JPH0414914Y2 - - Google Patents
Info
- Publication number
- JPH0414914Y2 JPH0414914Y2 JP1987009828U JP982887U JPH0414914Y2 JP H0414914 Y2 JPH0414914 Y2 JP H0414914Y2 JP 1987009828 U JP1987009828 U JP 1987009828U JP 982887 U JP982887 U JP 982887U JP H0414914 Y2 JPH0414914 Y2 JP H0414914Y2
- Authority
- JP
- Japan
- Prior art keywords
- lead
- external connection
- chip
- type electronic
- notch
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007789 sealing Methods 0.000 claims description 21
- 238000005219 brazing Methods 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 description 8
- 238000011179 visual inspection Methods 0.000 description 8
- 238000005476 soldering Methods 0.000 description 7
- 238000005452 bending Methods 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 2
- 238000012790 confirmation Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000000007 visual effect Effects 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000009795 derivation Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Details Of Resistors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
【考案の詳細な説明】
産業上の利用分野
本考案は、チツプ型電子部品、特にプリント基
板への半田付け状態を容易に目視検査することの
できるチツプ型電子部品に関連する。[Detailed Description of the Invention] Industrial Application Field The present invention relates to chip-type electronic components, particularly chip-type electronic components whose soldered state to a printed circuit board can be easily visually inspected.
従来の技術
現在使用される電気・電子部品には、例えば実
開昭60−96817号公報に示されるように、ダイオ
ード、トランジスタ又はIC等の能動素子及び抵
抗又はコンデンサ等の受動素子を構成する種々の
チツプ型電子部品があり、これらのチツプ型電子
部品は、公知の方法でプリント基板上に実装され
る。このようなチツプ型電子部品には、絶縁封止
体から一対のリードが反対方向に導出された同軸
リード型電子部品として形成されたものがある。BACKGROUND TECHNOLOGY Currently used electrical and electronic components include various active elements such as diodes, transistors, and ICs, and passive elements such as resistors and capacitors, as shown in Japanese Utility Model Application Publication No. 60-96817. There are several chip-type electronic components, and these chip-type electronic components are mounted on a printed circuit board by a known method. Some of these chip-type electronic components are formed as coaxial lead-type electronic components in which a pair of leads are led out in opposite directions from an insulating seal.
従来のチツプ型電子部品の一例を第５図につい
て説明する。第５図Ａは正面図、Ｂは底面図、Ｃ
は側面図である。チツプ型電子部品１は、絶縁封
止体２と、絶縁封止体２から互いに反対方向に導
出された板状の一対のリード電極３とを有する。
絶縁封止体２は、熱硬化性樹脂例えばエポキシ樹
脂よりなり、実質的に平面である四角形状の底面
２ａを有する。一対のリード電極３の各々は、絶
縁封止体２内に封止された半導体チツプ（図示せ
ず）に電気的に接続された導出部３ａと、導出部
３ａに連続する外部接続部３ｂとを有する。導出
部３ａは絶縁封止体２の底面２ａ以外の端面２ｂ
より導出される。リード電極３は絶縁封止体２に
沿つて折曲げられ、導出部３ａは端面２ｂに対面
すると共に、外部接続部３ｂは絶縁封止体２の底
面２ａに対面する。 An example of a conventional chip-type electronic component will be explained with reference to FIG. Figure 5 A is a front view, B is a bottom view, C
is a side view. The chip-type electronic component 1 has an insulating seal 2 and a pair of plate-shaped lead electrodes 3 led out from the insulating seal 2 in mutually opposite directions.
The insulating sealing body 2 is made of a thermosetting resin, such as an epoxy resin, and has a substantially flat square bottom surface 2a. Each of the pair of lead electrodes 3 has a lead-out portion 3a that is electrically connected to a semiconductor chip (not shown) sealed within the insulating sealing body 2, and an external connection portion 3b that is continuous with the lead-out portion 3a. has. The lead-out portion 3a is located on the end surface 2b of the insulating sealing body 2 other than the bottom surface 2a.
