the plating liquid is appropriately reduced (or the pressure is reduced by vacuum). Air was left behind in the narrow space, and it was not easy to remove this leftover air due to the influence of the surface tension of the plating solution. Especially narrow
If the space is a bag-shaped small hole, etc., and the opening direction is downward (or diagonally downward), the air left inside the hole can be removed by reducing the pressure of the plating liquid (or It was almost impossible to remove it only by reducing the pressure using a vacuum.
しかも、メツキ液を適宜減圧するにはかなり強
力な減圧装置が必要となり、その装置がかなり大
型で高価となる難点もあつた。また、メツキ液を
減圧するため、メツキ液が誤つて適宜減圧装置に
流入した場合、適宜減圧装置自体を損傷する虞れ
もあつた。 Moreover, in order to appropriately reduce the pressure of the plating liquid, a fairly powerful pressure reducing device is required, which also has the disadvantage of being quite large and expensive. Further, in order to reduce the pressure of the plating liquid, if the plating liquid accidentally flows into the pressure reducing device, there is a risk that the pressure reducing device itself may be damaged.
（問題点を解決するための手段）
そこで、本発明は、前述の如き難点等を解消す
べく創出されたものであり、具体的には、極小穴
の如き狭〓空間部分を備えた被メツキ物Ｈの洗浄
前に、この被メツキ物Ｈを前処理槽Ｓに内装し
て、この前処理槽Ｓ内を略真空状態とする。そし
て、前処理槽Ｓ内に水を入れて、被メツキ物Ｈを
水内に浸漬させ、被メツキ物Ｈの狭〓空間部分に
水が充填された状態のまま、前処理槽Ｓ内の水を
排出する。次に、前処理槽Ｓ内を略真空状態と
し、この前処理槽Ｓ内に処理液を入れて、被メツ
キ物Ｈを処理液内に浸漬させてメツキの前処理を
施す。それから、このメツキの前処理が施された
被メツキ物Ｈをメツキ槽に内装し、このメツキ槽
内を略真空状態とし、メツキ槽内にメツキ液を入
れて、被メツキ物Ｈをメツキ液内に浸漬させる手
段を採用した。(Means for Solving the Problems) Therefore, the present invention was created in order to solve the above-mentioned difficulties. Before cleaning the object H, the object H to be plated is placed in a pretreatment tank S, and the interior of the pretreatment tank S is brought into a substantially vacuum state. Then, pour water into the pre-treatment tank S, immerse the object H to be plated in the water, and keep the water in the pre-treatment tank S while the narrow space of the object H is filled with water. discharge. Next, the inside of the pre-treatment tank S is made into a substantially vacuum state, a processing liquid is put into the pre-treatment tank S, and the object to be plated H is immersed in the processing liquid to perform a pre-treatment for plating. Then, the object H to be plated which has been subjected to the pre-treatment for plating is placed in a plating tank, the inside of this plating tank is brought into a nearly vacuum state, the plating liquid is put into the plating tank, and the object H to be plated is placed in the plating liquid. A method of immersing it in water was adopted.
（作用）
しかして、被メツキ物Ｈは前処理槽Ｓ内に密閉
状態に内装され、この前処理槽Ｓ内を略真空状態
にすると、その極小穴の如き狭〓空間部分の空気
が無くなる（減圧される）。そして、被メツキ物
Ｈは前処理槽Ｓ内に入れられた水内に浸漬され、
被メツキ物Ｈの狭〓空間部分には水がスムーズに
充填される。次に、前処理槽Ｓ内を再び略真空状
態にして、この前処理槽Ｓ内に処理液を入れる
と、被メツキ物Ｈは処理液内に浸漬され、被メツ
キ物Ｈの狭〓空間部分に充填されている（残留し
ている）水に混入されるようにして処理液が充填
されて、メツキの前処理が狭〓空間部分に施され
る。(Function) The object to be plated H is sealed in the pretreatment tank S, and when the pretreatment tank S is brought into a nearly vacuum state, the air in the narrow spaces such as the tiny holes disappears ( depressurized). Then, the object to be plated H is immersed in water placed in the pre-treatment tank S,
The narrow space of the object H to be plated is smoothly filled with water. Next, the inside of the pre-treatment tank S is made into a substantially vacuum state again and the processing liquid is poured into this pre-treatment tank S. The object to be plated H is immersed in the processing liquid, and the narrow space of the object to be plated H is The treatment liquid is filled in such a way that it is mixed with the water that has been filled (residual), and pre-treatment for plating is applied to the narrow space.
