JPH0195589A - Attachment structure of leadless component - Google Patents
Attachment structure of leadless componentInfo
- Publication number
- JPH0195589A JPH0195589A JP62251552A JP25155287A JPH0195589A JP H0195589 A JPH0195589 A JP H0195589A JP 62251552 A JP62251552 A JP 62251552A JP 25155287 A JP25155287 A JP 25155287A JP H0195589 A JPH0195589 A JP H0195589A
- Authority
- JP
- Japan
- Prior art keywords
- width
- solder
- insulating substrate
- soldering
- conductor layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims abstract description 38
- 239000000758 substrate Substances 0.000 claims abstract description 26
- 238000005476 soldering Methods 0.000 claims abstract description 23
- 239000004020 conductor Substances 0.000 claims abstract description 21
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims abstract 2
- 230000000694 effects Effects 0.000 abstract description 11
- 239000003990 capacitor Substances 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000006071 cream Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000007779 soft material Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
Description
【発明の詳細な説明】
〈産業上の利用分野〉
本発明は、抵抗、コンデンサ等のリード線を有しない回
路部品（以下リードレス部品と略称する）の取付構造に
関し、このリードレス部品を絶縁基板に半田付けする際
に適用して有用なものである。[Detailed Description of the Invention] <Industrial Application Field> The present invention relates to a mounting structure for circuit components such as resistors, capacitors, etc. that do not have lead wires (hereinafter referred to as leadless components). This is useful when soldering to a board.
〈従来の技術及び発明が解決しようとする問題点〉リー
ドレス部品Ｉは第４図に示すように抵抗、コンデンサ等
を構成する直方体の回路素子２とその両端部に設けた電
ｗｓ３，３で構成されている。通常抵抗の場合には回路
素子２が直方体のセラミック基体とその表面に焼付けら
れた抵抗体とで構成されており、セラミック基体の両端
に端面より抵抗体の端部上面に伸びる電極膜が形成され
ている。そしてコンデンサの場合にはチタン酸バリウム
等を誘電体とする直方体のコンデンサ素子の両端に銀、
パラジウム等を塗布し、焼付けることによって電極膜を
形成するようにしている。<Prior art and problems to be solved by the invention> As shown in FIG. 4, the leadless component I consists of a rectangular parallelepiped circuit element 2 constituting a resistor, a capacitor, etc., and electric currents WS3, 3 provided at both ends of the circuit element 2. It is configured. In the case of a normal resistor, the circuit element 2 is composed of a rectangular parallelepiped ceramic base and a resistor baked on its surface, and electrode films are formed at both ends of the ceramic base extending from the end face to the upper surface of the end of the resistor. ing. In the case of a capacitor, a rectangular parallelepiped capacitor element whose dielectric material is barium titanate etc. has silver on both ends.
The electrode film is formed by applying palladium or the like and baking it.
ところで、これらのリードレス部品Ｉを絶縁基板ｌに取
付ける場合、通常第５図に示すように絶縁基板１にリー
ドレス部品Ｉのｒｉ電極より充分大きいラウンド部４ａ
を有する導体層４を形成し、この導体層４のラウンド部
４ａに上記リードレス部品■の電極３を対向せしめ第６
図（ａｌ、（ｂｌに示すように電極３の全周に友って半
田５が盛り上がるように半田付けしている。By the way, when these leadless components I are attached to an insulating substrate l, as shown in FIG.
A conductor layer 4 having a conductor layer 4 is formed, and the electrode 3 of the leadless component (2) is opposed to the round part 4a of the conductor layer 4.
As shown in Figures (al and bl), soldering is performed so that the solder 5 swells around the entire circumference of the electrode 3.
しかしながら、この種のリードレス部品工はその両端部
外周がほぼ完全に半田５によって覆れるため、絶縁基板
１として紙基材フェノール樹脂積層板や紙基材エポキシ
樹脂積層板等の比較的軟質な樹脂系絶縁基板を使用した
場合、製造工程中や使用中に回路部品そのものにクラッ
クが生じ破損することが多かった。すなわち、この種の
ものではリードレス部品Ｉの両端部外周がほぼ完全に覆
われ半田５によって完全に強固に導体層４に結合される
ため、製造工程中や使用中に絶縁基板１に外力が加わり
、彎曲した場合でもこれを吸収することができず、その
ままリードレス部品Ｉに応力が加わり、リードレス部品
■そのものにクラックが生じ破損するという問題があっ
た。However, in this type of leadless component machining, the outer periphery of both ends is almost completely covered with the solder 5, so a relatively soft material such as a paper-based phenol resin laminate or a paper-based epoxy resin laminate is used as the insulating substrate 1. When resin-based insulating substrates are used, the circuit components themselves often crack and break during the manufacturing process or during use. That is, in this type of device, the outer periphery of both ends of the leadless component I is almost completely covered and is completely and firmly bonded to the conductor layer 4 by the solder 5, so that no external force is applied to the insulating substrate 1 during the manufacturing process or during use. Even when the leadless component (I) is bent and bent, it cannot be absorbed, and stress is directly applied to the leadless component (I), causing a problem in that the leadless component (II) itself cracks and breaks.
