JPH0414914Y2 - - Google Patents
Info
- Publication number
- JPH0414914Y2 JPH0414914Y2 JP1987009828U JP982887U JPH0414914Y2 JP H0414914 Y2 JPH0414914 Y2 JP H0414914Y2 JP 1987009828 U JP1987009828 U JP 1987009828U JP 982887 U JP982887 U JP 982887U JP H0414914 Y2 JPH0414914 Y2 JP H0414914Y2
- Authority
- JP
- Japan
- Prior art keywords
- lead
- external connection
- chip
- type electronic
- notch
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007789 sealing Methods 0.000 claims description 21
- 238000005219 brazing Methods 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 description 8
- 238000011179 visual inspection Methods 0.000 description 8
- 238000005476 soldering Methods 0.000 description 7
- 238000005452 bending Methods 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 2
- 238000012790 confirmation Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000000007 visual effect Effects 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000009795 derivation Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Landscapes
- Details Of Resistors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987009828U JPH0414914Y2 (US06168655-20010102-C00055.png) | 1987-01-28 | 1987-01-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987009828U JPH0414914Y2 (US06168655-20010102-C00055.png) | 1987-01-28 | 1987-01-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63119231U JPS63119231U (US06168655-20010102-C00055.png) | 1988-08-02 |
| JPH0414914Y2 true JPH0414914Y2 (US06168655-20010102-C00055.png) | 1992-04-03 |
Family
ID=30795510
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987009828U Expired JPH0414914Y2 (US06168655-20010102-C00055.png) | 1987-01-28 | 1987-01-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0414914Y2 (US06168655-20010102-C00055.png) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2560869B2 (ja) * | 1989-04-27 | 1996-12-04 | 富士電機株式会社 | 二端子面実装形半導体装置 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6096817U (ja) * | 1983-12-08 | 1985-07-02 | 日本電気株式会社 | チツプ型電子部品 |
-
1987
- 1987-01-28 JP JP1987009828U patent/JPH0414914Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63119231U (US06168655-20010102-C00055.png) | 1988-08-02 |
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