更に、前処理が済んだ被メツキ物Ｈはメツキ槽
内に密閉状態に内装され、このメツキ槽内を略真
空状態にすると、その極小孔の如き狭〓空間部分
の空気が無くなる（減圧される）。そして、被メ
ツキ物Ｈはメツキ槽内に入れられたメツキ液内に
浸漬され、被メツキ物Ｈの狭〓空間部分にはメツ
キ液がスムーズに充填され、狭〓空間部分にメツ
キが施される。 Furthermore, the pre-treated object H to be plated is placed in a plating tank in a sealed state, and when the inside of this plating tank is brought to a near vacuum state, the air in narrow spaces such as the tiny holes disappears (the pressure is reduced). ). Then, the object to be plated H is immersed in the plating liquid placed in the plating tank, and the narrow space part of the object to be plated H is smoothly filled with the plating liquid, and the narrow space part is plated. .
（実施例） 以下、本発明を図示例について説明する。(Example) Hereinafter, the present invention will be explained with reference to illustrated examples.
本発明の方法に使用されるメツキの前処理装置
は、図に示すように、被メツキ物Ｈを収納可能な
前処理槽Ｓと、この前処理槽Ｓに接続される真空
ポンプ１と、前処理槽Ｓに接続される水槽３と、
前処理槽Ｓに接続される処理液槽４と、前処理槽
Ｓに接続されるエアー抜き６と、前処理槽Ｓに接
続されるドレイン７とからなる。 As shown in the figure, the plating pre-treatment device used in the method of the present invention includes a pre-treatment tank S that can accommodate the object to be plated H, a vacuum pump 1 connected to this pre-treatment tank S, and a A water tank 3 connected to the treatment tank S,
It consists of a processing liquid tank 4 connected to the pretreatment tank S, an air vent 6 connected to the pretreatment tank S, and a drain 7 connected to the pretreatment tank S.
そして、前処理槽Ｓは、適宜被メツキ物Ｈを取
出し自在に収納でき且つ密閉状態で収納できるよ
うに構成されている。尚、前処理槽Ｓ内にはバレ
ル等を設けておいても良い。 The pretreatment tank S is configured so that the object to be plated H can be removed and stored as appropriate, and can be stored in a sealed state. Note that a barrel or the like may be provided in the pretreatment tank S.
真空ポンプ１は、前記前処理槽ＳにバルブＶ１
及びタンク２を介して接続され、前処理槽Ｓ内を
略真空状態にできるように構成されている。 The vacuum pump 1 has a valve V1 in the pretreatment tank S.
and a tank 2, and are configured so that the inside of the pretreatment tank S can be brought into a substantially vacuum state.
水槽３は、前処理槽ＳにバルブＶ２を介して接
続され、バルブＶ２の開閉操作によつて前処理槽
Ｓ内に水を送給できるように構成されている。 The water tank 3 is connected to the pretreatment tank S via a valve V2, and is configured so that water can be supplied into the pretreatment tank S by opening and closing the valve V2.
処理液槽４は、前処理槽ＳにバルブＶ３を介し
て接続され、バルブＶ３の開閉操作によつて前処
理槽Ｓ内に処理液を送給できるように構成されて
いる。 The treatment liquid tank 4 is connected to the pretreatment tank S via a valve V3, and is configured such that the treatment liquid can be fed into the pretreatment tank S by opening and closing the valve V3.
エアー抜き６は、前処理槽Ｓ上部にバルブＶ４
を介して接続され、バルブＶ４の開閉操作によつ
て前処理槽Ｓ内に空気を導入できるように構成さ
れている。 Air vent 6 has valve V4 at the top of pre-treatment tank S.
It is configured such that air can be introduced into the pretreatment tank S by opening and closing the valve V4.
