JPS62183596A - Manufacture of double-sided circuit board - Google Patents
Manufacture of double-sided circuit boardInfo
- Publication number
- JPS62183596A JPS62183596A JP2414986A JP2414986A JPS62183596A JP S62183596 A JPS62183596 A JP S62183596A JP 2414986 A JP2414986 A JP 2414986A JP 2414986 A JP2414986 A JP 2414986A JP S62183596 A JPS62183596 A JP S62183596A
- Authority
- JP
- Japan
- Prior art keywords
- flexible substrate
- metal foil
- wiring pattern
- double
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 8
- 239000000758 substrate Substances 0.000 claims description 38
- 229910052751 metal Inorganic materials 0.000 claims description 33
- 239000002184 metal Substances 0.000 claims description 33
- 239000011888 foil Substances 0.000 claims description 32
- 238000000034 method Methods 0.000 claims description 24
- 239000000853 adhesive Substances 0.000 claims description 22
- 230000001070 adhesive effect Effects 0.000 claims description 22
- 229920002120 photoresistant polymer Polymers 0.000 description 16
- 238000005530 etching Methods 0.000 description 14
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】 ［発明の技術分野１ この発明は両面回路基板の製造方法に関する。[Detailed description of the invention] [Technical field of invention 1 The present invention relates to a method for manufacturing a double-sided circuit board.
［従来技術とその問題点］
従来、基板の表面側に形成された配線パターンと裏面側
の配線パターンとを接続する場合には、基板にスルーホ
ールを形成し、このスルーホールの内壁面に金属等の導
電性材料をメッキし、このメッキにより表面側の配線パ
ターンと裏面側の配線パターンとの導通を図っている。[Prior art and its problems] Conventionally, when connecting a wiring pattern formed on the front side of a board to a wiring pattern on the back side, a through hole is formed in the board, and a metal is attached to the inner wall of the through hole. This plating is used to establish electrical continuity between the wiring pattern on the front side and the wiring pattern on the back side.
しかし、上記のようなメッキによる方法では、前処理工
程、無電解メッキ処理、電解メッキ処理等の多くの処理
工程が必要であるため、量産性が悪いという欠点があっ
た。However, the above-mentioned plating method requires many processing steps such as pretreatment, electroless plating, and electrolytic plating, so it has the disadvantage of poor mass productivity.
［発明の目的］
この発明は上記のような事情を考慮してなされたもので
、その目的とするところは、量産性の良い両面回路基板
の製造方法を提供することにある。[Object of the Invention] The present invention has been made in consideration of the above-mentioned circumstances, and its object is to provide a method for manufacturing a double-sided circuit board that can be easily mass-produced.
［発明の要点］
この発明は上記のような目的を達成するために、片面に
配線パターンが形成された基板の所定箇所にスルーホー
ルを形成し、反対側の裏面にスルーホールを含む部分を
覆う金属箔を固着し、この後、スルーホール内に導電性
接着剤を充填して前記配線パターンと前記金属箔との導
通を図るようにしたことを要点とする。[Summary of the Invention] In order to achieve the above-mentioned object, the present invention forms through holes at predetermined locations on a substrate with a wiring pattern formed on one side, and covers the portion including the through holes on the back side of the opposite side. The key point is that the metal foil is fixed, and then a conductive adhesive is filled in the through hole to establish electrical continuity between the wiring pattern and the metal foil.
［実施例］
以下、図面を参照して、この発明の一実施例を説明する
。[Example] Hereinafter, an example of the present invention will be described with reference to the drawings.
