JPH0412035B2 - - Google Patents

Info

Publication number
JPH0412035B2
JPH0412035B2 JP57004423A JP442382A JPH0412035B2 JP H0412035 B2 JPH0412035 B2 JP H0412035B2 JP 57004423 A JP57004423 A JP 57004423A JP 442382 A JP442382 A JP 442382A JP H0412035 B2 JPH0412035 B2 JP H0412035B2
Authority
JP
Japan
Prior art keywords
metal mesh
chip
semiconductor device
tape
ground terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP57004423A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58122776A (ja
Inventor
Akihiro Kubota
Junichi Kasai
Tsuyoshi Aoki
Michio Ono
Kenji Hamagishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP57004423A priority Critical patent/JPS58122776A/ja
Publication of JPS58122776A publication Critical patent/JPS58122776A/ja
Publication of JPH0412035B2 publication Critical patent/JPH0412035B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/60—Arrangements for protection of devices protecting against electrostatic charges or discharges, e.g. Faraday shields
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/732—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between stacked chips

Landscapes

  • Electrodes Of Semiconductors (AREA)
JP57004423A 1982-01-14 1982-01-14 半導体装置 Granted JPS58122776A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57004423A JPS58122776A (ja) 1982-01-14 1982-01-14 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57004423A JPS58122776A (ja) 1982-01-14 1982-01-14 半導体装置

Publications (2)

Publication Number Publication Date
JPS58122776A JPS58122776A (ja) 1983-07-21
JPH0412035B2 true JPH0412035B2 (enExample) 1992-03-03

Family

ID=11583852

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57004423A Granted JPS58122776A (ja) 1982-01-14 1982-01-14 半導体装置

Country Status (1)

Country Link
JP (1) JPS58122776A (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5411896A (en) * 1992-03-16 1995-05-02 Delco Electronics Corporation Method of making supra-passivant grid
US5399902A (en) * 1993-03-04 1995-03-21 International Business Machines Corporation Semiconductor chip packaging structure including a ground plane

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5627962A (en) * 1979-08-15 1981-03-18 Matsushita Electric Ind Co Ltd Integrated circuit device
JPS5636157A (en) * 1979-08-31 1981-04-09 Hitachi Ltd Semiconductor device

Also Published As

Publication number Publication date
JPS58122776A (ja) 1983-07-21

Similar Documents

Publication Publication Date Title
US5436203A (en) Shielded liquid encapsulated semiconductor device and method for making the same
EP0682812B1 (en) Thermally conductive integrated circuit package with radio frequency shielding
JP3051011B2 (ja) パワ−モジュ−ル
JP2002524858A (ja) 電磁干渉シールド装置及び方法
TWI605564B (zh) 封裝結構及其製法
US10199736B2 (en) Wireless device
US7687283B2 (en) Method of producing a semiconductor device having a magnetic layer formed thereon
US6430059B1 (en) Integrated circuit package substrate integrating with decoupling capacitor
US20050046046A1 (en) Semiconductor package structure and method for manufacturing the same
JPH0412035B2 (enExample)
TW201214650A (en) Chip package having fully covering shield connected to GND ball
JP3234666B2 (ja) 半導体集積回路装置
JPH044753B2 (enExample)
US20020066592A1 (en) Ball grid array package capable of increasing heat-spreading effect and preventing electromagnetic interference
CN111081696B (zh) 半导体封装和制造半导体封装的方法
CN111653552B (zh) 一种具有高抗电磁脉冲干扰能力的四方扁平芯片封装结构
CN211238248U (zh) 半导体封装
KR100698570B1 (ko) 전자파 간섭을 감소시키는 패키지 디바이스
JPH1140709A (ja) 半導体実装構造およびその製造方法
JPS607741A (ja) 混成集積回路装置
JP3296168B2 (ja) 半導体装置
JP2630294B2 (ja) 混成集積回路装置およびその製造方法
JPH08255811A (ja) 電子部品の接続装置
JP2867710B2 (ja) プラスチック・ピン・グリッド・アレイ
CN211879381U (zh) 一种具有高抗电磁脉冲干扰能力的倒装焊芯片封装结构