JPH0423432B2 - - Google Patents
Info
- Publication number
- JPH0423432B2 JPH0423432B2 JP6914586A JP6914586A JPH0423432B2 JP H0423432 B2 JPH0423432 B2 JP H0423432B2 JP 6914586 A JP6914586 A JP 6914586A JP 6914586 A JP6914586 A JP 6914586A JP H0423432 B2 JPH0423432 B2 JP H0423432B2
- Authority
- JP
- Japan
- Prior art keywords
- copper plate
- copper
- tab
- molded
- etching
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 72
- 229910052802 copper Inorganic materials 0.000 claims description 72
- 239000010949 copper Substances 0.000 claims description 72
- 239000000758 substrate Substances 0.000 claims description 23
- 238000000034 method Methods 0.000 claims description 21
- 238000005530 etching Methods 0.000 claims description 19
- 238000007747 plating Methods 0.000 claims description 16
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 239000000919 ceramic Substances 0.000 claims description 7
- 238000005520 cutting process Methods 0.000 claims description 3
- 239000011224 oxide ceramic Substances 0.000 description 20
- 229910052574 oxide ceramic Inorganic materials 0.000 description 20
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 7
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- 239000000243 solution Substances 0.000 description 6
- 238000001035 drying Methods 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 4
- 239000010410 layer Substances 0.000 description 3
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6914586A JPS62224995A (ja) | 1986-03-27 | 1986-03-27 | パワ−モジュ−ル基盤の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6914586A JPS62224995A (ja) | 1986-03-27 | 1986-03-27 | パワ−モジュ−ル基盤の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62224995A JPS62224995A (ja) | 1987-10-02 |
| JPH0423432B2 true JPH0423432B2 (enrdf_load_stackoverflow) | 1992-04-22 |
Family
ID=13394193
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6914586A Granted JPS62224995A (ja) | 1986-03-27 | 1986-03-27 | パワ−モジュ−ル基盤の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62224995A (enrdf_load_stackoverflow) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01161892A (ja) * | 1987-12-18 | 1989-06-26 | Toshiba Corp | セラミックス回路基板およびその製造方法 |
| JP4923224B2 (ja) * | 2007-10-01 | 2012-04-25 | Ｄｏｗａメタルテック株式会社 | 金属セラミック複合部材に対するメッキ方法、および金属セラミック複合部材に対するパターン製造方法 |
| JP6324479B1 (ja) * | 2016-12-16 | 2018-05-16 | Ｊｘ金属株式会社 | 回路基板用金属板、回路基板、パワーモジュール、金属板成形品及び、回路基板の製造方法 |
-
1986
- 1986-03-27 JP JP6914586A patent/JPS62224995A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62224995A (ja) | 1987-10-02 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| EXPY | Cancellation because of completion of term |