JPH04154187A - Structure of through hole wiring board and manufacture thereof - Google Patents
Structure of through hole wiring board and manufacture thereofInfo
- Publication number
- JPH04154187A JPH04154187A JP27783990A JP27783990A JPH04154187A JP H04154187 A JPH04154187 A JP H04154187A JP 27783990 A JP27783990 A JP 27783990A JP 27783990 A JP27783990 A JP 27783990A JP H04154187 A JPH04154187 A JP H04154187A
- Authority
- JP
- Japan
- Prior art keywords
- hole
- wiring board
- conductor
- board
- diameter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 239000004020 conductor Substances 0.000 claims abstract description 58
- 239000000758 substrate Substances 0.000 claims description 26
- 238000000034 method Methods 0.000 claims description 20
- 238000007639 printing Methods 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 6
- 238000010304 firing Methods 0.000 claims description 4
- 239000011147 inorganic material Substances 0.000 claims description 4
- 230000007423 decrease Effects 0.000 claims description 3
- 229910010272 inorganic material Inorganic materials 0.000 claims description 3
- 239000011368 organic material Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 abstract description 5
- 239000002184 metal Substances 0.000 abstract description 5
- 238000009434 installation Methods 0.000 abstract 1
- 238000007650 screen-printing Methods 0.000 description 4
- 238000005219 brazing Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000004080 punching Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- LTPBRCUWZOMYOC-UHFFFAOYSA-N Beryllium oxide Chemical compound O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 229910052878 cordierite Inorganic materials 0.000 description 1
- JSKIRARMQDRGJZ-UHFFFAOYSA-N dimagnesium dioxido-bis[(1-oxido-3-oxo-2,4,6,8,9-pentaoxa-1,3-disila-5,7-dialuminabicyclo[3.3.1]nonan-7-yl)oxy]silane Chemical compound [Mg++].[Mg++].[O-][Si]([O-])(O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2)O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2 JSKIRARMQDRGJZ-UHFFFAOYSA-N 0.000 description 1
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052863 mullite Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
- H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野コ
本発明は、電子機器等に使用されるスルーホール配線板
及びその製造方法に関し、更に詳しくはリートピンの脱
落のないスルーホール配線板及びその製造方法に関する
ものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a through-hole wiring board used in electronic equipment, etc., and a method for manufacturing the same, and more specifically, a through-hole wiring board that prevents the wire pin from falling off, and its manufacturing method. It is about the method.
［従来の技術］
従来、スルーホールの接続部にリードピンを有する配線
板は、金型によるパンチング又はドリル等により、基板
にスルーホール加工を施し、その後基板材料に応して導
体を充填することによりスルーホール導体を得、この下
部にリードピンが接続されている。[Prior Art] Conventionally, wiring boards having lead pins at the connection parts of through-holes are manufactured by punching or drilling with a mold, etc. to form through-holes in the board, and then filling them with a conductor depending on the material of the board. A through-hole conductor is obtained, and a lead pin is connected to the bottom of this.
このように製造されたスルーホール配線板は、ＯＡ機器
、通信機器、民生機器等のあらゆる電子機器に使用され
ている。Through-hole wiring boards manufactured in this manner are used in all kinds of electronic equipment such as office automation equipment, communication equipment, and consumer equipment.
［発明か解決しようとする課Ｕ］
しかしながら、これらの電子機器は、近年小型化、軽薄
化が進み、これに伴いスルーホール配線板におけるスル
ーホールの径が小さくなる傾向にあり、更にこれらのス
ルーホールは、基板の表面と裏面とでその径がほぼ等し
く、そのため基板とスルーホール内に形成された導体と
の上下方向に対する強度が弱いという問題があり、従っ
てり一ドピンに対して上下方向の外力が加わると、スル
ーホール導体に接続されたリートピンは、導体がスルー
ホール内壁から剥れて抜は落ちてしまうという欠点があ
った。[Invention or problem to be solved U] However, in recent years, these electronic devices have become smaller, lighter and thinner, and the diameter of the through holes in through-hole wiring boards has also tended to become smaller. The diameter of the hole is almost the same on the front and back sides of the board, so there is a problem that the strength of the board and the conductor formed in the through hole in the vertical direction is weak. When an external force is applied to the lead pin connected to the through-hole conductor, the conductor peels off from the inner wall of the through-hole and falls off.