第１図（Ａ）〜（Ｄ）は両面回路基板の製造状態の要部
を示し、第２図から第４図はその製造工程を示し、第５
図は完成した両面回路基板を示す。第２図において、１
はロール状に巻かれたフレキシブル基板である。このフ
レキシブル基板ｌはポリエステル、ポリイミド、塩化ビ
ニル、ガラスエポキシ等のフィルムからなり、ロール状
に巻き取られている。このフレキシブル基板ｌは上下一
対のローラ２ａ、２ｂからなる第１のラミネート工程に
送られて、金属箔３がラミネートされる。即ち、金属箔
３は銅（Ｃｕ） 、ニッケル（Ｎｉ） 、アルミ（ＡＩ
）等からなり、その下面には接着剤３ａが塗布され、上
面には離型紙３ｂが剥離可能に接着されており、この状
態でロール状に巻かれてフレキシブル基板ｌの上方に配
置されている。そして、この金属箔３はフレキシブル基
板ｌと共にローラ２ａ、２ｂ間に送り込まれ、接着剤３
ａによりフレキシブル基板１の上面に接着される。この
とき、離型紙３ｂは金属箔３から剥離されてロール状に
巻き取られる。Figures 1 (A) to (D) show the main parts of the manufacturing state of the double-sided circuit board, Figures 2 to 4 show the manufacturing process, and Figure 5
The figure shows the completed double-sided circuit board. In Figure 2, 1
is a flexible substrate wound into a roll. This flexible substrate 1 is made of a film of polyester, polyimide, vinyl chloride, glass epoxy, etc., and is wound up into a roll. This flexible substrate 1 is sent to a first laminating process consisting of a pair of upper and lower rollers 2a and 2b, and a metal foil 3 is laminated thereon. That is, the metal foil 3 is made of copper (Cu), nickel (Ni), aluminum (AI).
), an adhesive 3a is applied to the lower surface, and a release paper 3b is removably adhered to the upper surface, and in this state it is wound into a roll and placed above the flexible substrate l. . Then, this metal foil 3 is sent between the rollers 2a and 2b together with the flexible substrate l, and the adhesive 3
It is adhered to the upper surface of the flexible substrate 1 by a. At this time, the release paper 3b is peeled off from the metal foil 3 and wound up into a roll.
このように金属箔３がラミネートされたフレキシブル基
板ｌは第１の感光工程に送られる。この感光工程は金属
箔３の表面にフォトレジスト膜を形成し、このフォトレ
ジスト膜上にマスク４を配置した後、その上方の光源５
で光を照射して、フォトレジスト膜を感光する。The flexible substrate 1 on which the metal foil 3 is laminated in this manner is sent to a first photosensitive step. In this exposure process, a photoresist film is formed on the surface of the metal foil 3, a mask 4 is placed on the photoresist film, and a light source 5 is placed above the mask 4.
The photoresist film is exposed to light by irradiating it with light.
そして、フォトレジスト膜上からマスク４を取り外した
後、フレキシブル基板１は第１のエツチング処理工程に
送られる。このエツチング処理工程はフレキシブル基板
ｌをエツチング槽６内に浸し、フォトレジスト膜および
金属箔３を化学的にエツチングする工程であり第２図で
は１工程として図示するが、実際には次の３つの工程か
らなる。すなわち、先ず、フレキシブル基板ｌをエツチ
ング槽６内に浸して、フォトレジスト膜の感光による未
硬化部分をエツチングし、この後フォトレジスト膜のエ
ツチングされた部分と対応する部分の金属箔３をエツチ
ングし、次いで、フォトレジスト膜の硬化部分をエツチ
ングして金属箔３の表面から除去する。After removing the mask 4 from above the photoresist film, the flexible substrate 1 is sent to a first etching process. This etching process is a process in which the flexible substrate l is immersed in an etching tank 6 and the photoresist film and metal foil 3 are chemically etched. Although it is shown as one process in FIG. 2, it actually involves the following three steps. Consists of processes. That is, first, the flexible substrate l is immersed in the etching tank 6, and the uncured portion of the photoresist film is etched by exposure to light, and then the metal foil 3 in the portion corresponding to the etched portion of the photoresist film is etched. Then, the hardened portion of the photoresist film is removed from the surface of the metal foil 3 by etching.
このようにエツチング処理されたフレキシブル基板ｌは
、洗浄されてエツチング槽６内から取り出されると、第
１図（Ａ）に示すように、フレキシブル基板ｌの上面に
金属箔３からなる配線パターン７が形成される。この後
、フレキシブル基板ｌは穿孔工程に送られ、所定箇所に
スルーホール９・・・が形成される。即ち、下面に針８
ａ・拳Φが植設された治具８を上方から押え付けること
により、第１図（Ｂ）に示すように、フレキシブル基板
１にスルーホール９・・・が配線パターン７の所定箇所
を通り、その上面から下面に貫通して形成される。この
場合、スルーホール９・・拳はそれぞれ、上側が大きく
、下側が若干小さいテーバ状の小孔になっている。When the flexible substrate l thus etched is cleaned and taken out from the etching tank 6, a wiring pattern 7 made of metal foil 3 is formed on the upper surface of the flexible substrate l, as shown in FIG. 1(A). It is formed. After this, the flexible substrate 1 is sent to a drilling process, and through holes 9 are formed at predetermined locations. That is, the needle 8 is on the bottom surface.
a. By pressing down the jig 8 in which the fist Φ is implanted from above, the through holes 9 ... pass through the predetermined locations of the wiring pattern 7 in the flexible substrate 1, as shown in FIG. 1(B). , is formed to penetrate from the upper surface to the lower surface. In this case, each of the through holes 9 and the fist is a small tapered hole that is larger on the upper side and slightly smaller on the lower side.
