JPH0414503B2 - - Google Patents

Info

Publication number
JPH0414503B2
JPH0414503B2 JP57042460A JP4246082A JPH0414503B2 JP H0414503 B2 JPH0414503 B2 JP H0414503B2 JP 57042460 A JP57042460 A JP 57042460A JP 4246082 A JP4246082 A JP 4246082A JP H0414503 B2 JPH0414503 B2 JP H0414503B2
Authority
JP
Japan
Prior art keywords
metallized layer
plating
metallized
die stage
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP57042460A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58158951A (ja
Inventor
Tetsushi Wakabayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP57042460A priority Critical patent/JPS58158951A/ja
Publication of JPS58158951A publication Critical patent/JPS58158951A/ja
Publication of JPH0414503B2 publication Critical patent/JPH0414503B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W70/05—

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP57042460A 1982-03-16 1982-03-16 半導体パッケージの製造方法 Granted JPS58158951A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57042460A JPS58158951A (ja) 1982-03-16 1982-03-16 半導体パッケージの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57042460A JPS58158951A (ja) 1982-03-16 1982-03-16 半導体パッケージの製造方法

Publications (2)

Publication Number Publication Date
JPS58158951A JPS58158951A (ja) 1983-09-21
JPH0414503B2 true JPH0414503B2 (cg-RX-API-DMAC10.html) 1992-03-13

Family

ID=12636678

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57042460A Granted JPS58158951A (ja) 1982-03-16 1982-03-16 半導体パッケージの製造方法

Country Status (1)

Country Link
JP (1) JPS58158951A (cg-RX-API-DMAC10.html)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2617518B2 (ja) * 1988-04-19 1997-06-04 新光電気工業株式会社 セラミックパッケージおよびその製造方法
JP2819570B2 (ja) * 1988-11-22 1998-10-30 ミノルタ株式会社 プリント基板の製造方法
US5206188A (en) * 1990-01-31 1993-04-27 Ibiden Co., Ltd. Method of manufacturing a high lead count circuit board
JP6298363B2 (ja) * 2014-06-03 2018-03-20 日本特殊陶業株式会社 配線基板

Also Published As

Publication number Publication date
JPS58158951A (ja) 1983-09-21

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