JPH0413374B2 - - Google Patents

Info

Publication number
JPH0413374B2
JPH0413374B2 JP8282882A JP8282882A JPH0413374B2 JP H0413374 B2 JPH0413374 B2 JP H0413374B2 JP 8282882 A JP8282882 A JP 8282882A JP 8282882 A JP8282882 A JP 8282882A JP H0413374 B2 JPH0413374 B2 JP H0413374B2
Authority
JP
Japan
Prior art keywords
weight
parts
group
aromatic
cured
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP8282882A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58198532A (ja
Inventor
Kazuhiko Morio
Hisashi Murase
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Adeka Corp
Original Assignee
Asahi Denka Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Denka Kogyo KK filed Critical Asahi Denka Kogyo KK
Priority to JP8282882A priority Critical patent/JPS58198532A/ja
Publication of JPS58198532A publication Critical patent/JPS58198532A/ja
Publication of JPH0413374B2 publication Critical patent/JPH0413374B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Polyethers (AREA)
  • Other Resins Obtained By Reactions Not Involving Carbon-To-Carbon Unsaturated Bonds (AREA)
  • Epoxy Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP8282882A 1982-05-17 1982-05-17 硬化性組成物 Granted JPS58198532A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8282882A JPS58198532A (ja) 1982-05-17 1982-05-17 硬化性組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8282882A JPS58198532A (ja) 1982-05-17 1982-05-17 硬化性組成物

Publications (2)

Publication Number Publication Date
JPS58198532A JPS58198532A (ja) 1983-11-18
JPH0413374B2 true JPH0413374B2 (enExample) 1992-03-09

Family

ID=13785253

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8282882A Granted JPS58198532A (ja) 1982-05-17 1982-05-17 硬化性組成物

Country Status (1)

Country Link
JP (1) JPS58198532A (enExample)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60188425A (ja) * 1984-03-08 1985-09-25 Toagosei Chem Ind Co Ltd カチオン重合方法
JPH0684509B2 (ja) * 1986-05-12 1994-10-26 株式会社日本触媒 洗浄剤組成物
JP2608743B2 (ja) * 1988-01-19 1997-05-14 日東電工株式会社 粘着剤薄層展開物の貼着構造
WO1989007620A1 (fr) * 1988-02-19 1989-08-24 Asahi Denka Kogyo K.K. Preparation a base de resine pour le modelage optique
JPH0826121B2 (ja) * 1988-02-19 1996-03-13 旭電化工業株式会社 光学的造形用樹脂組成物
US5434196A (en) * 1988-02-19 1995-07-18 Asahi Denka Kogyo K.K. Resin composition for optical molding
JP4539644B2 (ja) * 1993-07-29 2010-09-08 日立化成工業株式会社 回路接続材料とその接続材料を用いた回路の接続方法
JP4228652B2 (ja) * 1993-07-29 2009-02-25 日立化成工業株式会社 回路接続材料とその接続材料を用いた回路の接続方法
US6218482B1 (en) 1994-02-24 2001-04-17 New Japan Chemical Co., Ltd. Epoxy resin, process for preparing the resin and photo-curable resin composition and resin composition for powder coatings containing the epoxy resin
KR960701916A (ko) * 1994-02-24 1996-03-28 하또리 마사미쓰 에폭시 수지, 이의 제조 방법 및 이를 함유하는 광경화성 수지 조성물 및 분체 도료용 수지 조성물(Epoxy Resin, Process for Producing the Same, and Photocurable Resin Composition and Powder Coating Resin Composition Both Containing Said Resin)
JP2001207150A (ja) 2000-01-26 2001-07-31 Sony Chem Corp 接着剤組成物
JP2002097443A (ja) * 2000-09-21 2002-04-02 Hitachi Chem Co Ltd 接着剤組成物及びこれを用いた回路接続材料並びに接続体
JP2002302537A (ja) * 2001-04-03 2002-10-18 Ricoh Co Ltd インクジェットヘッド製造用エポキシ樹脂組成物及びインクジェットヘッド製造方法
JP2006199778A (ja) * 2005-01-19 2006-08-03 Hitachi Chem Co Ltd 接着剤組成物、回路接続用接着剤及びこれを用いた回路接続方法、接続体
JP2008296557A (ja) * 2007-06-04 2008-12-11 Mazda Motor Corp 接着接合部材及び該部材の製造方法
JP4985114B2 (ja) * 2007-06-04 2012-07-25 マツダ株式会社 接着接合部材及び該部材の製造方法
JP5509529B2 (ja) * 2008-03-28 2014-06-04 マツダ株式会社 接合組立品の製造方法および接合組立品の製造装置
JP2011111556A (ja) * 2009-11-27 2011-06-09 Hitachi Chem Co Ltd 接着剤組成物、回路接続材料、接続体及び回路部材の接続方法、並びに半導体装置
JP5707754B2 (ja) * 2010-07-12 2015-04-30 横浜ゴム株式会社 導電性組成物および太陽電池セル
JP2012046756A (ja) * 2011-09-28 2012-03-08 Hitachi Chem Co Ltd 回路接続用接着剤及びこれらを用いた回路接続方法、接続体
JP5392333B2 (ja) * 2011-09-28 2014-01-22 日立化成株式会社 回路接続用接着剤及びこれらを用いた回路接続方法、接続体
JP2012046757A (ja) * 2011-09-28 2012-03-08 Hitachi Chem Co Ltd 回路接続用接着剤及びこれらを用いた回路接続方法、接続体
JP2013095881A (ja) * 2011-11-02 2013-05-20 Furukawa Electric Co Ltd:The 接着剤組成物、半導体レーザモジュールおよび半導体レーザモジュールの製造方法
WO2018047728A1 (ja) * 2016-09-06 2018-03-15 住友化学株式会社 偏光板及びその製造方法

Also Published As

Publication number Publication date
JPS58198532A (ja) 1983-11-18

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