そこで、本発明者等は、前記スルーホール部において、
リードピンに接続された導体部の脱落という問題につい
て種々検討した結果、スルーホールの断面形状を異なら
しめると共にスルーホールの径よりも大きいリードピン
接続部を形成することにより本発明の初期の目的が達成
されることを見出し、ここに本発明を完成した。Therefore, the inventors of the present invention, in the through-hole section,
As a result of various studies on the problem of the conductor part connected to the lead pin falling off, the initial object of the present invention was achieved by making the cross-sectional shape of the through hole different and forming the lead pin connection part larger than the diameter of the through hole. We have now completed the present invention.
従って、本発明の目的は、リードピンの脱落のないスル
ーホール配線板及びその製造方法を提供することにある
。SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a through-hole wiring board in which lead pins do not fall off and a method for manufacturing the same.
［課題を解決するための手段］
本発明の上記目的は、下記の１）〜９）により達成され
る。[Means for Solving the Problems] The above objects of the present invention are achieved by the following 1) to 9).
１）基板に形成されたスルーホール導体の断面形状にお
いて、該スルーホール導体の径が基板の厚み方向に対し
て異なることを特徴とするスルーホール配線板。1) A through-hole wiring board characterized in that in the cross-sectional shape of the through-hole conductor formed on the board, the diameter of the through-hole conductor differs in the thickness direction of the board.
２）第１項記載のスルーホール導体の径が基板の上面か
ら下面に向って順次縮小することを特徴とするスルーホ
ール配線板。2) A through-hole wiring board according to item 1, wherein the diameter of the through-hole conductor gradually decreases from the top surface to the bottom surface of the board.
３）第１項記載のスルーホール導体の径が基板の最上面
及び最下面以外に少なくとも一つの極大値を有すること
を特徴とするスルーホール配線板。3) A through-hole wiring board according to item 1, wherein the diameter of the through-hole conductor has at least one maximum value at a location other than the top and bottom surfaces of the board.
４）第１項記載のスルーホール導体の径が基板の最上面
及び最下面以外に少なくとも一つの極小値を有すること
を特徴とするスルーホール配線板。4) A through-hole wiring board according to item 1, wherein the diameter of the through-hole conductor has at least one minimum value at a portion other than the top and bottom surfaces of the board.
５）第１項乃至第４項記載の基板が無機質からなる絶縁
基材であることを特徴とするスルーホール配線板。5) A through-hole wiring board, characterized in that the substrate according to items 1 to 4 is an insulating base material made of an inorganic material.
６）第１項乃至第４項記載の基板が有機質からなる絶縁
基材であることを特徴とするスルーホール配線板。6) A through-hole wiring board, characterized in that the substrate according to items 1 to 4 is an insulating base material made of an organic material.
７）第１項乃至第６項記載のスルーホールにおいて、基
板裏面のスルーホール部に設置するリードビン接続部の
径がスルーホールの仕置上であることを特徴とするスル
ーホール配線板。7) A through-hole wiring board according to items 1 to 6, wherein the diameter of the lead bin connecting portion installed in the through-hole portion on the back side of the board is equal to the diameter of the through-hole.
８）第７項記載の接続部にリートピンが接続されている
ことを特徴とするスルーホール配線板。8) A through-hole wiring board, characterized in that a lead pin is connected to the connection portion according to item 7.
９）次のイ）〜ホ）の工程からなることを特徴とするス
ルーホール配線板の製造方法。9) A method for manufacturing a through-hole wiring board, characterized by comprising the following steps a) to e).
イ）基板に該基板の厚み方向に対してスルーホールの径
が異なるようにスルーホールを形成する工程、
口）該スルーホールに導体ペーストを印刷してスルーホ
ール導体を形成する工程、
ハ）該スルーホール導体の下部に導体ペーストを印刷し
てリードピン接続部を形成する工程、二）このようにし
て得られた基板を焼成する工程、
ホ）焼成して得られた基板のり−ドピン接続部にリード
ピンを接続してリードピンを有するスルーホール配線板
を得る工程、
以下、本発明を更に具体的に説明する。B) A process of forming through holes in the board so that the diameter of the through holes differs in the thickness direction of the board; H) A process of printing conductive paste on the through holes to form through-hole conductors; C) A process of forming through-hole conductors in the through-holes. A step of printing a conductor paste on the lower part of the through-hole conductor to form a lead pin connection part, 2) A step of firing the board obtained in this way, and 5) A process of printing the board paste obtained by baking and forming a lead pin connection part. The process of connecting lead pins to obtain a through-hole wiring board having lead pins.The present invention will be described in more detail below.
本発明は、スルーホールの径を基板の厚み方向に対して
異なるように形成することにより、スルーホール内に形
成された導体と接続されたリードピンが該導体と一緒に
抜は落ちることがないという優れた効果を有するもので
ある。The present invention prevents the lead pins connected to the conductor formed in the through hole from falling out together with the conductor by forming the diameter of the through hole to be different in the thickness direction of the board. It has excellent effects.