かかる問題点に鑑み、半田の付着量及び付着状態を効果
的に規制できるようにし、絶縁基板が多少彎曲した場合
でも半田の弾力性によってこれを容易に吸収し、回路部
分の破損に直接つながらないようにしたものも提案され
ている。In view of these problems, the amount and state of adhesion of solder can be effectively regulated, and even if the insulating board is slightly bent, the elasticity of the solder will easily absorb this bending, so that it will not directly lead to damage to the circuit part. A new version has also been proposed.
かかるリードレス部品の取付構造について、第４図及び
第５図に示す従来技術と同一部分には同一番号を付し、
第７図に基づき説明する。Regarding the mounting structure of such leadless parts, the same parts as the conventional technology shown in FIGS. 4 and 5 are given the same numbers,
This will be explained based on FIG.
第７図に示すように、この従来技術では、導体層４のラ
ウンド部４ａはその幅が電極３゜３の幅とほぼ同−若し
くは狭くなるように設定されており導体層４のラウンド
部４ａに電極３，３を当接させた状態で半田デイツプ法
によって電極３，３とラウンド部４ａとの間に半田５を
付着させることによってリードレス部品Ｉを導体層４に
電気的に接続するようにしている。As shown in FIG. 7, in this prior art, the width of the round portion 4a of the conductor layer 4 is set to be approximately the same as or narrower than the width of the electrode 3. The leadless component I is electrically connected to the conductor layer 4 by applying solder 5 between the electrodes 3, 3 and the round part 4a using the solder dip method with the electrodes 3, 3 in contact with the electrodes 3, 3. I have to.
なお、かかる半田付けに先立ち、リードレス部品Ｉは接
着剤（特に熱硬化性の接着剤）によって絶縁基板１に固
着している。この固着により半田デイツプ法による半田
付けの際にリードレス部品Ｉが動かないようにするとと
もに、リードレス部品■の絶縁基板１に対する機械的な
結合を補強している。Note that, prior to such soldering, the leadless component I is fixed to the insulating substrate 1 with an adhesive (particularly a thermosetting adhesive). This fixation prevents the leadless component I from moving during soldering by the solder dip method, and also reinforces the mechanical connection of the leadless component I to the insulating substrate 1.
このようにすると、第８図（ａ）ｉｂ）に示すように、
リードレス部品Ｉに形成した電極３゜３の内、導体層４
のラウンド部４ａに対向する側面を除く他の面と導体層
４のラウンド部４ａとの間に半田５が付着することにな
り、また、導体層４のラウンド部４ａの幅が電極３．３
の幅とほぼ同一に形成されているため、リードレス部品
工の側面とラウンド部４ａとの間に付着する半田５の量
が著しく少なくなり、絶縁基板１が彎曲した場合でもそ
の応力を半田５の弾性力によって充分に吸収することが
できるようになる。したがって、この従来技術によれば
絶縁基板１に外力が加わり若干弯曲した場合でもその応
力が直接リードレス部品Ｉに加わることがほとんどなく
リードレス部品Ｉそのものにクラックが生じ破損される
のを防止することができる。In this way, as shown in FIG. 8(a) ib),
Among the electrodes 3゜3 formed on the leadless component I, the conductor layer 4
The solder 5 is attached between the round portion 4a of the conductor layer 4 and the other surface excluding the side surface facing the round portion 4a of the electrode 3.
Since the width of the solder 5 is approximately the same as that of the round part 4a, the amount of solder 5 that adheres between the side surface of the leadless component and the round part 4a is significantly reduced, and even if the insulating board 1 is curved, the stress is The elastic force of the material allows sufficient absorption. Therefore, according to this prior art, even if an external force is applied to the insulating substrate 1 and the insulating substrate 1 is slightly bent, the stress is hardly applied directly to the leadless component I, thereby preventing cracks and damage to the leadless component I itself. be able to.
