JPH0423432B2 - - Google Patents
Info
- Publication number
- JPH0423432B2 JPH0423432B2 JP6914586A JP6914586A JPH0423432B2 JP H0423432 B2 JPH0423432 B2 JP H0423432B2 JP 6914586 A JP6914586 A JP 6914586A JP 6914586 A JP6914586 A JP 6914586A JP H0423432 B2 JPH0423432 B2 JP H0423432B2
- Authority
- JP
- Japan
- Prior art keywords
- copper plate
- copper
- tab
- molded
- etching
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 72
- 229910052802 copper Inorganic materials 0.000 claims description 72
- 239000010949 copper Substances 0.000 claims description 72
- 239000000758 substrate Substances 0.000 claims description 23
- 238000000034 method Methods 0.000 claims description 21
- 238000005530 etching Methods 0.000 claims description 19
- 238000007747 plating Methods 0.000 claims description 16
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 239000000919 ceramic Substances 0.000 claims description 7
- 238000005520 cutting process Methods 0.000 claims description 3
- 239000011224 oxide ceramic Substances 0.000 description 20
- 229910052574 oxide ceramic Inorganic materials 0.000 description 20
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 7
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- 239000000243 solution Substances 0.000 description 6
- 238000001035 drying Methods 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 4
- 239000010410 layer Substances 0.000 description 3
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明は、パワーモジユール基盤の製造方法に
関する。さらに詳しくは、複数個の成形銅板がタ
ブ部分により互いに連結された形の成形銅板集合
体を酸化物セラミツクス基板に直接接合させ、接
合後、該タブ部分を切り取る事により、熱放散性
に優れ、回路構成されたパワーモジユール基盤を
製造する方法を提供する事に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method of manufacturing a power module base. More specifically, a molded copper plate assembly in which a plurality of molded copper plates are connected to each other by tab portions is directly bonded to an oxide ceramic substrate, and after bonding, the tab portions are cut off, resulting in excellent heat dissipation. The present invention relates to providing a method for manufacturing a power module board having a circuit configuration.
［従来の技術］
従来のパワーモジユール基盤製造方法では、酸
化物セラミツクス基盤に、モリブデン又はタング
ステンをメタライズさせ、ニツケルメツキし、そ
の後、ハンダ付けを行ない銅の熱拡散板を接合さ
せている。しかし、このような従来技術の方法で
は回路構成が比較的容易なため、熱伝導度の悪い
モリブデンおよびタングステンが用いられ、放熱
性に欠点があつた。又、特開昭49−17381号公報
に詳細に述べられている様に、酸化物セラミツク
スと銅とを直接接触させて接合させる直接接合法
があるが、銅板を回路構成した時、多くの小さな
要素に分かれるため、酸化物セラミツクス基盤上
に精度よく配置し、直接接合することは難しく、
高コストとなる欠点がある。さらに、酸化物セラ
ミツクス基盤の表面に無電解銅メツキするパワー
モジユール基盤の製造方法がある。通常、酸化物
セラミツクスへの無電解銅メツキは、セラミツク
スを溶融アルカリ液に浸漬して表面を粗化し、そ
れをパラジウムを含有する前処理液に浸漬してセ
ラミツクス表面をメツキに対して活性化した後、
銅メツキ液に浸漬することにより行う。しかし、
通常、酸化物セラミツクス基盤に無電解銅メツキ
を厚くつけるには時間がかかるため、該方法によ
り得られる銅メツキ層は薄いものである。このた
め、放熱性に劣り、熱を多量に発生する電子部品
を搭載すると故障の原因となる欠点があり、ま
た、銅メツキを行うために酸化物セラミツクス基
盤の表面処理が必要となり高コストとなる欠点が
ある。[Prior Art] In a conventional power module board manufacturing method, an oxide ceramic board is metallized with molybdenum or tungsten, plated with nickel, and then soldered to join a copper thermal diffusion plate. However, since the circuit configuration is relatively easy in such prior art methods, molybdenum and tungsten, which have poor thermal conductivity, are used, resulting in a drawback in heat dissipation. Furthermore, as described in detail in JP-A-49-17381, there is a direct bonding method in which oxide ceramics and copper are brought into direct contact and bonded, but when a copper plate is configured into a circuit, many small Because it is divided into elements, it is difficult to precisely place it on an oxide ceramic substrate and bond it directly.