このようにスルーホール９・・・が形成されたフレキシ
ブル基板ｌは上下一対のローラｌＯａ、１０ｂからなる
第２のラミネート工程に送られて、その下面に金属箔１
１が上述と同様にラミネートされる。即ち、この金属箔
１１は銅（Ｃｕ）、ニッケル（Ｘｉ） 、アルミ（ＡＩ
）等からなり、その上面には導電性接着剤１１ａが塗布
され、下面には離型紙１１ｂが剥離可能に接着され、こ
の状態でロール状に巻かれてフレキシブル基板１の下側
に配置されており、フレキシブル基板１と共にローラｌ
Ｏａ、ｌＯｂ間に送り込まれ、導電性接着剤１１ａによ
りフレキシブル基板ｌの下面に接着される。このとき、
離型紙ｆｌｂは金属箔１１から剥離されてロール状に巻
き取られる。また、金属箔１１が接着されたフレキシブ
ル基板ｌは、一度ロール状に巻き取られる。 き取ら
れる。The flexible substrate l with the through holes 9 formed in this way is sent to a second laminating process consisting of a pair of upper and lower rollers lOa and 10b, and a metal foil 1 is placed on the lower surface of the flexible substrate l.
1 is laminated in the same manner as described above. That is, this metal foil 11 is made of copper (Cu), nickel (Xi), aluminum (AI).
), a conductive adhesive 11a is applied to the upper surface, and a release paper 11b is removably adhered to the lower surface, and in this state, it is wound into a roll and placed under the flexible substrate 1. The roller l along with the flexible substrate 1
It is sent between Oa and lOb and adhered to the lower surface of the flexible substrate l with a conductive adhesive 11a. At this time,
The release paper flb is peeled off from the metal foil 11 and wound up into a roll. Further, the flexible substrate 1 to which the metal foil 11 is adhered is once wound up into a roll. It is taken away.
このように巻き取られたフレキシブル基板１は、第３図
に示すように、表裏面が反転して引出されて第２の感光
工程に送られる。この感光工程では裏面側（図では上面
側）の金属箔１１の上面にフォトレジスト膜を形成し、
このフォトレジスト膜上にマスク１２を配置した後、そ
の上方の光源１３で光を照射して、フォトレジスト膜を
感光する。As shown in FIG. 3, the flexible substrate 1 wound up in this manner is pulled out with its front and back surfaces turned over and sent to a second photosensitive step. In this exposure process, a photoresist film is formed on the top surface of the metal foil 11 on the back side (top side in the figure),
After placing a mask 12 on this photoresist film, light is irradiated from a light source 13 above the mask 12 to expose the photoresist film.
そして、フォトレジスト膜上からマスク１２が取り外さ
れた後、第２のエツチング処理工程に送られる。このエ
ツチング処理工程は上述と同様に、フレキシブル基板１
のフォトレジスト膜および金属箔１１を化学的にエツチ
ングする工程であり、表面側（図では下面側）の配線パ
ターンが除去されるのを防止するためエツチング槽６を
用いずに、エツチング液をノズル１４で噴射することに
より行われる。この第２のエツチング処理工程も第１の
エツチング処理工程と同様であり、まず、フォトレジス
ト膜の感光による未硬化部分をエツチングし、この後フ
ォトレジスト膜のエツチングされた部分と対応する部分
の金属箔１１をエツチングし、次いで、フォトレジスト
膜の硬化部分をエツチングして金属箔１１の表面から除
去する。After the mask 12 is removed from above the photoresist film, the film is sent to a second etching process. This etching process is performed in the same manner as described above.