ところが、かかる従来技術では、半田デイツプ法により
半田付けをしている事、及び半田面積が小さくなり、半
田によらず絶縁基板１に対する機械的な結合力を補強し
なければならない事に起因して、前述の如り、リードレ
ス部品Ｉを接続剤で絶縁基板１に固着している。このた
め、リフロー半田付は時においても半田５の表面張力に
よりリードレス部品■を動かして中央に位置決めする、
所謂セルフ・アライメント効果が得られなくなってしま
う。However, in such conventional technology, soldering is performed by a solder dip method, and the solder area becomes small, and the mechanical bonding force to the insulating substrate 1 must be reinforced regardless of solder. As described above, the leadless component I is fixed to the insulating substrate 1 using a connecting agent. For this reason, in reflow soldering, the leadless component ■ is sometimes moved and positioned in the center by the surface tension of the solder 5.
The so-called self-alignment effect cannot be obtained.
本発明は、上記従来技術に鑑み、半田付けによる大きな
機械的結合力を維持し乍らリードレス部品に対するクラ
ックの発生を防止し、半田付は時のセルフ・アライメン
ト効果も得られるリードレス部品の取付構造を提供する
ことを目的とする。In view of the above-mentioned prior art, the present invention prevents the generation of cracks in leadless components while maintaining a large mechanical bonding force due to soldering, and also provides a self-alignment effect when soldering is performed. The purpose is to provide a mounting structure.
く問題点を解決するための手段〉
上記目的を達成する本発明の構成は、互いに対向して絶
縁基板に形成された導体層の半田付けに寄与する部分で
あるラウンド部の幅を、リード線を有しない回路部品の
両端部に形成した電極の幅より広く形成するとともに、
前記ラウンド部から前記回路部品の外方へ伸びる部分で
あり、半田フィレットを形成する部分である導体層のリ
ード部の幅を前記電極の幅より狭く形成したことを特徴
とする。Means for Solving the Problems> The structure of the present invention that achieves the above object is such that the width of the round portions that contribute to soldering of the conductor layers formed on the insulating substrate facing each other is In addition to forming the electrodes wider than the width of the electrodes formed at both ends of the circuit component that does not have
The lead portion of the conductor layer, which is a portion extending from the round portion to the outside of the circuit component and forming a solder fillet, is formed to have a width narrower than the width of the electrode.
く作 用〉
上記構成の本発明によれば、ラウンド部は充分な広さを
有するので、接着剤による固定が不要でクリーム半田の
溶融時にはリードレス部品に対しセルフ・アライメント
効果が発揮される。半田デイツプ時はリード部が第６図
のように半田におおわれることはない。また、絶縁基板
に外力が作用した場合、これによる絶縁基板の変形はリ
ード部の半田により吸収される。Effects> According to the present invention having the above configuration, the round portion has a sufficient width, so fixing with an adhesive is not necessary, and a self-alignment effect is exerted on the leadless component when the cream solder is melted. During solder dipping, the lead portion is not covered with solder as shown in FIG. Furthermore, when an external force is applied to the insulating substrate, the resulting deformation of the insulating substrate is absorbed by the solder of the lead portion.
く実 施 例〉
以下本発明の実施例を従来技術と同一部分には同一番号
を付した図面に基づき詳細に説明する。Embodiments Hereinafter, embodiments of the present invention will be described in detail based on the drawings in which the same parts as those of the prior art are given the same numbers.
第１図（ａｌは本発明の第１の実施例を示す平面図（半
田付は前）、第１図［ｂ）はその正面図（半田付は後）
、第１図（（ニ）はその右側面図（半田付は後）である
。これら第１図（ａ）〜第１図（ｅ）に示すように、リ
ードレス部品Ｉは回路素子２とその両端部に設けた電極
３，３とからなる。この場合の電極３，３は銀パラジウ
ム電極であり、回路素子の端部の全面を覆うように、即
ち端面、上下両面及び両側面に亘って設けである。導体
層４はラウンド部４ａ及びこのラウンド部４ａからリー
ドレス部品Ｉの外方へ伸びる部分であるリード部４ｂか
らなり、絶縁基板１の表面に形成しである。Fig. 1 (al is a plan view showing the first embodiment of the present invention (soldering is before), Fig. 1 [b] is its front view (soldering is after)
, FIG. 1 ((d) is the right side view (soldering is done afterward). As shown in FIGS. 1(a) to 1(e), the leadless component I is connected to the circuit element 2. It consists of electrodes 3, 3 provided at both ends.The electrodes 3, 3 in this case are silver palladium electrodes, and are arranged so as to cover the entire surface of the end of the circuit element, that is, over the end face, both upper and lower surfaces, and both sides. The conductor layer 4 is formed on the surface of the insulating substrate 1, and includes a round portion 4a and a lead portion 4b extending outward from the round portion 4a of the leadless component I.