本発明に用いられるスルーホールの断面形状は、後述の
実施例から明らかなように種々の構造のものがある。The cross-sectional shape of the through-hole used in the present invention has various structures, as will be clear from the examples described later.
本発明に用いられる基板の材質には無機質又は有機質の
種々のものが用いられ、無機質では、例えばセラミック
基板として、アルミナ、窒化アルミニウム、ベリリア、
炭化硅素、ムライト、コージエライト等、ホーロー基板
、メタルコア基板等が挙げられ、また有機質のものでは
、紙フエノール基板、紙エポキシ基板、ガラスエポキシ
基板、ポリイミド樹脂基板等が挙げられる。Various inorganic or organic materials are used for the substrate used in the present invention. Examples of inorganic materials include alumina, aluminum nitride, beryllia, and ceramic substrates.
Examples include silicon carbide, mullite, cordierite, etc., hollow substrates, metal core substrates, etc. Organic substrates include paper phenol substrates, paper epoxy substrates, glass epoxy substrates, polyimide resin substrates, etc.
本発明に用いられるスルーホール導体は、スルーホール
に導体ペースト（厚膜導体）が充填されるが、該導体ペ
ーストは金属及びガラスフリットを含み、金属としては
、例えば金、銀、白金、銅、アルミニウム、及びそれら
の合金等が用いられる。In the through-hole conductor used in the present invention, the through-hole is filled with a conductor paste (thick film conductor), and the conductor paste contains metal and glass frit, and examples of the metal include gold, silver, platinum, copper, Aluminum, alloys thereof, etc. are used.
また接続部（パッド）は導体ペーストを印刷して形成さ
れるが、この導体ペーストはスルーホールに充填される
導体ペーストと同種のものが用いられる。Further, the connection portion (pad) is formed by printing a conductive paste, and this conductive paste is of the same type as the conductive paste filled in the through holes.
本発明において、スルーホールに導体ペーストを充填す
る方法及び接続部の形成方法は、スクリーン印刷法が用
いられ、このスクリーン印刷法は、プリント配線技術の
分野において周知の方法である。In the present invention, a screen printing method is used as a method for filling the through hole with conductive paste and a method for forming a connection portion, and this screen printing method is a well-known method in the field of printed wiring technology.
本発明において、スルーホールの加工は、金型によるパ
ンチング、ドリルを用いる方法、レーザーを用いる方法
等が挙げられるが、このうち好ましくはレーザーを用い
る方法である。In the present invention, the through-holes can be processed by punching with a mold, by using a drill, by using a laser, etc. Among these, the method using a laser is preferred.
本発明に用いられるリードピンの種類等は特に制限はな
く、通常この技術分野で用いられるものである。The types of lead pins used in the present invention are not particularly limited, and are those commonly used in this technical field.
リードピンは、例えばろう付は等によって接続すること
ができる。The lead pins can be connected by, for example, brazing.
［作用］
本発明では、スルーホールの径を基板の厚み方向に対し
て異なるように形成したので、スルーホール内に形成さ
れた導体と接続されたリードピンが該導体と一緒に抜は
落ちることがなく、即ち弓き抜き強度の大きいものが得
られる。[Function] In the present invention, since the diameter of the through hole is formed to be different in the thickness direction of the board, the lead pin connected to the conductor formed in the through hole will not fall out together with the conductor. In other words, a product with high bow punching strength can be obtained.
またスルーホールの径よりも大きい径の接続部を有する
ので、いづれの方向にも脱落することがなく、−層引き
抜き強度が強化される。Furthermore, since the connecting portion has a diameter larger than the diameter of the through hole, it will not fall off in any direction, and the strength for pulling out the layer will be strengthened.
［実施例］
以下、本発明について、実施例を挙げて更に詳しく説明
するが、本発明は、これらの実施例に限定されるもので
はない。[Examples] Hereinafter, the present invention will be described in more detail with reference to Examples, but the present invention is not limited to these Examples.
以下、図面を参照しながら本発明を説明する。The present invention will be described below with reference to the drawings.
第１図は、本発明にかかるスルーホール導体を有する配
線板を示す断面図である。FIG. 1 is a sectional view showing a wiring board having through-hole conductors according to the present invention.
第２図は、第１図のスルーホール導体を有する配線板の
スルーホール接続部にリードピンを接続した構造を示す
断面図である。FIG. 2 is a cross-sectional view showing a structure in which lead pins are connected to through-hole connection portions of a wiring board having through-hole conductors shown in FIG. 1. FIG.