It is derived from The lead electrode 3 is bent along the insulating seal 2, the lead-out portion 3a faces the end surface 2b, and the external connection portion 3b faces the bottom surface 2a of the insulating seal 2.
考案が解決しようとする問題点
ところで、上記従来のチツプ型電子部品では、
プリント基板上に半田付けした場合に、半田付け
状態の目視確認に手間を必要としたり、目視確認
が困難又は不可能となることがある。即ち、チツ
プ型電子部品の接着状態は、半田付け接合部の周
辺に広がつた半田のツヤや量を目視で確認するこ
とによつてかなり的確に判断することができる。
従つて、半田付け状態の目視検査で接着状態を確
認することが多い。この目視検査を行う場合、プ
リント基板上に接着された従来のチツプ型電子部
品では、外部接続部３ｂの幅長l2が絶縁封止体２
の底面２ａの幅長ｌより小さいため、外部接続部
３ｂとプリント基板上の電極、即ちボンデイング
パツドとの接着部の半田付け状態を正面から目視
することが困難又は不可能となり、このため、狭
い視覚で側面から目視検査していた。従つて、チ
ツプ型電子部品１の両側に設けられた一対の外部
接続部３ｂの半田付け状態を目視検査する場合に
は、チツプ型電子部品１の両側から最低２回観察
しなければならなかつた。実際には、チツプ型電
子部品に隣接して他の部品をプリント基板上に半
田付けする隣接実装又は高密度実装が頻繁に行わ
れるが、このような実装状態の下では、側面から
の目視検査が困難又は不可能であつた。Problems that the invention attempts to solve By the way, the above conventional chip-type electronic components have
When soldering is performed on a printed circuit board, visual confirmation of the soldered state may require time and effort, or visual confirmation may be difficult or impossible. That is, the adhesion state of a chip-type electronic component can be determined fairly accurately by visually checking the gloss and amount of solder that has spread around the soldered joint.
Therefore, the adhesion state is often confirmed by visual inspection of the soldered state. When performing this visual inspection, in a conventional chip-type electronic component bonded on a printed circuit board, the width l 2 of the external connection part 3b is
Since the width l is smaller than the width l of the bottom surface 2a, it is difficult or impossible to visually observe the soldered state of the bonding part between the external connection part 3b and the electrode on the printed circuit board, that is, the bonding pad from the front. Visual inspection was performed from the side using narrow vision. Therefore, when visually inspecting the soldering state of the pair of external connections 3b provided on both sides of the chip-type electronic component 1, it is necessary to observe the chip-type electronic component 1 at least twice from both sides. . In practice, adjacent mounting or high-density mounting, in which other components are soldered onto a printed circuit board adjacent to chip-type electronic components, is often performed, but under such mounting conditions, visual inspection from the side is difficult. was difficult or impossible.
本考案は、プリント基板への半田付け状態を容
易に目視検査することのできるチツプ型電子部品
を提供することを目的とする。 An object of the present invention is to provide a chip-type electronic component whose soldering state to a printed circuit board can be easily visually inspected.