このときラウンド部４ａの幅は電極３幅よりも広く、ま
たリード部４ｂの幅は電極３の幅よりも狭く形成しであ
る。リードレス部品Ｉは、その’ｒ４４％３がラウンド
部４ａ及びリード部４ｂに跨がるよう絶縁基板１上に載
置されラウンド部４ａ及びリード部４ｂに半田付けされ
ている。かくて電極３の下面はラウンド部４ａの中央部
分に半田により固着されるとともに、電極３の両側面は
ラウンド部４ａの両側部分に、また電極３の端面ばリー
ド部４ｂに夫々半田５のフィレットを介して固着される
。At this time, the width of the round portion 4a is wider than the width of the electrode 3, and the width of the lead portion 4b is narrower than the width of the electrode 3. The leadless component I is placed on the insulating substrate 1 so that its 'r44%3 straddles the round part 4a and the lead part 4b, and is soldered to the round part 4a and the lead part 4b. In this way, the lower surface of the electrode 3 is fixed to the central part of the round part 4a by solder, and fillets of solder 5 are applied to both sides of the electrode 3 to both sides of the round part 4a, and to the end faces of the electrode 3 and to the lead part 4b. It is fixed through.
かかる本実施例によればリードレス部品工のリフ四−半
田付は時にはラウンド部４ａの中央部分の半田によりセ
ルフ・アライメント効果が発揮され正規位置への位置決
めがなされるばかりでなく、ラウンド部４ａが電極３の
幅より広いので、充分な機械的強度をもってリードレス
部品■が絶縁基板１に固着される。デイツプ半田の場合
も部品電極に対するラウンド幅が狭く第６図のように電
極３が半田におおわれることはなく、第１図（ｂＬ（０
１のように半田フィレットは低く半田付けされる。According to this embodiment, when performing rift soldering in leadless parts machining, the self-alignment effect is sometimes exhibited by the solder at the center of the round part 4a, and not only is the round part 4a positioned at the correct position, but also the round part 4a is wider than the width of the electrode 3, the leadless component (2) is fixed to the insulating substrate 1 with sufficient mechanical strength. In the case of dip solder, the round width with respect to the component electrode is narrow and the electrode 3 is not covered with solder as shown in Fig. 6, and as shown in Fig. 1 (bL(0
1, the solder fillet is soldered low.
また、絶縁基板１に外力が加わった場合における絶縁基
板１の変形は、リード部４ｂを電極３より幅狭に形成し
たので、前記リード部４ｂの変形により吸収される。Further, since the lead portion 4b is formed narrower than the electrode 3, deformation of the insulating substrate 1 when an external force is applied to the insulating substrate 1 is absorbed by the deformation of the lead portion 4b.
第２図（ａ）は本発明の第２の実施例を示す平面図（半
田付は前）、第２図（ｂｌはその正面図（半田付は後）
である。両図に示すように、本実施例のリードレス部品
Ｉは、前記実施例のものに対し電極３の構造が異なって
いる。Fig. 2(a) is a plan view showing the second embodiment of the present invention (soldering is before), Fig. 2(bl is a front view thereof (soldering is after)
It is. As shown in both figures, the leadless component I of this embodiment differs from that of the previous embodiment in the structure of the electrode 3.
この電極３は金属電極であり回路素子２の端面から引き
出され下面に回り込ませである。This electrode 3 is a metal electrode drawn out from the end face of the circuit element 2 and wrapped around the lower face.
本実施例の場合もラウンド部４ａの幅は電極３の幅より
も広く、またリード部４ｂの幅は電極３の輻よりも狭く
形成してあり、電極３をラウンド部４ａ及びリード部４
ｂに跨がらせ、絶縁基板１に半田付けしである。この結
果、電極３とリード部４ｂとの間には半田５のフィレッ
トが形成されるとともに、前記実施例と同様の作用が得
られる。In this embodiment as well, the width of the round portion 4a is wider than the width of the electrode 3, and the width of the lead portion 4b is narrower than the convergence of the electrode 3.
b, and soldered to the insulating substrate 1. As a result, a fillet of solder 5 is formed between the electrode 3 and the lead portion 4b, and the same effect as in the previous embodiment is obtained.