This is a process of chemically etching the photoresist film and metal foil 11, and in order to prevent the wiring pattern on the front side (lower side in the figure) from being removed, the etching liquid is applied through a nozzle without using the etching bath 6. This is done by injecting at 14. This second etching treatment step is also similar to the first etching treatment step; first, the uncured portion of the photoresist film is etched by exposure to light, and then the metal of the portion of the photoresist film corresponding to the etched portion is etched. The foil 11 is etched and the hardened portion of the photoresist film is then etched away from the surface of the metal foil 11.
このようにエツチング処理されたフレキシブル基板ｌは
、洗浄されると、第１図（Ｃ）に示すように、フレキシ
ブル基板ｌの下面に金属箔１１からなる配線パターン１
５が形成され、再びロール状に巻き取られる。When the flexible substrate l thus etched is cleaned, a wiring pattern 1 made of metal foil 11 is formed on the lower surface of the flexible substrate l, as shown in FIG. 1(C).
5 is formed and wound up again into a roll.
この巻き取られたフレキシブル基板１は第４図に示すよ
うに、その表裏面を再び反転させて印刷工程に送られる
。この印刷工程はフレキシブル基板ｌに形成されたスル
ーホール９・・・内に導電性接着剤１６を充填する工程
であり、フレキシブル基板１の上にマスク１７を配置し
、スキージ１８によりこのマスク１７を通してスルーホ
ール９・・・内に導電性接着剤１６が印刷される。この
導電性接着剤１６はフレキシブル基板ｌの表裏面に形成
された所定の配線パターン７．１５を相互に導通するも
のである。この場合、導電性接着剤１６はスルーホール
９・・・の開口側が上になっているので、良好に充填さ
れる。As shown in FIG. 4, this wound flexible substrate 1 is turned over again and sent to a printing process. This printing process is a process of filling the conductive adhesive 16 into the through holes 9 formed in the flexible substrate 1. A mask 17 is placed on the flexible substrate 1, and the mask 17 is passed through with a squeegee 18. A conductive adhesive 16 is printed inside the through holes 9. This conductive adhesive 16 connects predetermined wiring patterns 7.15 formed on the front and back surfaces of the flexible substrate 1 to each other. In this case, the conductive adhesive 16 is filled satisfactorily because the opening side of the through hole 9 faces upward.
この後、フレキシブル基板１は乾燥工程に送られ、光源
１９により導電性接着剤１６が乾燥されると、第１図（
Ｄ）および第５図に示すように、両面に配線パターン７
．１５が形成され、その両者の所定箇所が導通したフレ
キシブル基板ｌが得られる。このようにして得られたフ
レキシブル基板ｌは第５図に示すように、ロール状に巻
き取られるか、あるいは同図に２点鎖線で示す位置で切
断され、各基板毎に順次分割される。After that, the flexible substrate 1 is sent to a drying process, and the conductive adhesive 16 is dried by the light source 19, as shown in FIG.
D) and the wiring pattern 7 on both sides as shown in FIG.
．． 15 is formed, and a flexible substrate l is obtained in which predetermined portions of both are electrically connected. As shown in FIG. 5, the flexible substrate l obtained in this way is wound up into a roll or is cut at the positions indicated by the two-dot chain lines in the same figure, and is sequentially divided into individual substrates.
しかるに、上記のような両面回路基板め製造方法によれ
ば、フレキシブル基板ｌのスルーホール９・・・に導電
性接着剤１６をマスク印刷により充填するようにしたの
で、従来のような高度なメッキ技術を必要とする大掛か
りなメッキ装置が不要となり、簡単な印刷装置で、導電
性接着剤１６を良好に充填することができると共に、表
裏面の配線パターン７．１５を確実に導通することがで
き、しかも、歩留りが良く、量産性の向上を図ることが
できる。この場合、片面に配線パターン７が形成された
フレキシブル基板ｌの所定箇所にスルーホール９・・・
を形成した後、裏面にスルーホール９・・・を含む部分
を覆う配線パターン１５を接着し、この後、スルーホー
ル９・・・内に導電性接着剤１６を充填するようにした
ので、導電性接着剤１６が印刷時に漏れたりすることが
なく、均一にスルーホール９・会・内に充填することが
できる。However, according to the method for manufacturing double-sided circuit boards as described above, the conductive adhesive 16 is filled into the through-holes 9 of the flexible board 1 by mask printing, so that high-level plating as in the conventional method is not possible. A large-scale plating device that requires technology is not required, and a simple printing device can satisfactorily fill the conductive adhesive 16, and also ensure continuity between the wiring patterns 7 and 15 on the front and back surfaces. Moreover, the yield is good and mass productivity can be improved. In this case, through holes 9 are formed at predetermined locations on a flexible substrate l having a wiring pattern 7 formed on one side.