問題点を解決するための手段
本考案によるチツプ型電子部品は、底面、底面
から略直角にかつ互いに対向して伸びる一対の側
面及び底面から略直角にかつ互いに対向して伸び
る一対の端面を有する絶縁封止体と、絶縁封止体
の一対の端面の各々から導出されたリード電極と
を備えている。リード電極は、導出部と、導出部
に連続し且つ導出部の導出方向に直角か方向での
幅長が導出部の幅長よりも大きい板状の外部接続
部とを有する。絶縁封止体の一対の端面の各々と
底面との境界部分に第１の切欠部が形成されてい
る。絶縁封止体の側面の各々と端面の各々との境
界部分に第１の切欠部に連続する第２の切欠部が
形成されている。導出部の各々は対応する絶縁封
止体の端面に沿つて配置されている。外部接続部
に中央側は第１の切欠部内に配置されている。外
部接続部の端部の各々は第２の切欠部内に配置さ
れている。ろう材を介して外部接続部が外部電極
体に固着されたとき、ろう材が外部接続部の第２
の切欠部に配置された部分まではい上れる。Means for Solving the Problems The chip-type electronic component according to the present invention has a bottom surface, a pair of side surfaces extending substantially perpendicularly from the bottom surface and facing each other, and a pair of end surfaces extending substantially perpendicularly from the bottom surface and facing each other. It includes an insulating seal and a lead electrode led out from each of a pair of end faces of the insulating seal. The lead electrode has a lead-out portion and a plate-shaped external connection portion that is continuous with the lead-out portion and whose width in a direction perpendicular to the lead-out direction of the lead-out portion is larger than the width of the lead-out portion. A first notch is formed at a boundary between each of the pair of end faces and the bottom face of the insulating seal. A second notch continuous to the first notch is formed at a boundary between each side surface and each end surface of the insulating sealing body. Each of the lead-out portions is arranged along the end surface of the corresponding insulating sealing body. The central side of the external connection part is arranged in the first notch. Each of the ends of the external connections are disposed within the second cutout. When the external connection part is fixed to the external electrode body through the brazing material, the brazing material is attached to the second part of the external connection part.
You can climb up to the part located in the notch.
作 用
絶縁封止体の側面に対向する折り曲部が外部接
続部の両端部に形成されているので、半田が折曲
げ部に沿つてはい上がつた状態で電子部品を半田
付けできる。このためプリント基部のボンデイン
グパツドと外部接続部との半田付け状態をチツプ
型電子部品の正面又は上面から良好にかつ容易に
目視確認できる。また、従来よりもろう材の量を
増大して固着でき、プリント基板への接着力を強
化できる。更に、リード電極の外部接続部を切欠
部に収容できるので、外部接続部の絶縁封止体か
らの浮き上がりを抑制でき、電子部品をプリント
基板に容易に取付けることができる。Function Since bent portions facing the side surfaces of the insulating seal are formed at both ends of the external connection portion, electronic components can be soldered with the solder creeping up along the bent portions. Therefore, the soldering state between the bonding pad of the printed base and the external connection portion can be clearly and easily visually checked from the front or top surface of the chip-type electronic component. Additionally, it is possible to increase the amount of brazing filler metal than in the past to increase the adhesive strength to the printed circuit board. Furthermore, since the external connection portion of the lead electrode can be accommodated in the notch, lifting of the external connection portion from the insulating sealing body can be suppressed, and the electronic component can be easily attached to the printed circuit board.
実施例
以下、本考案の実施例を第１図〜第４図につい
て説明する。これらの図面では第５図に示す部分
と同一の個所については同一符号を付し、説明を
省略する。Embodiment Hereinafter, embodiments of the present invention will be described with reference to FIGS. 1 to 4. In these drawings, parts that are the same as those shown in FIG. 5 are designated by the same reference numerals, and explanations thereof will be omitted.