ドレン７は、前処理槽Ｓ下部にバルブＶ５を介
して接続され、バルブＶ５の開閉操作によつて前
処理槽Ｓ内の水や処理液が排出できるように構成
されている。 The drain 7 is connected to the lower part of the pretreatment tank S via a valve V5, and is configured so that water and processing liquid in the pretreatment tank S can be drained by opening and closing the valve V5.
尚、図中５は、前処理槽Ｓ上部に接続されるシ
リンダーで、このシリンダー５は、略真空状態の
前処理槽Ｓ内に、水や処理液を送給する際、内部
のピストンが水や処理液の送給分だけ移動するよ
うに構成したものである。 In addition, 5 in the figure is a cylinder connected to the upper part of the pre-treatment tank S, and when this cylinder 5 is feeding water or processing liquid into the pre-treatment tank S in a substantially vacuum state, the piston inside the cylinder 5 is connected to the top of the pre-treatment tank S. It is configured so that it moves by the amount of water and processing liquid supplied.
ところで、前処理槽Ｓの具体的構成、寸法、真
空ポンプ１及びタンク２の具体的構成、形状、配
設状態、水槽３及び処理液槽４の具体的構成、前
処理槽Ｓへの取付け位置、エアー抜き６及びドレ
ン７の具体的構成、前処理槽Ｓへの取付け位置、
バルブＶ１，Ｖ２，Ｖ３，Ｖ４，Ｖ５の具体的構
成、シリンダー５の具体的構成、取付け位置等は
図示例のもの等に限定されることなく適宜自由に
設定できる。 By the way, the specific configuration and dimensions of the pretreatment tank S, the specific configuration, shape, and arrangement state of the vacuum pump 1 and the tank 2, the specific configuration of the water tank 3 and the treatment liquid tank 4, and the mounting position to the pretreatment tank S. , the specific configuration of the air vent 6 and the drain 7, the installation position in the pretreatment tank S,
The specific configurations of the valves V1, V2, V3, V4, V5, the specific configuration of the cylinder 5, the mounting position, etc. are not limited to those shown in the illustrations, and can be freely set as appropriate.
そして、本発明のメツキ方法は、メツキの前処
理工程に於いて、極小穴の如き狭〓空間部分を備
えた被メツキ物Ｈの洗浄前に、この被メツキ物Ｈ
を前処理槽Ｓに内装する。そして、この前処理槽
Ｓを密閉状態とする。それから、バルブＶ１を開
くと共に、真空ポンプ１を作動して、前処理槽Ｓ
内を略真空状態とし、極小穴の如き狭〓空間部分
の空気を無くす（減圧する）。この後、バルブＶ
２を開き、水槽３内の水を前処理槽Ｓ内に入れ、
被メツキ物Ｈを水内に浸漬させる。すると、被メ
ツキ物Ｈの狭〓空間部分には水がスムーズに充填
される。次に、被メツキ物Ｈの狭〓空間部分に水
が充填された状態のまま、バルブＶ４，Ｖ５を開
き前処理槽Ｓ内の水を排出する。前処理槽Ｓ内の
水の排出後は、バルブＶ４，Ｖ５を閉じ、バルブ
Ｖ１を開くと共に、真空ポンプ１を作動して、前
処理槽Ｓ内を略真空状態とする。そして、バルブ
Ｖ３を開き、処理液槽４内の処理液を前処理槽Ｓ
内に入れ、被メツキ物Ｈを処理液内に浸漬され
る。すると、被メツキ物Ｈの狭〓空間部分に充填
されている（残留している）水に処理液が混入さ
れるようにして充填されて、メツキの前処理が狭
〓空間部分に施される。 In the plating method of the present invention, in the plating pre-treatment step, before cleaning the object H to be plated which has a narrow space portion such as a very small hole,
is placed in the pretreatment tank S. Then, this pretreatment tank S is brought into a closed state. Then, the valve V1 is opened, the vacuum pump 1 is activated, and the pretreatment tank S
The inside is almost in a vacuum state, eliminating air in narrow spaces such as tiny holes (depressurizing). After this, valve V
2, and put the water in the water tank 3 into the pretreatment tank S.