It has the disadvantage of high cost. Furthermore, there is a method for manufacturing a power module substrate in which the surface of an oxide ceramic substrate is electrolessly plated with copper. Normally, electroless copper plating on oxide ceramics involves immersing the ceramic in molten alkaline solution to roughen the surface, and then immersing it in a pretreatment solution containing palladium to activate the ceramic surface for plating. rear,
This is done by immersing it in copper plating solution. but,
Usually, since it takes time to thickly apply electroless copper plating to an oxide ceramic substrate, the copper plating layer obtained by this method is thin. For this reason, it has poor heat dissipation properties, and if it is equipped with electronic components that generate a large amount of heat, it has the disadvantage of causing failure.Additionally, surface treatment of the oxide ceramic base is required to perform copper plating, resulting in high costs. There are drawbacks.
又、酸化物セラミツクス基盤に接合された銅
に、必要な回路構成を行なう方法として、エツチ
ングが考えられるが、接合された銅が厚い場合、
エツチングが表面から行なわれていくため、第５
図に示すごとく、レジストを塗布した表面層と、
酸化物セラミツクスとの接合面に差が生じ、精度
のよい回路構成が行なえない欠点がある。 Etching can also be considered as a method of forming the necessary circuitry on copper bonded to an oxide ceramic substrate, but if the bonded copper is thick,
Since etching is performed from the surface, the fifth
As shown in the figure, the surface layer coated with resist,
There is a difference in the bonding surface with the oxide ceramic, which makes it difficult to form a circuit with high precision.
［発明が解決しようとする問題点］
本発明は、上述のごとき欠点がなく、しかも安
価なパワーモジユール基盤の製造方法を提供せん
とするものである。[Problems to be Solved by the Invention] It is an object of the present invention to provide a method for manufacturing a power module base that is free from the above-mentioned drawbacks and is inexpensive.
［問題点を解決するための手段］
本発明は、回路構成された要素となる銅板部分
がタブ部分でつなぎ合わされた形の複数の銅板の
集合体をプレスで成形加工してつくり、次に酸化
物セラミツクス基盤にタブ部分が接触しない様に
するため、プレスで成形加工された成形銅板の回
路構成された各要素部分だけをレジストでおお
い、露出したタブ部分をエツチングにより各要素
部分より薄くし、次いでレジストを除去し、酸化
物セラミツクス基盤上に精度よく配置して直接接
合させた後、接合されずに残つているタブ部分
を、カツターあるいはルータ等で除去することか
らなるパワーモジユール基盤の製造方法を提供せ
んとするものである。[Means for Solving the Problems] The present invention is made by forming an assembly of a plurality of copper plates with a press, in which the copper plate parts that are the elements of the circuit are connected by tab parts, and then oxidizing. In order to prevent the tabs from coming into contact with the ceramic substrate, only the circuit elements of the press-formed copper plate were covered with resist, and the exposed tabs were etched to be thinner than each element. Next, the resist is removed, the oxide ceramic substrate is precisely placed and directly bonded, and the remaining tab portions that are not bonded are removed using a cutter, router, etc. to manufacture the power module substrate. The purpose is to provide a method.