１は基板であり、２は本発明にかかるスルーホールであ
って、このスルーホール２は、基板１の上部から下部に
向ってスルーホール２の径が縮小している。またこのス
ルーホール２の内部には金属ペーストが印刷により充填
されて導体３を形成している。そしてこのスルーホール
２の下部には接続部４であるパッドが設けられている。1 is a substrate, and 2 is a through hole according to the present invention, and the diameter of the through hole 2 decreases from the top to the bottom of the substrate 1. Further, the inside of this through hole 2 is filled with metal paste by printing to form a conductor 3. A pad, which is a connecting portion 4, is provided below the through hole 2.
これによりスルーホール導体３は、強固に固定され、引
き抜き強度が大きくなるから、リードピン５が接続され
ても抜は落ちることがない。As a result, the through-hole conductor 3 is firmly fixed and has a high pull-out strength, so that even if the lead pin 5 is connected, the through-hole conductor 3 will not fall off.
第３図は、本発明のスルーホール配線板の製造方法を示
すフローシートであり、０．６３５＋＋＋＋ａの厚みを
有する９５％アルミナ基板１に２０Ｗの出力をもつ炭酸
ガスレーザーを用いて基板の上部よりも下部のスルーホ
ール径が縮小した形状のスルーホールを形成するように
スルーホール加工を行った。FIG. 3 is a flow sheet showing a method for manufacturing a through-hole wiring board according to the present invention. Through-hole processing was also performed to form a through-hole with a reduced diameter at the bottom.
この際、上面の孔径は直径２００μｍとし、下面の孔径
は直径１００μ０となるようにした。At this time, the pore diameter on the upper surface was set to 200 μm in diameter, and the pore diameter on the lower surface was set to 100 μm in diameter.
得られたスルーホールにＡｇ：Ｐｄ＝８０ ： ２０の
割合のガラスフリットを含有する厚膜導体をスクリーン
印刷法を用いて印刷することにより充填しスルーホール
導体３を形成した。ついで、この導体３を１５０℃、１
０分で乾燥した後、スルーホール径の小さい方の側に直
径４００μｍの導体パッドを同様にスクリーン印刷法を
用いて印刷し、乾燥して接続部４を形成した。The obtained through hole was filled with a thick film conductor containing glass frit in a ratio of Ag:Pd=80:20 by printing using a screen printing method to form a through hole conductor 3. Then, this conductor 3 was heated to 150°C for 1
After drying for 0 minutes, a conductor pad with a diameter of 400 μm was similarly printed on the side of the smaller through hole using the screen printing method, and dried to form a connecting portion 4.
続いて、これを８５０℃、１０分キープ、トータル６０
分の焼成プロファイルで焼成した。Next, keep this at 850℃ for 10 minutes, total 60℃.
Fired with a firing profile of 30 minutes.
このようにして得られた基板１の接続部４に直径３００
μｍのヘッドをもつリートピン５をＡｇ：Ｃｕ−７Ｌ２
８（重量比）の共晶組成をもつろう材により８００℃、
５分、窒素気流中でろう付けをした。得られたリードビ
ンは、上下方向の引き抜き強度に優れていた。The connecting portion 4 of the substrate 1 thus obtained has a diameter of 300 mm.
Ag:Cu-7L2 Riet pin 5 with μm head
800℃ by using a brazing material with a eutectic composition of 8 (weight ratio).
Brazing was performed in a nitrogen stream for 5 minutes. The obtained lead bin had excellent vertical pull-out strength.
本発明にかかるスルーホール導体の断面形状は、第４図
のａ ｚ ｆに示される種々の形状を有することができ
る。The cross-sectional shape of the through-hole conductor according to the present invention can have various shapes as shown in az f in FIG.
即ち、ａはスルーホール導体の断面形状が基板の上面と
下面の間で凹部曲線を有している場合であり、ｂは基板
の最上面及び最下面との間て凹部曲線（極大値）を有し
ている場合である。That is, a is a case where the cross-sectional shape of the through-hole conductor has a concave curve between the top and bottom surfaces of the substrate, and b is a case where the cross-sectional shape of the through-hole conductor has a concave curve (maximum value) between the top and bottom surfaces of the substrate. This is the case if you have one.
Ｃはスルーホール導体の断面形状が基板の上面と下面の
間で角状の凹部直線（８ｉ大値）を有している場合であ
る。C is a case where the cross-sectional shape of the through-hole conductor has an angular recess straight line (8i maximum value) between the upper surface and the lower surface of the substrate.