The object to be plated H is immersed in water. Then, the narrow space of the object H to be plated is smoothly filled with water. Next, the valves V4 and V5 are opened and the water in the pretreatment tank S is discharged while the narrow space of the object H to be plated is still filled with water. After draining the water in the pretreatment tank S, the valves V4 and V5 are closed, the valve V1 is opened, and the vacuum pump 1 is operated to bring the interior of the pretreatment tank S into a substantially vacuum state. Then, open the valve V3 and drain the processing liquid in the processing liquid tank 4 into the pretreatment tank S.
The object H to be plated is immersed in the processing liquid. Then, the treatment liquid is mixed with the water filling (remaining) in the narrow space of the object H to be plated, and pre-treatment for plating is applied to the narrow space. .
更に、前処理が施された被メツキ物Ｈをメツキ
槽に内装すると共に、このメツキ槽を密閉状態と
する。それから、バルブを開くと共に、真空ポン
プを作動して、メツキ槽内を略真空状態とし、狭
〓空間部分の空気を無くす（減圧する）。この後、
バルブを開き、メツキ液をメツキ槽内に入れ、被
メツキ物Ｈをメツキ液内に浸漬させる。すると、
被メツキ物Ｈの狭〓空間部分にはメツキ液がスム
ーズに充填され、メツキ処理が施される。 Further, the pretreated object H to be plated is placed in the plating tank, and the plating tank is sealed. Then, the valve is opened and the vacuum pump is operated to bring the inside of the plating tank to a substantially vacuum state, eliminating air in the narrow space (reducing the pressure). After this,
The valve is opened, the plating liquid is put into the plating tank, and the object to be plated H is immersed in the plating liquid. Then,
The plating liquid is smoothly filled into the narrow space of the object to be plated H, and the plating process is performed.
ところで、狭〓空間部分がかなり小さく、メツ
キ処理を施す際に、狭〓空間部分に、処理液が残
つているような場合は、メツキ槽内をあえて略真
空状態としなくとも確実なメツキ処理が施せるよ
うになる。 By the way, if the narrow space is quite small and the processing solution remains in the narrow space when plating is performed, reliable plating can be achieved without creating a near-vacuum state inside the plating tank. You will be able to apply it.
また、前記メツキ方法を実施する装置として
は、例えば、図の前処理槽Ｓをメツキ槽とし、こ
の前処理槽Ｓにバルブを介してメツキ液が収容さ
れているメツキ液用槽を接続して構成したもので
も良いし（図示せず）、或いは、図の前処理槽Ｓ
とは別にメツキ槽を設け、このメツキ槽にバルブ
を介してメツキ液が収容されているメツキ液用槽
を接続して構成したものでも良い（図示せず）。 Further, as an apparatus for carrying out the plating method, for example, the pre-treatment tank S in the figure is used as a plating tank, and a plating liquid tank containing a plating liquid is connected to this pre-treatment tank S via a valve. (not shown) or the pre-treatment tank S shown in the figure.
A plating tank may be provided separately, and a plating liquid tank containing plating liquid may be connected to this plating tank via a valve (not shown).
（発明の効果）
従つて、本発明のメツキ方法によれば、被メツ
キ物Ｈを前処理槽Ｓやメツキ槽内に入れてから、
これらの前処理槽Ｓやメツキ槽を略真空状態とし
ているので、狭〓空間部分の空気を比較的容易に
除去する（減圧する）ことができるようになり、
この状態で、前処理槽Ｓやメツキ槽内に水や処理
液やメツキ液を入れるので、水や処理液やメツキ
液が狭〓空間部分に確実且つスムーズに充填され
るようになり、メツキの前処理やメツキ処理が確
実且つ容易に行えるようになる。(Effect of the invention) Therefore, according to the plating method of the present invention, after putting the object H to be plated into the pretreatment tank S or the plating tank,
Since these pre-treatment tank S and plating tank are kept in a substantially vacuum state, the air in the narrow space can be relatively easily removed (depressurized).
In this state, water, treatment liquid, and plating liquid are poured into the pretreatment tank S and the plating tank, so that the water, treatment liquid, and plating liquid are reliably and smoothly filled into the narrow space, and the plating process is completed. Pretreatment and plating can be performed reliably and easily.