第３図は本発明の第３の実施例を示す平面図（半田付は
前）である。同図に示すリードレス部品Ｉは第２図（ａ
ｌに示すリードレス部品Ｉとほぼ同様であるが、導体Ｐ
Ｊ４のリード部が複数本に分かれている。即ち、本実施
例では２本のリード部４ｂ、４ｃを有する。FIG. 3 is a plan view (soldering is shown in front) showing a third embodiment of the present invention. The leadless component I shown in the figure is shown in Figure 2 (a
It is almost the same as the leadless component I shown in 1, but the conductor P
The lead part of J4 is divided into multiple parts. That is, this embodiment has two lead portions 4b and 4c.
第２の実施例と同様に金属電極を有するリードレス部品
工は、その幅が大きくなると、半田付けした場合、第２
図（ｂ）に示すような半田５のフィレットの高さが低く
なってしまう。Similarly to the second embodiment, leadless components having metal electrodes have a larger width, and when soldered, the second
The height of the fillet of the solder 5 as shown in FIG. 5(b) becomes low.
これは電極３の下面のラウンド部が大きいと、その部分
の半田が端面に付着する半田５を引き込むためであるが
、この場合の半田付は作業の良否は前記フィレットの立
上りを作業者が視認することにより判定しているので、
フィレットの高さがある程度確保されないと前記判定を
行ないにくいという問題がある。This is because if the round part on the lower surface of the electrode 3 is large, the solder in that part will pull in the solder 5 adhering to the end face, but in this case, the quality of the soldering work can be determined by the operator visually checking the rise of the fillet. Since the judgment is made by
There is a problem in that it is difficult to make the above determination unless the height of the fillet is secured to a certain extent.
本実施例の如く幅の狭いリード部４ｂ、４ａを形成する
ことによりフィレットの高さを視認に都合が良い程度に
確保することができる。By forming the narrow lead portions 4b and 4a as in this embodiment, the height of the fillet can be secured to a level convenient for visual recognition.
即ち、本実施例は電極３の幅が広い金属電極を有するリ
ードレス部品■に適用して有用なものとなる。That is, this embodiment is useful when applied to a leadless component (2) in which the electrode 3 has a wide metal electrode.
本実施例によれば、電極３とリード部４ｂ。According to this embodiment, the electrode 3 and the lead portion 4b.
４Ｃとの間には半田５のフィレットが夫々形成されると
ともに、前記第１及び第２の実施例と同様の作用が得ら
れる。Fillets of the solder 5 are formed between the solder 4C and the solder 5, respectively, and the same effect as in the first and second embodiments can be obtained.
〈発明の効果〉
以上実施例とともに具体的に説明したように、本発明に
よれば、導体層のラウンド部の幅を電極の幅より広くし
たので、リードレス部品の絶縁基板に対する固着は充分
な機械的強度で確保されるばかりでなく、導体層のリー
ド部の幅を電極の幅より狭くしたので、絶縁基板の変形
はリード部で吸収されリードレス部品に有害な応力が作
用するのを防止し得、更にクリーム半田を用いて半田付
けを行なう場合、半田付けによるセルフ・アライメント
効果が発揮されリードレス部品の位置決めを有効に行な
うことができる。<Effects of the Invention> As specifically explained above in conjunction with the embodiments, according to the present invention, the width of the round portion of the conductor layer is made wider than the width of the electrode, so that the leadless component is sufficiently fixed to the insulating substrate. In addition to ensuring mechanical strength, the width of the lead portion of the conductor layer is made narrower than the width of the electrode, so deformation of the insulating substrate is absorbed by the lead portion, preventing harmful stress from acting on leadless components. Furthermore, when soldering is performed using cream solder, a self-alignment effect is exhibited by the soldering, and the positioning of leadless components can be performed effectively.