After forming, a wiring pattern 15 covering the portion including the through holes 9 was adhered to the back surface, and then a conductive adhesive 16 was filled in the through holes 9, so that the conductive The adhesive 16 does not leak during printing and can be evenly filled into the through hole 9.
なお、上述した実施例では、フレキシブル基板ｌの裏面
に金属箔１１をラミネートし、この金属箔１１を第２の
感光工程および第２のエツチング処理工程を経て配線パ
ターン１５に形成したが、この発明はこれに限られるこ
となく、ベースフィルム上に配線パターン状に形成され
た金属箔をフレキシブル基板ｌに熱転写しても良い。こ
の場合、配線パターンはジャンパ機能、つまりスルーホ
ール９・０・間を接続するリードパターンだけの場合を
含む。In the above-described embodiment, the metal foil 11 was laminated on the back surface of the flexible substrate l, and the metal foil 11 was formed into the wiring pattern 15 through the second photosensitive process and the second etching process. However, the present invention is not limited to this, and a metal foil formed in the shape of a wiring pattern on a base film may be thermally transferred to the flexible substrate l. In this case, the wiring pattern includes only a jumper function, that is, a lead pattern connecting through holes 9 and 0.
さらに、表面側の配線パターンは金属箔の場合で説明し
たが、これは導電性インクを印刷によって形成すること
もできる。Furthermore, although the wiring pattern on the front side has been described using metal foil, it can also be formed by printing conductive ink.
また、上述し〆実施例では、フレキシブル基板ｌの裏面
に金属箔１１を接着するものとして導電性接着剤１１ａ
を用いたが、絶縁性の接着剤を用いても良い、この場合
には、金属箔１１の全面に絶縁性の接着剤を設けず、ス
ルーホール９・・・と対応する部分を除いて設ければ良
く、また、接着剤層が極めて薄い（充填用の導電性接着
剤１６中の導電粒子よりも薄い）ものであれば、導通不
良の心配はない。In addition, in the above-mentioned embodiment, the conductive adhesive 11a is used to bond the metal foil 11 to the back surface of the flexible substrate l.
However, an insulating adhesive may also be used. In this case, the insulating adhesive is not applied to the entire surface of the metal foil 11, but is applied except for the parts corresponding to the through holes 9... Moreover, if the adhesive layer is extremely thin (thinner than the conductive particles in the conductive adhesive 16 for filling), there is no fear of poor conduction.
さらに、充填用の導電性接着剤１６は印刷によらず、点
滴により充填しても良いことは勿論である。Furthermore, it goes without saying that the conductive adhesive 16 for filling may be filled by dripping instead of by printing.
［発明の効果］
以上説明したように、この発明は片面に配線パターンが
形成された基板の所定箇所にスルーホールを形成し、反
対側の裏面にスルーホールを含む部分を覆う金属箔を固
着し、この後、スルーホール内に導電性接着剤を充填し
て前記配線パターンと前記金属箔との導通を図るように
したので、簡単な方法で、容易にかつ良好に製作するこ
とができ、しかも歩留りが良く、量産性の向上を図るこ
とができる。[Effects of the Invention] As explained above, the present invention forms through holes at predetermined locations on a substrate with a wiring pattern formed on one side, and fixes a metal foil covering the portion including the through holes to the back side of the opposite side. After that, a conductive adhesive is filled into the through hole to establish electrical continuity between the wiring pattern and the metal foil, so it can be easily and satisfactorily manufactured using a simple method. The yield is good and mass productivity can be improved.
図はこの発明の一実施例を示し、第１図（Ａ）〜（Ｄ）
は両面回路基板の製造状態の要部断面図、第２図から第
４図はその製造工程を示す図、第５図は完成した両面回
路基板を示す斜視図である。
ｌ・・・・・・フレキシブル基板、３．１１・・・・・
・金属箔、７．１５・・・・・・配線パターン、９・・
・・・・スルーホール、１６・・・・・・導電性接着剤
。
特許出願人 カシオ計算機株式会社
手続補正書
昭和６１年３月４日The figures show one embodiment of this invention, and FIGS. 1(A) to (D)
2 to 4 are views showing the manufacturing process, and FIG. 5 is a perspective view showing the completed double-sided circuit board. l...Flexible board, 3.11...