まず、第１図から第３図は本考案の実施例を示
し、第１図のチツプ型電子部品４は、リード電極
３を折曲げる前の状態にある。絶縁封止体２の底
面２ａの両辺に沿つて第１の切欠部２ｅを形成
し、第１の切欠部２ｅ内に外部接続部３ｃを収納
する。更に、底面２ａの両側に第２の切欠部２ｆ
を形成し、第２の切欠部２ｆ内に外部接続部３ｃ
の折曲げ部３ｄを収納する。このような構造にす
ると、外部接続部３が絶縁封止体２から実質的に
突出しないので、コンパクトなチツプ型電子部品
４を製造することができる。従来の外部接続部３
ｂに相当する外部接続部３ｃの幅長l3は、絶縁封
止体２の幅長ｌよりも大きい。リード電極３の折
曲げ加工を容易にするために、導出部３ａの幅長
l1は絶縁封止体２の幅長ｌの1/2以下としている。
第１図の状態から絶縁封止体２の端面２ｂ及び底
面２ａ更に側面２ｃ，２ｄに沿つてリード電極３
を折曲げると、外部接続部３ｃが絶縁封止体２の
底面２ａと側面２ｃ，２ｄに対面した第３図に示
すチツプ型電子部品４が得られる。なお、図面で
は隣接状態で図示するリード電極３と絶縁封止体
２とは実際には微かに離れている。第４図はチツ
プ型電子部品４をプリント基板５のボデイングパ
ツト６に半田７を介して接着した状態を示す。絶
縁封止体２の側面２ｃ，２ｄ側に屈曲する折曲げ
部３ｄが外部接続部３ｃの両端に形成されるの
で、充分な量の半田量を大きな付着面積に与え
て、チツプ型電子部品４を強固にプリント基板５
に接着することができる。また、半田７が第３図
に示すように、折曲げ部３ｄに沿つて半田７が上
方にはい上るので、チツプ型電子部品４の半田付
け状態をチツプ型電子部品４の正面及び上面から
目視できる。したがつて、半田付け状態の良否の
判定を良好にかつ容易に行える。なお、外部接続
部３ｃの両端に折曲げ部３ｄを形成しない場合に
は、絶縁封止体２の外側に半田７が広がり難いの
で、過剰量の半田７を使用しないと正面及び上面
からの半田付け状態の目視は不可態となる。 First, FIGS. 1 to 3 show an embodiment of the present invention, and the chip-type electronic component 4 in FIG. 1 is in a state before the lead electrodes 3 are bent. A first cutout 2e is formed along both sides of the bottom surface 2a of the insulating seal 2, and the external connection portion 3c is housed in the first cutout 2e. Furthermore, second notches 2f are provided on both sides of the bottom surface 2a.
is formed, and an external connection portion 3c is formed within the second cutout portion 2f.
The bent portion 3d of is stored. With such a structure, the external connection portion 3 does not substantially protrude from the insulating seal 2, so that a compact chip-type electronic component 4 can be manufactured. Conventional external connection part 3
The width l 3 of the external connection portion 3c corresponding to b is larger than the width l of the insulating sealing body 2. In order to facilitate the bending process of the lead electrode 3, the width of the lead-out portion 3a is
l 1 is set to 1/2 or less of the width l of the insulating sealing body 2.
From the state shown in FIG. 1, the lead electrode 3
By bending, a chip-type electronic component 4 as shown in FIG. 3 is obtained in which the external connection portion 3c faces the bottom surface 2a and side surfaces 2c and 2d of the insulating sealing body 2. Note that the lead electrode 3 and the insulating sealing body 2, which are shown adjacent to each other in the drawings, are actually slightly separated from each other. FIG. 4 shows a state in which a chip-type electronic component 4 is bonded to a body pad 6 of a printed circuit board 5 via a solder 7. As shown in FIG. Since bent portions 3d that are bent toward the side surfaces 2c and 2d of the insulating sealing body 2 are formed at both ends of the external connection portion 3c, a sufficient amount of solder can be applied to a large adhesion area and the chip-type electronic component 4 Solidify the printed circuit board 5
Can be glued to. Furthermore, as the solder 7 creeps upward along the bent portion 3d as shown in FIG. can. Therefore, it is possible to judge whether the soldering condition is good or bad easily and satisfactorily. Note that if the bent portions 3d are not formed at both ends of the external connection portion 3c, it is difficult for the solder 7 to spread to the outside of the insulating sealing body 2, so if an excessive amount of solder 7 is not used, soldering from the front and top surfaces will not occur. Visual inspection of the attached state is impossible.
