JPH0416465Y2 - - Google Patents
Info
- Publication number
- JPH0416465Y2 JPH0416465Y2 JP1986038716U JP3871686U JPH0416465Y2 JP H0416465 Y2 JPH0416465 Y2 JP H0416465Y2 JP 1986038716 U JP1986038716 U JP 1986038716U JP 3871686 U JP3871686 U JP 3871686U JP H0416465 Y2 JPH0416465 Y2 JP H0416465Y2
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- led
- light
- emitting part
- chips
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000002093 peripheral effect Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 21
- 239000000758 substrate Substances 0.000 description 12
- 230000000295 complement effect Effects 0.000 description 8
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 7
- 239000011159 matrix material Substances 0.000 description 7
- 229910052709 silver Inorganic materials 0.000 description 7
- 239000004332 silver Substances 0.000 description 7
- 238000007789 sealing Methods 0.000 description 4
- 230000004907 flux Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910000510 noble metal Inorganic materials 0.000 description 3
- 239000003086 colorant Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986038716U JPH0416465Y2 (US06589383-20030708-C00041.png) | 1986-03-17 | 1986-03-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986038716U JPH0416465Y2 (US06589383-20030708-C00041.png) | 1986-03-17 | 1986-03-17 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62149857U JPS62149857U (US06589383-20030708-C00041.png) | 1987-09-22 |
| JPH0416465Y2 true JPH0416465Y2 (US06589383-20030708-C00041.png) | 1992-04-13 |
Family
ID=30851217
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986038716U Expired JPH0416465Y2 (US06589383-20030708-C00041.png) | 1986-03-17 | 1986-03-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0416465Y2 (US06589383-20030708-C00041.png) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000332297A (ja) * | 1999-05-17 | 2000-11-30 | Koha Co Ltd | フルカラーｌｅｄモジュール |
| US20030057421A1 (en) * | 2001-09-27 | 2003-03-27 | Tzer-Perng Chen | High flux light emitting diode having flip-chip type light emitting diode chip with a transparent substrate |
-
1986
- 1986-03-17 JP JP1986038716U patent/JPH0416465Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62149857U (US06589383-20030708-C00041.png) | 1987-09-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4067801B2 (ja) | 照明装置 | |
| JP3668438B2 (ja) | チップ発光ダイオード | |
| EP0182254A2 (en) | Dot matrix luminous display | |
| JPH088463A (ja) | 薄型ｌｅｄドットマトリックスユニット | |
| JP4841627B2 (ja) | 電子部品及びその製造方法 | |
| EP1889245B1 (en) | Ultra-thin alphanumeric display | |
| US20210272945A1 (en) | Multiple pixel package structure with buried chip and electronic device using the same | |
| JPH10242523A (ja) | 発光ダイオード表示装置およびそれを利用した画像表示装置 | |
| JPH0416465Y2 (US06589383-20030708-C00041.png) | ||
| JP4062640B2 (ja) | Ｌｅｄ表示装置 | |
| JP2556911Y2 (ja) | ドットマトリクス発光表示体 | |
| JPS62215289A (ja) | ドツトマトリクス発光表示体 | |
| CN2509675Y (zh) | 具两面发光的发光二极管显示器 | |
| JPH0416466Y2 (US06589383-20030708-C00041.png) | ||
| TW201119099A (en) | Light-emitting diode and method for manufacturing thereof | |
| JP2531569Y2 (ja) | 発光表示装置 | |
| CN217485444U (zh) | 一种led发光器件 | |
| JP2508432Y2 (ja) | ドットマトリクス発光表示体 | |
| CN214745122U (zh) | 连接板、cob灯带及灯条 | |
| JP2006041113A (ja) | 発光ダイオード組立用基板および発光ダイオード組立体用基板を用いた表示装置 | |
| CN217485443U (zh) | 柔性led显示屏 | |
| CN209747512U (zh) | 一种led显示结构 | |
| CN215008265U (zh) | Led封装组件 | |
| JP5999341B2 (ja) | 発光装置および照明装置 | |
| CN217562213U (zh) | 透明led显示屏 |