すなわち、従来の方法ではなし得なかつた、例
えば、適宜半導体のピンが嵌入されるようなプリ
ント基盤や集積回路の基盤に於ける略0.3mm以下
の小孔や、袋穴の如き極小穴や、幅が狭く複雑な
溝や、開口方向が下向き（或いは、斜下向き）に
設けられているような袋状小穴等の狭〓空間部分
に残つてしまう空気を確実に排除できるようにな
ると共に、この狭隙空間部分に水や処理液やメツ
キ液を確実に充填できるようになる。そのため、
充分な前処理やメツキ処理が期待でき、メツキ処
理時に於けるメツキ不良の防止に役立ち、歩留り
も著しく向上するようになる。しかも、メツキ作
業の作業能率向上も図れるようになる。 In other words, it is possible to form extremely small holes such as small holes of about 0.3 mm or less in printed circuit boards and integrated circuit boards, blind holes, etc., which could not be achieved with conventional methods, for example, into which semiconductor pins may be inserted. It is possible to reliably eliminate air remaining in narrow spaces such as narrow and complicated grooves and bag-shaped small holes with openings facing downward (or diagonally downward). It becomes possible to reliably fill the narrow gap space with water, treatment liquid, and plating liquid. Therefore,
Sufficient pre-treatment and plating treatment can be expected, helping to prevent plating defects during plating treatment and significantly improving yield. Furthermore, it is possible to improve the work efficiency of plating work.
また、被メツキ物Ｈが入れられている前処理槽
Ｓやメツキ槽内を真空ポンプ１によつて略真空状
態としているので、比較的強力でない真空ポンプ
１であつても前処理槽Ｓやメツキ槽内を略真空状
態にでき、小型で廉価な真空ポンプ１を利用でき
る。しかも、水や処理液や、メツキ液が真空ポン
プ１に流入する虞れが全くなくなり、真空ポンプ
１自体の損傷も全くなくなる。 In addition, since the pretreatment tank S and the plating tank in which the object to be plated H is placed are kept in a substantially vacuum state by the vacuum pump 1, even if the vacuum pump 1 is relatively weak, the pretreatment tank S and plating tank The inside of the tank can be brought into a substantially vacuum state, and a small and inexpensive vacuum pump 1 can be used. Furthermore, there is no risk of water, processing liquid, or plating liquid flowing into the vacuum pump 1, and there is no damage to the vacuum pump 1 itself.
特に、被メツキ物Ｈの狭〓空間部分に水を充填
してから、被メツキ物Ｈを処理液に浸漬させるの
で、水が充填され空気が確実に排除されている狭
〓空間部分に、処理液が混入されるようにして充
填され、狭〓空間部分に於ける前処理が効率良
く、且つ経済的に行えるようになる。 In particular, since the narrow space part of the object H to be plated is filled with water and then the object H to be plated is immersed in the treatment solution, the narrow space part where water is filled and air is reliably removed is treated. It is filled in such a way that the liquid is mixed in, and pretreatment in a narrow space can be carried out efficiently and economically.
ところで、本発明のメツキ方法によれば、これ
を実施するための装置自体の構成の簡素化や、設
置の容易化や、自動化等が図り易くなり、メツキ
処理能率も大幅に向上するようになる。 By the way, according to the plating method of the present invention, the configuration of the device itself for carrying out the method can be simplified, installation can be made easier, automation can be easily achieved, and the plating processing efficiency can also be greatly improved. .
図面はメツキの前処理装置の概略図である。
Ｓ……前処理槽、１……真空ポンプ、２……タ
ンク、３……水槽、４……処理液槽、５……シリ
ンダー、６……エアー抜き、７……ドレン、Ｖ１
……バルブ、Ｖ２……バルブ、Ｖ３……バルブ、
Ｖ４……バルブ、Ｖ５……バルブ、Ｈ……被メツ
キ物。
The drawing is a schematic diagram of a pretreatment device for plating. S... Pre-treatment tank, 1... Vacuum pump, 2... Tank, 3... Water tank, 4... Processing liquid tank, 5... Cylinder, 6... Air bleed, 7... Drain, V1
...Valve, V2...Valve, V3...Valve,
V4...Valve, V5...Valve, H...Object to be plated.
