JPH0413414B2 - - Google Patents
Info
- Publication number
- JPH0413414B2 JPH0413414B2 JP25070689A JP25070689A JPH0413414B2 JP H0413414 B2 JPH0413414 B2 JP H0413414B2 JP 25070689 A JP25070689 A JP 25070689A JP 25070689 A JP25070689 A JP 25070689A JP H0413414 B2 JPH0413414 B2 JP H0413414B2
- Authority
- JP
- Japan
- Prior art keywords
- alloy
- weight
- solderability
- lead
- precipitated particles
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000463 material Substances 0.000 claims description 15
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 12
- 239000004065 semiconductor Substances 0.000 claims description 9
- 239000002245 particle Substances 0.000 claims description 8
- 229910052759 nickel Inorganic materials 0.000 claims description 6
- 229910052710 silicon Inorganic materials 0.000 claims description 6
- 239000010703 silicon Substances 0.000 claims description 6
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 229910052760 oxygen Inorganic materials 0.000 claims description 3
- 239000001301 oxygen Substances 0.000 claims description 3
- 239000012535 impurity Substances 0.000 claims description 2
- 229910045601 alloy Inorganic materials 0.000 description 18
- 239000000956 alloy Substances 0.000 description 18
- 238000007747 plating Methods 0.000 description 10
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 239000002244 precipitate Substances 0.000 description 3
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 238000004881 precipitation hardening Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000005097 cold rolling Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Conductive Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25070689A JPH0310037A (ja) | 1989-09-28 | 1989-09-28 | 半導体機器用リード材 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25070689A JPH0310037A (ja) | 1989-09-28 | 1989-09-28 | 半導体機器用リード材 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57006063A Division JPS6045698B2 (ja) | 1982-01-20 | 1982-01-20 | 半導体機器用リ−ド材 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0310037A JPH0310037A (ja) | 1991-01-17 |
| JPH0413414B2 true JPH0413414B2 (enrdf_load_stackoverflow) | 1992-03-09 |
Family
ID=17211837
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25070689A Granted JPH0310037A (ja) | 1989-09-28 | 1989-09-28 | 半導体機器用リード材 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0310037A (enrdf_load_stackoverflow) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005003554A1 (ja) | 2003-07-08 | 2005-01-13 | Cosmo Plant Co., Ltd | 風力発電システム、永久磁石の配置構造および電気・力変換装置 |
-
1989
- 1989-09-28 JP JP25070689A patent/JPH0310037A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0310037A (ja) | 1991-01-17 |
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