・Metal foil, 7.15...Wiring pattern, 9...
...Through hole, 16... Conductive adhesive. Patent applicant Casio Computer Co., Ltd. Procedural amendment dated March 4, 1986
Claims (1)
ルーホールを形成する工程と、反対側の裏面に少なくと
も前記スルーホールを含む部分を覆う金属箔を固着する
工程と、前記スルーホール内に導電性接着剤を充填して
前記配線パターンと前記金属箔とを導通する工程とを含
むことを特徴とする両面回路基板の製造方法。A step of forming a through hole at a predetermined location of a substrate with a wiring pattern formed on one side, a step of fixing a metal foil covering at least a portion including the through hole on the back side of the opposite side, and a step of forming a conductive layer in the through hole. A method for manufacturing a double-sided circuit board, comprising the step of filling an adhesive to establish electrical continuity between the wiring pattern and the metal foil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61024149A JPH0728124B2 (en) | 1986-02-07 | 1986-02-07 | Double-sided circuit board manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61024149A JPH0728124B2 (en) | 1986-02-07 | 1986-02-07 | Double-sided circuit board manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62183596A true JPS62183596A (en) | 1987-08-11 |
| JPH0728124B2 JPH0728124B2 (en) | 1995-03-29 |
Family
ID=12130278
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61024149A Expired - Lifetime JPH0728124B2 (en) | 1986-02-07 | 1986-02-07 | Double-sided circuit board manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0728124B2 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04154187A (en) * | 1990-10-18 | 1992-05-27 | Mitsubishi Materials Corp | Structure of through hole wiring board and manufacture thereof |
| JP2002261413A (en) * | 2001-02-28 | 2002-09-13 | Fujikura Ltd | Flexible circuit board and method of manufacturing the same |
| JP2006095915A (en) * | 2004-09-30 | 2006-04-13 | Brother Ind Ltd | Inkjet head, relay substrate, compound substrate, method for producing inkjet head, and method for producing compound substrate |
| JP2010177471A (en) * | 2009-01-29 | 2010-08-12 | Sumitomo Electric Printed Circuit Inc | Flexible printed wiring board, manufacturing method thereof, and electronic apparatus |
| JP2017059801A (en) * | 2015-09-17 | 2017-03-23 | 東洋インキＳｃホールディングス株式会社 | Laminate for shielding electromagnetic waves, electromagnetic wave shield laminate, electronic device and method for manufacturing the same |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5498966A (en) * | 1978-01-20 | 1979-08-04 | Matsushita Electric Ind Co Ltd | Doubleesided printed circuit board and method of producing same |
| JPS58141594A (en) * | 1982-02-17 | 1983-08-22 | 株式会社東芝 | Method of connecting both sides of printed circuit board |
-
1986
- 1986-02-07 JP JP61024149A patent/JPH0728124B2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5498966A (en) * | 1978-01-20 | 1979-08-04 | Matsushita Electric Ind Co Ltd | Doubleesided printed circuit board and method of producing same |
| JPS58141594A (en) * | 1982-02-17 | 1983-08-22 | 株式会社東芝 | Method of connecting both sides of printed circuit board |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04154187A (en) * | 1990-10-18 | 1992-05-27 | Mitsubishi Materials Corp | Structure of through hole wiring board and manufacture thereof |
| JP2002261413A (en) * | 2001-02-28 | 2002-09-13 | Fujikura Ltd | Flexible circuit board and method of manufacturing the same |
| JP2006095915A (en) * | 2004-09-30 | 2006-04-13 | Brother Ind Ltd | Inkjet head, relay substrate, compound substrate, method for producing inkjet head, and method for producing compound substrate |
| JP2010177471A (en) * | 2009-01-29 | 2010-08-12 | Sumitomo Electric Printed Circuit Inc | Flexible printed wiring board, manufacturing method thereof, and electronic apparatus |
| JP2017059801A (en) * | 2015-09-17 | 2017-03-23 | 東洋インキＳｃホールディングス株式会社 | Laminate for shielding electromagnetic waves, electromagnetic wave shield laminate, electronic device and method for manufacturing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0728124B2 (en) | 1995-03-29 |
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| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |