JPH0410752B2 - - Google Patents

Info

Publication number
JPH0410752B2
JPH0410752B2 JP60230259A JP23025985A JPH0410752B2 JP H0410752 B2 JPH0410752 B2 JP H0410752B2 JP 60230259 A JP60230259 A JP 60230259A JP 23025985 A JP23025985 A JP 23025985A JP H0410752 B2 JPH0410752 B2 JP H0410752B2
Authority
JP
Japan
Prior art keywords
metal layer
ceramic
aluminum nitride
metal
electroless plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60230259A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6288394A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP23025985A priority Critical patent/JPS6288394A/ja
Priority to EP19860114283 priority patent/EP0219122B1/en
Priority to DE8686114283T priority patent/DE3672441D1/de
Publication of JPS6288394A publication Critical patent/JPS6288394A/ja
Publication of JPH0410752B2 publication Critical patent/JPH0410752B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP23025985A 1985-10-15 1985-10-15 窒化アルミニウムセラミツク基板の製造方法 Granted JPS6288394A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP23025985A JPS6288394A (ja) 1985-10-15 1985-10-15 窒化アルミニウムセラミツク基板の製造方法
EP19860114283 EP0219122B1 (en) 1985-10-15 1986-10-15 Metallized ceramic substrate and method of manufacturing the same
DE8686114283T DE3672441D1 (de) 1985-10-15 1986-10-15 Metallisiertes keramiksubstrat und herstellungsverfahren.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23025985A JPS6288394A (ja) 1985-10-15 1985-10-15 窒化アルミニウムセラミツク基板の製造方法

Publications (2)

Publication Number Publication Date
JPS6288394A JPS6288394A (ja) 1987-04-22
JPH0410752B2 true JPH0410752B2 (enrdf_load_stackoverflow) 1992-02-26

Family

ID=16904997

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23025985A Granted JPS6288394A (ja) 1985-10-15 1985-10-15 窒化アルミニウムセラミツク基板の製造方法

Country Status (1)

Country Link
JP (1) JPS6288394A (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63260884A (ja) * 1987-04-16 1988-10-27 日本碍子株式会社 セラミツク基体およびその製造方法
JP2013143471A (ja) * 2012-01-11 2013-07-22 Murata Mfg Co Ltd 電子部品
JP6158595B2 (ja) * 2013-05-29 2017-07-05 日本特殊陶業株式会社 サーミスタ素子

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5482666A (en) * 1977-12-15 1979-07-02 Oki Electric Ind Co Ltd Nonnelectrolytic plating method of insulated substrate
JPH0679989B2 (ja) * 1985-02-26 1994-10-12 ティーディーケイ株式会社 窒化アルミニウム上の銅電極形成法

Also Published As

Publication number Publication date
JPS6288394A (ja) 1987-04-22

Similar Documents

Publication Publication Date Title
JP2003338516A (ja) 半導体装置およびその製造方法
JP2014533775A (ja) セラミック基板に埋め込まれた金属構造体
US5510139A (en) Process for assembly and bonding of electronic components on an insulating support
JP2637804B2 (ja) メッキ付き基材
TW200403290A (en) Method for electroless metalisation of polymer substrate
JPH0487213A (ja) 異方性導電膜およびその製造方法
JPH0410752B2 (enrdf_load_stackoverflow)
EP0219122B1 (en) Metallized ceramic substrate and method of manufacturing the same
JPH0322715B2 (enrdf_load_stackoverflow)
JP2003253454A (ja) 電子部品のめっき方法、及び電子部品
JPS594062A (ja) 電子部品外囲器及びその製造方法
JPH0261160B2 (enrdf_load_stackoverflow)
JP3244102B2 (ja) Ｉｃパッケージ
JPH104260A (ja) アルミニウム放熱基板の製造方法
JPS60262304A (ja) 液晶表示装置
JPS61263189A (ja) セラミツク配線基板の製造方法
JPS6352796B2 (enrdf_load_stackoverflow)
JP4511011B2 (ja) 配線基板の製造方法
JPH05235519A (ja) 配線板の製造法
JP3801334B2 (ja) 半導体素子搭載用基板とその製造方法
JPH0423432B2 (enrdf_load_stackoverflow)
JPH04146624A (ja) 半導体装置の電極の製造方法
JPS622591A (ja) 金属ベ−ス混成集積回路基板の製法
WO2000051075A1 (en) Ic card and terminal plate for ic card
JP2003226981A (ja) 電子部品のめっき方法、及び電子部品

Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term