ｄは基板の最上面及び最下面においてスルーホールの径
が同じで上面と下面との間で凸部曲線（極小値）を有し
ている場合である。d is a case where the diameter of the through hole is the same on the top and bottom surfaces of the substrate and has a convex curve (minimum value) between the top and bottom surfaces.
ｅはスルーホール導体の断面形状が基板の上面と下面の
間で角状の凸部直線（極小値）を有している場合である
。e is a case where the cross-sectional shape of the through-hole conductor has an angular convex straight line (minimum value) between the upper surface and the lower surface of the substrate.
ｆは基板の最上面及び最下面においてスルーホールの径
が同じで上面と下面との間で波状曲線を有している場合
である。f is the case where the through holes have the same diameter on the top and bottom surfaces of the substrate and have a wavy curve between the top and bottom surfaces.
［発明の効果］
本発明では、スルーホール導体の断面形状が異なるよう
に形成したので、該導体と接続されたリードピンが脱落
したり、引き抜かれたりすることがなく、またリードピ
ン接続部を接続する方のスルーホール導体の径より大き
くしであるので、層の引き抜き強度に優れたスルーホー
ル配線板が得られる。[Effects of the Invention] In the present invention, since the through-hole conductors are formed to have different cross-sectional shapes, the lead pins connected to the conductors will not fall off or be pulled out, and the lead pin connection portions will not be connected. Since the diameter is larger than that of the other through-hole conductor, a through-hole wiring board with excellent layer pull-out strength can be obtained.
更に本発明の製造方法を用いることにより簡単かつ経済
的にスルーホール配線板が得られる。Furthermore, by using the manufacturing method of the present invention, a through-hole wiring board can be obtained simply and economically.
第１図は、本発明にかかるスルーホール導体を有する配
線板を示す断面図である。
第２図は、第１図のスルーホール導体を有する配線板の
スルーホール接続部にリードビンを接続した構造を示す
断面図である。
第３図は、本発明のスルーホール配線板の製造方法を示
すフローシートである。
第４図のａ〜ｆは、スルーホール導体の種々の断面形状
を示す断面図である。
符合の説明
１・・基板 ２・・スルーホール
３・・スルーホール導体
４・・接続部（バット）
５・・リートピンFIG. 1 is a sectional view showing a wiring board having through-hole conductors according to the present invention. FIG. 2 is a sectional view showing a structure in which a lead bin is connected to a through-hole connection portion of a wiring board having through-hole conductors shown in FIG. FIG. 3 is a flow sheet showing a method for manufacturing a through-hole wiring board of the present invention. 4A to 4F are cross-sectional views showing various cross-sectional shapes of through-hole conductors. Explanation of symbols 1... Board 2... Through hole 3... Through hole conductor 4... Connection part (butt) 5... Leat pin
Claims (1)
いて、該スルーホール導体の径が基板の厚み方向に対し
て異なることを特徴とするスルーホール配線板。 ２）請求項１記載のスルーホール導体の径が基板の上面
から下面に向って順次縮小することを特徴とするスルー
ホール配線板。 ３）請求項１記載のスルーホール導体の径が基板の最上
面及び最下面以外に少なくとも一つの極大値を有するこ
とを特徴とするスルーホール配線板。 ４）請求項１記載のスルーホール導体の径が基板の最上
面及び最下面以外に少なくとも一つの極小値を有するこ
とを特徴とするスルーホール配線板。 ５）請求項１乃至請求項４記載の基板が無機質からなる
絶縁基材であることを特徴とするスルーホール配線板。 ６）請求項１乃至請求項４記載の基板が有機質からなる
絶縁基材であることを特徴とするスルーホール配線板。 ７）請求項１乃至請求項６記載のスルーホールにおいて
、基板裏面のスルーホール部に設置するリードピン接続
部の径がスルーホールの径以上であることを特徴とする
スルーホール配線板。 ８）請求項７記載の接続部にリードピンが接続されてい
ることを特徴とするスルーホール配線板。 ９）次のイ）〜ホ）の工程からなることを特徴とするス
ルーホール配線板の製造方法。 イ）基板に該基板の厚み方向に対してスルーホールの径
が異なるようにスルーホールを形成する工程、 ロ）該スルーホールに導体ペーストを印刷してスルーホ
ール導体を形成する工程、 ハ）該スルーホール導体の下部に導体ペーストを印刷し
てリードピン接続部を形成する工程、ニ）このようにし
て得られた基板を焼成する工程、 ホ）焼成して得られた基板のリードピン接続部にリード
ピンを接続してリードピンを有するスルーホール配線板
を得る工程、[Scope of Claims] 1) A through-hole wiring board characterized in that in the cross-sectional shape of the through-hole conductor formed on the board, the diameter of the through-hole conductor differs in the thickness direction of the board. 2) A through-hole wiring board according to claim 1, wherein the diameter of the through-hole conductor gradually decreases from the top surface to the bottom surface of the substrate. 3) A through-hole wiring board according to claim 1, wherein the diameter of the through-hole conductor has at least one maximum value at a portion other than the top and bottom surfaces of the substrate. 4) A through-hole wiring board according to claim 1, wherein the diameter of the through-hole conductor has at least one minimum value at a portion other than the top and bottom surfaces of the substrate. 