本考案の実施例は、同一技術思想の範囲内で
種々の変更が可能である。第１図〜第３図に示す
第１実施例において、外部接続部３ｃの幅長l3を
更に延長して絶縁封止体２の側面に巻き付け、外
部接続部３ｃで絶縁封止体２の略全周を囲んでも
よい。外部接続部３ｃを絶縁封止体２に巻き付け
た構造では、どの側面でも接着面として使用でき
るので、接着面の自由度が増加する利点がある。
上記実施例では、絶縁封止体２の断面形状を四角
形としたが、底面２ａが全体として概略四角形状
であると共に、外部接続部３ｃと対面する部分の
底面２ａが実質的に平面状であれば、それ以外の
形状、例えば六角形断面としてもよい。また、チ
ツプ型電子部品としては、半導体のみならず、抵
抗体やコンデンサも使用することができる。 The embodiments of the present invention can be modified in various ways within the scope of the same technical idea. In the first embodiment shown in FIGS. 1 to 3, the width l 3 of the external connection portion 3c is further extended and wrapped around the side surface of the insulation sealing body 2, and the external connection portion 3c is connected to the insulation sealing body 2. It may be surrounded almost all the way around. In the structure in which the external connection portion 3c is wound around the insulating sealing body 2, any side surface can be used as an adhesion surface, so there is an advantage that the degree of freedom of the adhesion surface is increased.
In the above embodiment, the cross-sectional shape of the insulating sealing body 2 is square. However, the bottom surface 2a may have a generally square shape as a whole, and the bottom surface 2a of the portion facing the external connection portion 3c may be substantially planar. For example, it may have a shape other than that, for example, a hexagonal cross section. Furthermore, as the chip type electronic component, not only semiconductors but also resistors and capacitors can be used.
考案の効果
本考案では、プリント基板へのチツプ型電子部
品の半田付け状態の目視検査が容易である。即
ち、本考案のチツプ型電子部品では、リード電極
の外部接続部の両端は絶縁封止体の底面より外側
に伸びて絶縁封止体の側面に対面する折曲げ部を
形成しているため、外部接続部とボンデイングパ
ツドとの半田付け状態をチツプ型電子部品の正面
又は上面から十分に目視することができる。Effects of the invention According to the invention, it is easy to visually inspect the state of soldering of chip-type electronic components to a printed circuit board. That is, in the chip type electronic component of the present invention, both ends of the external connection portion of the lead electrode form a bent portion extending outward from the bottom surface of the insulating seal and facing the side surface of the insulating seal. The soldered state between the external connection portion and the bonding pad can be sufficiently visually observed from the front or top surface of the chip-type electronic component.
また、本考案のチツプ型電子部品では、側面か
らの目視検査が不可能な場合でも、正面又は上面
からの目視検査が容易であるため、従来のように
目視検査が不可能になる事態を解消することがで
きる。 In addition, with the chip-type electronic component of the present invention, even if visual inspection from the side is not possible, visual inspection from the front or top surface is easy, eliminating the situation where visual inspection is impossible as in the past. can do.
更に、本考案では従来より半田量を増大でき、
チツプ型電子部品のプリント基板等のボンデイン
グパツドに対する接着力が増加する。 Furthermore, with this invention, the amount of solder can be increased compared to conventional methods.
The adhesion strength of chip-type electronic components to bonding pads such as printed circuit boards is increased.
第１図は本考案によるチツプ型電子部品のリー
ド電極を折曲げる前の状態を示し、Ａは平面図、
Ｂは側面図、第２図は本考案のチツプ型電子部品
の絶縁封止体の形状を示し、Ａは正面図、Ｂは側
面図、第３図は第１図のチツプ型電子部品のリー
ド電極を折曲げた後のチツプ型電子部品の断面図
を示し、ＡはＢの−線での断面図、ＢはＡの
−線での断面図、第４図は第３図のチツプ型
電子部品をプリント基板に接着した状態を示し、
Ａは正面図、ＢはＡの−線での断面図、第５
図は従来のチツプ型電子部品を示し、Ａは正面
図、Ｂは底面図、Ｃは側面図である。
２……絶縁封止体、２ａ……底面、２ｂ……端
面、２ｃ，２ｄ……側面、２ｅ……第１の切欠
部、２ｆ……第２の切欠部、３……リード電極、
３ａ……導出部、３ｃ……外部接続部、３ｄ……
折曲げ部、４……チツプ型電子部品。
FIG. 1 shows the state of the chip-type electronic component according to the present invention before the lead electrodes are bent, A is a plan view;
B is a side view, FIG. 2 shows the shape of the insulating seal of the chip-type electronic component of the present invention, A is a front view, B is a side view, and FIG. 3 is the lead of the chip-type electronic component of FIG. 1. A cross-sectional view of the chip-type electronic component after bending the electrode is shown, A is a cross-sectional view taken along the - line of B, B is a cross-sectional view of A taken along the - line, and Figure 4 shows the chip-type electronic component of Figure 3. Shows the state in which the parts are glued to the printed circuit board,
A is a front view, B is a cross-sectional view taken along the - line of A, 5th
The figures show a conventional chip-type electronic component, in which A is a front view, B is a bottom view, and C is a side view. 2... Insulating sealing body, 2a... Bottom surface, 2b... End surface, 2c, 2d... Side surface, 2e... First notch, 2f... Second notch, 3... Lead electrode,
3a...Derivation part, 3c...External connection part, 3d...
