JPH0415263U - - Google Patents
Info
- Publication number
- JPH0415263U JPH0415263U JP5513290U JP5513290U JPH0415263U JP H0415263 U JPH0415263 U JP H0415263U JP 5513290 U JP5513290 U JP 5513290U JP 5513290 U JP5513290 U JP 5513290U JP H0415263 U JPH0415263 U JP H0415263U
- Authority
- JP
- Japan
- Prior art keywords
- pins
- guide hole
- electronic component
- circuit board
- mounting structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 230000037431 insertion Effects 0.000 claims 1
- 238000003780 insertion Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- 239000006071 cream Substances 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本案に係る部品実装構造をＰＧＡに適
用した一例を示す斜視図、第２図はＰＧＡのプリ
ント基板への実装状態を示す要部正面図、第３図
は従来のＰＧＡの実装構造を示す斜視図、第４図
はそのＰＧＡのプリント基板への実装状態を示す
正面図である。
１０……ＰＧＡ（電子部品）、１１……他のピ
ン、１１Ａ，１１Ｂ，１１Ｃ……（ガイド）ピン
、ｄ……ガイドピンの突出長さ、１００……プリ
ント基板、１０１……面実装ランド、１０２Ａ，
１０２Ｂ，１０２Ｃ……ガイド孔、１０３Ａ，１
０３Ｂ，１０３Ｃ……はんだ付けランド、Ｃ……
クリームはんだ。
Fig. 1 is a perspective view showing an example of applying the component mounting structure according to the present invention to a PGA, Fig. 2 is a front view of main parts showing a state in which the PGA is mounted on a printed circuit board, and Fig. 3 is a conventional PGA mounting structure. FIG. 4 is a front view showing a state in which the PGA is mounted on a printed circuit board. 10...PGA (electronic component), 11...Other pins, 11A, 11B, 11C...(guide) pin, d...Protrusion length of guide pin, 100...Printed circuit board, 101...Surface mounting land , 102A,
102B, 102C...Guide hole, 103A, 1
03B, 103C...Soldering land, C...
Cream solder.
Claims (1)
Ａ（Ｐｉｎ Ｇｒｉｄ Ａｒｒａｙ）、その他の
リード挿入型電子部品のプリント基板への実装構
造において、前記電子部品のコーナ３ヶ所に配置
された３本のピンの長さを少なくとも前記基板の
厚さ分だけ他のピンよりも長く突出させる一方、
前記プリント基板の前記３本のピンとの対応部に
ガイド孔を貫通形成すると共に、該基板表面の前
記他のピンとの対応部にはんだ付けランドを形成
し、前記３本のピンを前記ガイド孔に挿入・位置
決めすると共に、前記他のピンを前記基板表面の
前記はんだ付けランドにリフローはんだ付けさせ
るようにして成る電子部品の実装構造。 (2) ガイド孔の少なくとも基板表面周囲にはん
だ付けランドを形成し、３本のピンを前記ガイド
孔に挿入・位置決めすると共に、該３本のピンを
前記基板表面側のはんだ付けランドにリフローは
んだ付けするようにして成る請求項(1)に記載の
電子部品の実装構造。[Scope of claims for utility model registration] (1) PG with multiple pins protruding from one side of the main body
A (Pin Grid Array), in a structure for mounting other lead insertion type electronic components on a printed circuit board, the length of the three pins arranged at three corners of the electronic component is at least equal to the thickness of the circuit board. While making it protrude longer than other pins,
A guide hole is formed through the printed circuit board at a portion corresponding to the three pins, and a soldering land is formed at a portion of the surface of the board corresponding to the other pin, and the three pins are inserted into the guide hole. A mounting structure for electronic components, in which the other pins are inserted and positioned, and the other pins are reflow soldered to the soldering lands on the surface of the substrate. (2) Form a soldering land around at least the board surface of the guide hole, insert and position three pins into the guide hole, and reflow solder the three pins to the soldering land on the board surface side. The electronic component mounting structure according to claim (1), wherein the electronic component mounting structure is configured such that the electronic component is attached.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5513290U JPH0415263U (en) | 1990-05-26 | 1990-05-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5513290U JPH0415263U (en) | 1990-05-26 | 1990-05-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0415263U true JPH0415263U (en) | 1992-02-06 |
Family
ID=31577815
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5513290U Pending JPH0415263U (en) | 1990-05-26 | 1990-05-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0415263U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0228990A (en) * | 1988-07-19 | 1990-01-31 | Seiko Epson Corp | Mounting system of semiconductor device |
-
1990
- 1990-05-26 JP JP5513290U patent/JPH0415263U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0228990A (en) * | 1988-07-19 | 1990-01-31 | Seiko Epson Corp | Mounting system of semiconductor device |
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