5) A through-hole wiring board, wherein the substrate according to any one of claims 1 to 4 is an insulating base material made of an inorganic material. 6) A through-hole wiring board, wherein the substrate according to any one of claims 1 to 4 is an insulating base material made of an organic material. 7) A through-hole wiring board according to any one of claims 1 to 6, wherein the diameter of the lead pin connecting portion installed in the through-hole portion on the back side of the substrate is greater than or equal to the diameter of the through-hole. 8) A through-hole wiring board, characterized in that a lead pin is connected to the connection portion according to claim 7. 9) A method for manufacturing a through-hole wiring board, characterized by comprising the following steps a) to e). b) Forming through holes in the board so that the diameters of the through holes differ in the thickness direction of the board; b) Printing conductive paste on the through holes to form through-hole conductors; c) Forming through-hole conductors. A step of printing a conductor paste on the lower part of the through-hole conductor to form a lead pin connection part, d) A step of firing the board obtained in this way, and e) A step of printing a lead pin in the lead pin connection part of the board obtained by firing. a step of connecting the through-hole wiring board with lead pins,
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27783990A JPH04154187A (en) | 1990-10-18 | 1990-10-18 | Structure of through hole wiring board and manufacture thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27783990A JPH04154187A (en) | 1990-10-18 | 1990-10-18 | Structure of through hole wiring board and manufacture thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04154187A true JPH04154187A (en) | 1992-05-27 |
Family
ID=17588985
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27783990A Pending JPH04154187A (en) | 1990-10-18 | 1990-10-18 | Structure of through hole wiring board and manufacture thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04154187A (en) |
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07170046A (en) * | 1993-09-22 | 1995-07-04 | Matsushita Electric Ind Co Ltd | Printed-wiring board and manufacture thereof |
| JP2003218525A (en) * | 2002-01-18 | 2003-07-31 | Fujitsu Ltd | Circuit board and its manufacturing method |
| JP2004111915A (en) * | 2002-07-11 | 2004-04-08 | Dainippon Printing Co Ltd | Multilayered wiring board and manufacturing method thereof |
| JP2007027706A (en) * | 2005-06-17 | 2007-02-01 | Nec Corp | Wiring board, manufacturing method therefor and semiconductor package |
| EP1988758A1 (en) * | 2006-02-22 | 2008-11-05 | Ibiden Co., Ltd. | Printed wiring board and process for producing the same |
| JP2012029166A (en) * | 2010-07-26 | 2012-02-09 | Seiko Instruments Inc | Package, method of manufacturing package, piezoelectric transducer, and oscillator |
| JP2015026746A (en) * | 2013-07-26 | 2015-02-05 | 新光電気工業株式会社 | Light-emitting element mounting package and light-emitting element package |
| WO2015076301A1 (en) * | 2013-11-21 | 2015-05-28 | 大日本印刷株式会社 | Through electrode substrate and semiconductor device using through electrode substrate |
| JP2016034030A (en) * | 2015-09-29 | 2016-03-10 | 大日本印刷株式会社 | Through-electrode substrate and method for manufacturing through-electrode substrate |
| JP2016054310A (en) * | 2015-11-20 | 2016-04-14 | 大日本印刷株式会社 | Through electrode substrate and semiconductor device using through electrode substrate |
| JP2016213253A (en) * | 2015-04-30 | 2016-12-15 | 大日本印刷株式会社 | Through electrode substrate and interposer using through electrode substrate and semiconductor device |
| JP2017041650A (en) * | 2016-11-15 | 2017-02-23 | 大日本印刷株式会社 | Through electrode substrate and semiconductor device using through electrode substrate |
| JP2021052193A (en) * | 2020-12-02 | 2021-04-01 | 大日本印刷株式会社 | Through-electrode substrate and semiconductor device |
| JP2022130437A (en) * | 2020-12-02 | 2022-09-06 | 大日本印刷株式会社 | Penetration electrode substrate and semiconductor device |
| US11728243B2 (en) | 2016-09-05 | 2023-08-15 | Dai Nippon Printing Co., Ltd. | Through electrode substrate and semiconductor device |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58197896A (en) * | 1982-05-14 | 1983-11-17 | 株式会社日立製作所 | Circuit board having through hole and method of producing same |
| JPS62183596A (en) * | 1986-02-07 | 1987-08-11 | カシオ計算機株式会社 | Manufacture of double-sided circuit board |
| JPH01143394A (en) * | 1987-11-30 | 1989-06-05 | Ngk Insulators Ltd | Ceramic package with lead |
| JPH0391291A (en) * | 1989-09-04 | 1991-04-16 | Toshiba Corp | Wiring board |
| JPH03136298A (en) * | 1989-10-20 | 1991-06-11 | Fujitsu Ltd | Manufacture of printed circuit board |
| JPH04105393A (en) * | 1990-08-24 | 1992-04-07 | Oki Electric Ind Co Ltd | Structure of via hole in ceramic multilayered board |
| JPH04504332A (en) * | 1989-10-30 | 1992-07-30 | ザ・フォックスボロ・カンパニー | Multilayer circuit board with microporous layer and method for manufacturing the same |
-
1990
- 1990-10-18 JP JP27783990A patent/JPH04154187A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58197896A (en) * | 1982-05-14 | 1983-11-17 | 株式会社日立製作所 | Circuit board having through hole and method of producing same |
| JPS62183596A (en) * | 1986-02-07 | 1987-08-11 | カシオ計算機株式会社 | Manufacture of double-sided circuit board |
| JPH01143394A (en) * | 1987-11-30 | 1989-06-05 | Ngk Insulators Ltd | Ceramic package with lead |
| JPH0391291A (en) * | 1989-09-04 | 1991-04-16 | Toshiba Corp | Wiring board |
| JPH03136298A (en) * | 1989-10-20 | 1991-06-11 | Fujitsu Ltd | Manufacture of printed circuit board |
| JPH04504332A (en) * | 1989-10-30 | 1992-07-30 | ザ・フォックスボロ・カンパニー | Multilayer circuit board with microporous layer and method for manufacturing the same |
| JPH04105393A (en) * | 1990-08-24 | 1992-04-07 | Oki Electric Ind Co Ltd | Structure of via hole in ceramic multilayered board |
Cited By (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07170046A (en) * | 1993-09-22 | 1995-07-04 | Matsushita Electric Ind Co Ltd | Printed-wiring board and manufacture thereof |
| US7678695B2 (en) | 2002-01-18 | 2010-03-16 | Fujitsu Limited | Circuit substrate and method for fabricating the same |
| JP2003218525A (en) * | 2002-01-18 | 2003-07-31 | Fujitsu Ltd | Circuit board and its manufacturing method |
| US7211899B2 (en) | 2002-01-18 | 2007-05-01 | Fujitsu Limited | Circuit substrate and method for fabricating the same |
| KR100870685B1 (en) * | 2002-01-18 | 2008-11-26 | 후지쯔 가부시끼가이샤 | Circuit substrate and method for fabricating the same |
| JP2004111915A (en) * | 2002-07-11 | 2004-04-08 | Dainippon Printing Co Ltd | Multilayered wiring board and manufacturing method thereof |
| JP2007027706A (en) * | 2005-06-17 | 2007-02-01 | Nec Corp | Wiring board, manufacturing method therefor and semiconductor package |
| US9029711B2 (en) | 2006-02-22 | 2015-05-12 | Ibiden Co., Ltd. | Method for manufacturing a printed wiring board having a through-hole conductor |
| EP1988758A4 (en) * | 2006-02-22 | 2011-03-23 | Ibiden Co Ltd | Printed wiring board and process for producing the same |
| US8101865B2 (en) | 2006-02-22 | 2012-01-24 | Ibiden Co., Ltd. | Printed wiring board and a method of production thereof |
| US8324506B2 (en) | 2006-02-22 | 2012-12-04 | Ibiden Co., Ltd. | Printed wiring board and a method of production thereof |
| US8890000B2 (en) | 2006-02-22 | 2014-11-18 | Ibiden Co., Ltd. | Printed wiring board having through-hole and a method of production thereof |
| EP1988758A1 (en) * | 2006-02-22 | 2008-11-05 | Ibiden Co., Ltd. | Printed wiring board and process for producing the same |
| JP2012029166A (en) * | 2010-07-26 | 2012-02-09 | Seiko Instruments Inc | Package, method of manufacturing package, piezoelectric transducer, and oscillator |
| JP2015026746A (en) * | 2013-07-26 | 2015-02-05 | 新光電気工業株式会社 | Light-emitting element mounting package and light-emitting element package |
| US10580727B2 (en) | 2013-11-21 | 2020-03-03 | Dai Nippon Printing Co., Ltd. | Through-hole electrode substrate |
| WO2015076301A1 (en) * | 2013-11-21 | 2015-05-28 | 大日本印刷株式会社 | Through electrode substrate and semiconductor device using through electrode substrate |
| US12080637B2 (en) | 2013-11-21 | 2024-09-03 | Dai Nippon Printing Co., Ltd. | Through-hole electrode substrate |
| US11362028B2 (en) | 2013-11-21 | 2022-06-14 | Dai Nippon Printing Co., Ltd. | Through-hole electrode substrate |
| JP2015103586A (en) * | 2013-11-21 | 2015-06-04 | 大日本印刷株式会社 | Through electrode substrate and semiconductor device using through electrode substrate |
| US10790221B2 (en) | 2013-11-21 | 2020-09-29 | Dai Nippon Printing Co., Ltd. | Through-hole electrode substrate |
| US10256176B2 (en) | 2013-11-21 | 2019-04-09 | Dai Nippon Printing Co., Ltd. | Through-hole electrode substrate and semiconductor device using through-hole electrode substrate |
| CN109616458A (en) * | 2013-11-21 | 2019-04-12 | 大日本印刷株式会社 | Through electrode substrate and the semiconductor device for utilizing through electrode substrate |
| JP2016213253A (en) * | 2015-04-30 | 2016-12-15 | 大日本印刷株式会社 | Through electrode substrate and interposer using through electrode substrate and semiconductor device |
| JP2016034030A (en) * | 2015-09-29 | 2016-03-10 | 大日本印刷株式会社 | Through-electrode substrate and method for manufacturing through-electrode substrate |
| JP2016054310A (en) * | 2015-11-20 | 2016-04-14 | 大日本印刷株式会社 | Through electrode substrate and semiconductor device using through electrode substrate |
| US11728243B2 (en) | 2016-09-05 | 2023-08-15 | Dai Nippon Printing Co., Ltd. | Through electrode substrate and semiconductor device |
| JP2017041650A (en) * | 2016-11-15 | 2017-02-23 | 大日本印刷株式会社 | Through electrode substrate and semiconductor device using through electrode substrate |
| JP2021052193A (en) * | 2020-12-02 | 2021-04-01 | 大日本印刷株式会社 | Through-electrode substrate and semiconductor device |
| JP2022130437A (en) * | 2020-12-02 | 2022-09-06 | 大日本印刷株式会社 | Penetration electrode substrate and semiconductor device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH04154187A (en) | Structure of through hole wiring board and manufacture thereof | |
| US4712161A (en) | Hybrid and multi-layer circuitry | |
| JP3765627B2 (en) | Multilayer circuit board and manufacturing method thereof | |
| JPS62216259A (en) | Manufacture and structure of hybrid integrated circuit | |
| JP2016219478A (en) | Wiring board and manufacturing method therefor | |
| US20020031642A1 (en) | Method for producing filled vias in electronic components | |
| EP0997941B1 (en) | Conductive paste and ceramic printed circuit substrate using the same | |
| JP4752612B2 (en) | Manufacturing method of circuit board with protruding electrode | |
| JP4683743B2 (en) | Wiring board manufacturing method | |
| US20050173152A1 (en) | Circuit board surface mount package | |
| JP2005150551A (en) | Method of manufacturing wiring board | |
| JPH09293968A (en) | Method of manufacturing multilayer wiring substrate | |
| JPH05206620A (en) | Metallic base circuit board | |
| US5992012A (en) | Method for making electrical interconnections between layers of an IC package | |
| CN214753834U (en) | Ceramic substrate and light-emitting device | |
| JPH06120633A (en) | Ceramic wiring board | |
| JP2020188134A (en) | Wiring substrate and manufacturing method of the same | |
| JP2002016176A (en) | Wiring board and connection structure therefor | |
| JPH05267496A (en) | Manufacture of ceramic wiring board | |
| JP2564297B2 (en) | Circuit board | |
| JPS59150495A (en) | Method of producing thick film circuit board | |
| JPH03240289A (en) | Manufacture of aluminum nitride substrate | |
| JPH05206598A (en) | Ceramic circuit board | |
| JPS6175596A (en) | Manufacture of through hole multilayer circuit board | |
| JPS60180151A (en) | Substrate with bump and manufacture thereof |