第１図（ａｌは本発明の第１の実施例を示す平面図、第
１図（ｂ）はその正面図、第１図（Ｃ）はその右側面図
、第２図（ａ）は本発明の第２実施例を示す平面図、第
２図（ｂ）はその正面図、第３図は本発明の第３の実施
例を示す平面図、第４図はり一ドレス部品を示す斜視図
、第５図は従来技術の一例を示す平面図、第６図（ａ）
はそのＡ−Ａ、ｉｌｌ断面図、第６図（ｂ）は第５図の
Ｂ−Ｂ線断面図、第７図は従来技術の他の例を示す平面
図、第８図（ａ）はそのＣ−Ｃ線断面図、第８図（ｂ）
；よ第７図のＤ−Ｄ線断面図である。
図面中、
■はリードレス部品、
１は絶縁基板、
３は電極、
４は導体層、
４ａはラウンド部、
４ｂ、４ｃはリード部、
５は半田である。
第１図（ａ）
第３図
第７図
第８図Figure 1 (al is a plan view showing the first embodiment of the present invention, Figure 1 (b) is its front view, Figure 1 (C) is its right side view, Figure 2 (a) is the main A plan view showing the second embodiment of the invention, FIG. 2(b) is a front view thereof, FIG. 3 is a plan view showing the third embodiment of the invention, and FIG. 4 is a perspective view showing the beam dress part. , FIG. 5 is a plan view showing an example of the prior art, and FIG. 6(a)
6(b) is a sectional view taken along the line BB of FIG. 5, FIG. 7 is a plan view showing another example of the prior art, and FIG. Cross-sectional view along the line C-C, FIG. 8(b)
; is a sectional view taken along line D-D in FIG. 7; In the drawings, 1 is a leadless component, 1 is an insulating substrate, 3 is an electrode, 4 is a conductor layer, 4a is a round part, 4b and 4c are lead parts, and 5 is solder. Figure 1 (a) Figure 3 Figure 7 Figure 8
Claims (1)
けに寄与する部分であるラウンド部の幅を、リード線を
有しない回路部品の両端部に形成した電極の幅より広く
形成するとともに、前記ラウンド部から前記回路部品の
外方へ伸びる部分であり、半田フィレットを形成する部
分である導体層のリード部の輻を前記電極の幅より狭く
形成したことを特徴とするリードレス部品の取付構造。The width of the round part, which is a part that contributes to soldering of the conductor layers formed on the insulating substrate facing each other, is formed wider than the width of the electrodes formed at both ends of the circuit component having no lead wire, and A mounting structure for a leadless component, characterized in that the radius of the lead portion of the conductor layer, which is a portion extending outward from the round portion of the circuit component and forming a solder fillet, is narrower than the width of the electrode. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62251552A JPH0195589A (en) | 1987-10-07 | 1987-10-07 | Attachment structure of leadless component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62251552A JPH0195589A (en) | 1987-10-07 | 1987-10-07 | Attachment structure of leadless component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0195589A true JPH0195589A (en) | 1989-04-13 |
Family
ID=17224524
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62251552A Pending JPH0195589A (en) | 1987-10-07 | 1987-10-07 | Attachment structure of leadless component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0195589A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5311405A (en) * | 1993-08-02 | 1994-05-10 | Motorola, Inc. | Method and apparatus for aligning and attaching a surface mount component |
| EP1565046A1 (en) * | 2004-02-12 | 2005-08-17 | Kabushiki Kaisha Toyota Jidoshokki | Surface mounting structure for surface mounting an electronic component |
| JP2012089742A (en) * | 2010-10-21 | 2012-05-10 | Denso Corp | Method of manufacturing electronic device |
| US10879211B2 (en) | 2016-06-30 | 2020-12-29 | R.S.M. Electron Power, Inc. | Method of joining a surface-mount component to a substrate with solder that has been temporarily secured |
-
1987
- 1987-10-07 JP JP62251552A patent/JPH0195589A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5311405A (en) * | 1993-08-02 | 1994-05-10 | Motorola, Inc. | Method and apparatus for aligning and attaching a surface mount component |
| EP1565046A1 (en) * | 2004-02-12 | 2005-08-17 | Kabushiki Kaisha Toyota Jidoshokki | Surface mounting structure for surface mounting an electronic component |
| US7186926B2 (en) | 2004-02-12 | 2007-03-06 | Kabushiki Kaisha Toyota Jidoshokki | Surface mounting structure for surface mounting an electronic component |
| JP2012089742A (en) * | 2010-10-21 | 2012-05-10 | Denso Corp | Method of manufacturing electronic device |
| US10879211B2 (en) | 2016-06-30 | 2020-12-29 | R.S.M. Electron Power, Inc. | Method of joining a surface-mount component to a substrate with solder that has been temporarily secured |
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