Claims (1)
物の洗浄前に、この被メツキ物を前処理槽に内装
して、この前処理槽内を略真空状態とし、そし
て、前処理槽内に水を入れて、被メツキ物を水内
に浸漬させ、被メツキ物の狭〓空間部分に水が充
填された状態のまま、前処理槽内の水を排出し、
次に、前処理槽内を略真空状態とし、この前処理
槽内に処理液を入れて、被メツキ物を処理液内に
浸漬させてメツキの前処理を施し、このメツキの
前処理が施された被メツキ物をメツキ槽に内装
し、このメツキ槽内を略真空状態とし、メツキ槽
内にメツキ液を入れて、被メツキ物をメツキ液内
に浸漬させることを特徴とした狭〓空間部分に対
するメツキ方法。1. Before cleaning an object to be plated that has a narrow space such as a very small hole, the object to be plated is placed in a pretreatment tank, the inside of this pretreatment tank is brought into a substantially vacuum state, and the inside of the pretreatment tank is Pour water into the tank, immerse the object to be plated in the water, and drain the water in the pre-treatment tank while the narrow space of the object to be plated remains filled with water.
Next, the inside of the pre-treatment tank is brought into a substantially vacuum state, a processing solution is put into the pre-treatment tank, and the object to be plated is immersed in the processing solution to perform plating pre-treatment. A narrow space characterized in that the object to be plated is placed in a plating tank, the inside of the plating tank is kept in a substantially vacuum state, a plating liquid is poured into the plating tank, and the object to be plated is immersed in the plating liquid. Method of plating parts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6509888A JPH01240694A (en) | 1988-03-18 | 1988-03-18 | Pretreatment for plating to narrow space part and said treatment device and plating method to narrow space part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6509888A JPH01240694A (en) | 1988-03-18 | 1988-03-18 | Pretreatment for plating to narrow space part and said treatment device and plating method to narrow space part |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01240694A JPH01240694A (en) | 1989-09-26 |
| JPH0416556B2 true JPH0416556B2 (en) | 1992-03-24 |
Family
ID=13277099
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6509888A Granted JPH01240694A (en) | 1988-03-18 | 1988-03-18 | Pretreatment for plating to narrow space part and said treatment device and plating method to narrow space part |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01240694A (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100586481B1 (en) | 1997-09-02 | 2006-11-30 | 가부시키가이샤 에바라 세이사꾸쇼 | How to Plate the Substrate |
| JP2008075103A (en) * | 2006-09-19 | 2008-04-03 | Sumitomo Electric Ind Ltd | Method for forming porous resin material |
| JP5820160B2 (en) * | 2011-06-22 | 2015-11-24 | 株式会社日本アレフ | Plating film forming method for bag-like micropipe |
| JP7067863B2 (en) | 2016-12-28 | 2022-05-16 | 株式会社荏原製作所 | Methods and equipment for processing substrates |
| FR3077825B1 (en) * | 2018-02-14 | 2020-02-28 | 3D Plus | METHOD FOR METALLIZING HOLES OF AN ELECTRONIC MODULE BY LIQUID PHASE DEPOSITION |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5684497A (en) * | 1979-12-11 | 1981-07-09 | Seiko Epson Corp | Plating method of cast product |
| JPS5684498A (en) * | 1979-12-11 | 1981-07-09 | Seiko Epson Corp | Plating method of cast product |
| JPS5684499A (en) * | 1979-12-11 | 1981-07-09 | Seiko Epson Corp | Plating method of cast product |
| JPS6125799A (en) * | 1984-07-12 | 1986-02-04 | 末崎 康永 | Cutter for cooking |
-
1988
- 1988-03-18 JP JP6509888A patent/JPH01240694A/en active Granted
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5684497A (en) * | 1979-12-11 | 1981-07-09 | Seiko Epson Corp | Plating method of cast product |
| JPS5684498A (en) * | 1979-12-11 | 1981-07-09 | Seiko Epson Corp | Plating method of cast product |
| JPS5684499A (en) * | 1979-12-11 | 1981-07-09 | Seiko Epson Corp | Plating method of cast product |
| JPS6125799A (en) * | 1984-07-12 | 1986-02-04 | 末崎 康永 | Cutter for cooking |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01240694A (en) | 1989-09-26 |
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