JPS62224995A - パワ−モジュ−ル基盤の製造方法 - Google Patents
パワ−モジュ−ル基盤の製造方法Info
- Publication number
- JPS62224995A JPS62224995A JP6914586A JP6914586A JPS62224995A JP S62224995 A JPS62224995 A JP S62224995A JP 6914586 A JP6914586 A JP 6914586A JP 6914586 A JP6914586 A JP 6914586A JP S62224995 A JPS62224995 A JP S62224995A
- Authority
- JP
- Japan
- Prior art keywords
- copper plate
- tab
- copper
- molded
- resist
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 62
- 229910052802 copper Inorganic materials 0.000 claims description 62
- 239000010949 copper Substances 0.000 claims description 62
- 239000000758 substrate Substances 0.000 claims description 18
- 238000000034 method Methods 0.000 claims description 17
- 238000005530 etching Methods 0.000 claims description 15
- 238000007747 plating Methods 0.000 claims description 10
- 239000000919 ceramic Substances 0.000 claims description 6
- 238000005304 joining Methods 0.000 claims description 3
- 239000011224 oxide ceramic Substances 0.000 description 19
- 229910052574 oxide ceramic Inorganic materials 0.000 description 19
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 6
- 230000017525 heat dissipation Effects 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6914586A JPS62224995A (ja) | 1986-03-27 | 1986-03-27 | パワ−モジュ−ル基盤の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6914586A JPS62224995A (ja) | 1986-03-27 | 1986-03-27 | パワ−モジュ−ル基盤の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62224995A true JPS62224995A (ja) | 1987-10-02 |
| JPH0423432B2 JPH0423432B2 (enrdf_load_stackoverflow) | 1992-04-22 |
Family
ID=13394193
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6914586A Granted JPS62224995A (ja) | 1986-03-27 | 1986-03-27 | パワ−モジュ−ル基盤の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62224995A (enrdf_load_stackoverflow) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01161892A (ja) * | 1987-12-18 | 1989-06-26 | Toshiba Corp | セラミックス回路基板およびその製造方法 |
| JP2008045218A (ja) * | 2007-10-01 | 2008-02-28 | Dowa Holdings Co Ltd | 金属セラミック複合部材に対するメッキ方法、パターン製造方法、および湿式処理装置、並びにパワーモジュール用金属セラミックス複合部材 |
| JP2018098467A (ja) * | 2016-12-16 | 2018-06-21 | Ｊｘ金属株式会社 | 回路基板用金属板、回路基板、パワーモジュール、金属板成形品及び、回路基板の製造方法 |
-
1986
- 1986-03-27 JP JP6914586A patent/JPS62224995A/ja active Granted
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01161892A (ja) * | 1987-12-18 | 1989-06-26 | Toshiba Corp | セラミックス回路基板およびその製造方法 |
| JP2008045218A (ja) * | 2007-10-01 | 2008-02-28 | Dowa Holdings Co Ltd | 金属セラミック複合部材に対するメッキ方法、パターン製造方法、および湿式処理装置、並びにパワーモジュール用金属セラミックス複合部材 |
| JP2018098467A (ja) * | 2016-12-16 | 2018-06-21 | Ｊｘ金属株式会社 | 回路基板用金属板、回路基板、パワーモジュール、金属板成形品及び、回路基板の製造方法 |
| WO2018110104A1 (ja) * | 2016-12-16 | 2018-06-21 | Ｊｘ金属株式会社 | 回路基板用金属板、回路基板、パワーモジュール、金属板成形品及び、回路基板の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0423432B2 (enrdf_load_stackoverflow) | 1992-04-22 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| EXPY | Cancellation because of completion of term |