Bend part, 4... Chip type electronic component.
Claims (1)
伸びる一対の側面及び前記底面から略直角にかつ
互いに対向して伸びる一対の端面を有する絶縁封
止体と、該絶縁封止体の前記一対の端面の各々か
ら導出されたリード電極とを備えたチツプ型電子
部品において、 前記リード電極は、導出部と、該導出部に連続
し且つ前記導出部の導出方向に直角な方向での幅
長が前記導出部の幅長よりも大きい板状の外部接
続部とを有し、 前記絶縁封止体の一対の端面の各々と前記底面
との境界部分に第１の切欠部が形成され、 前記絶縁封止体の前記側面の各々と前記端面の
各々との境界部分に前記第１の切欠部に連続する
第２の切欠部が形成され、 前記導出部の各々は対応する前記絶縁封止体の
前記端面に沿つて配置され、 前記外部接続部の中央側は前記第１の切欠部内
に配置され、 前記外部接続部の端部の各々は前記第２の切欠
部内に配置され、 ろう材を介して前記外部接続部が外部電極体に
固着されたとき、該ろう材が前記外部接続部の前
記第２の切欠部に配置された部分まではい上れる
ことを特徴とするチツプ型電子部品。[Claims for Utility Model Registration] An insulating sealing body having a bottom surface, a pair of side surfaces extending substantially perpendicularly from the bottom surface and facing each other, and a pair of end surfaces extending substantially perpendicularly from the bottom surface facing each other; A chip-type electronic component comprising a lead electrode led out from each of the pair of end faces of the insulating sealing body, wherein the lead electrode includes a lead-out part and a lead-out part that is continuous with the lead-out part and extends in the lead-out direction of the lead-out part. a plate-shaped external connection portion having a width in a perpendicular direction larger than the width of the lead-out portion; a notch is formed, a second notch continuous to the first notch is formed at a boundary between each of the side surfaces and each of the end faces of the insulating sealing body, and each of the lead-out parts disposed along the end surface of the corresponding insulating sealing body, the center side of the external connection section is disposed within the first notch, and each end of the external connection section is disposed within the second notch. and when the external connection part is fixed to the external electrode body through a brazing material, the brazing material can crawl up to the part of the external connection part disposed in the second notch. Chip type electronic components.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987009828U JPH0414914Y2 (en) | 1987-01-28 | 1987-01-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987009828U JPH0414914Y2 (en) | 1987-01-28 | 1987-01-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63119231U JPS63119231U (en) | 1988-08-02 |
| JPH0414914Y2 true JPH0414914Y2 (en) | 1992-04-03 |
Family
ID=30795510
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987009828U Expired JPH0414914Y2 (en) | 1987-01-28 | 1987-01-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0414914Y2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2560869B2 (en) * | 1989-04-27 | 1996-12-04 | 富士電機株式会社 | Two-terminal surface mount semiconductor device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6096817U (en) * | 1983-12-08 | 1985-07-02 | 日本電気株式会社 | Chip type electronic components |
-
1987
- 1987-01-28 JP JP1987009828U patent/JPH0414914Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63119231U (en) | 1988-08-02 |
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