回路構成された要素となる銅板部分がタブでつ
なぎ合わされた状態の銅板集合体をプレスで成形
加工してつくり、酸化物セラミツクス基盤上に精
度よく配置し、直接接合させる時、タブ部分と回
路構成された各要素の銅板となる部分の厚さが同
一であれば、タブ部分も接合され、接合後タブ部
分の除去が必要となる。そこで、タブ部分を接合
させないため、プレスで成形した銅板の回路構成
された各要素部分をレジストでおおい、タブ部分
だけをエツチングにより、板厚を、各要素より薄
くし、レジストを除去したあと、酸化物セラミツ
クス基盤上に精度よく配置し、直接接合させる
と、タブ部分は、回路構成された各要素部分の銅
板より板厚が薄いので、酸化物セラミツクス基盤
に接触しないため、接合せず、カツターあるいは
ルータ等で容易に除去できる。なお、レジストと
してはエツチング用やメツキ用等のいろいろな種
類のものが市販されており、形態としては液状及
びフイルム状のものが代表的であるが、本発明方
法においては、該方法に適用することが可能ない
かなる公知のものであつてもよい。本発明方法に
おいて用いることの出来るレジスト及びその適用
方法は、当業者には明らかであろう。またタブ部
分のエツチングは、回路構成された各要素となる
部分の成形銅板を酸化物セラミツクス基盤上に精
度よく配置して直接接合を行う際に、タブ部分が
酸化物セラミツクス基盤に接触しない程度であれ
ばよい。このようにエツチングの程度を最小限に
留めれば、エツチングによる銅板サイドのアンダ
ーカツトが大きくならないので、成形銅板の板厚
が厚くても、精度よく回路構成された、パワーモ
ジユール基盤が製造出来る。 The copper plate parts that form the elements of the circuit are formed by pressing a copper plate assembly in which they are connected by tabs, and when they are precisely placed on an oxide ceramic substrate and directly bonded, the tab parts and the circuit structure are formed. If the thickness of the copper plate portion of each element is the same, the tab portion will also be joined and it will be necessary to remove the tab portion after joining. Therefore, in order to avoid joining the tab parts, each element part of the press-formed copper plate containing the circuit is covered with resist, and only the tab part is etched to make the plate thinner than each element, and after removing the resist, When placed accurately on an oxide ceramic substrate and bonded directly, the tab portion is thinner than the copper plate of each element part of the circuit, so it does not contact the oxide ceramic substrate, so it is not bonded and the cutter is removed. Alternatively, it can be easily removed using a router or the like. Various types of resists are commercially available, such as those for etching and plating, and the typical forms are liquid and film. Any known method that can be used may be used. Resists that can be used in the method of the invention and methods of applying them will be apparent to those skilled in the art. In addition, the etching of the tab portions is done to the extent that the tab portions do not come into contact with the oxide ceramic substrate when the molded copper plates of each element of the circuit are precisely placed on the oxide ceramic substrate and directly bonded. Good to have. If the degree of etching is kept to a minimum in this way, the undercut on the side of the copper plate due to etching will not become large, so even if the thickness of the formed copper plate is thick, a power module board with an accurate circuit configuration can be manufactured. .
酸化物セラミツクス基盤に直接接合される成形
銅板部分が厚くなるに従い、タブ部分の板厚を、
切除可能な厚さにエツチングする必要性を生じ
る。 As the thickness of the molded copper plate that is directly bonded to the oxide ceramics substrate increases, the thickness of the tab should be increased.
This creates the need to etch to a resectable thickness.
しかし、厚さ方向に、一方向からのみエツチン
グを続けると、アンダーカツトが著しくなり、垂
直なエツジを呈さなくなる。そこで成形銅板の回
路構成された各要素部分をレジストでおおい、タ
ブ部分を両面からエツチングし、エツチングサイ
ドのアンダーカツトが著しくならない程度でエツ
チングを止め、レジストを除去し、酸化物セラミ
ツクス基盤上に、精度良く配置し、直接接合を行
なえば、カツターおよびルータ等で、切除可能な
タブ部分の厚さが実現できる。パワーモジユール
基盤に搭載される電子部品の消費電力が大きくな
るに従い、酸化物セラミツクス基盤に直接接合さ
せる成形銅板の板厚が厚くなるので、タブ部分を
両面からエツチングすることにより、精度よく回
路構成されたパワーモジユール基盤を製造するこ
とができる。しかしながら、この方法により、さ
らに厚い成形銅板をエツチングしようとすると
き、エツチングサイドのアンダーカツトが激しく
なり、実用的でない場合がある。そこで、上記製
造方法により製造されたパワーモジユール基盤の
回路構成された成形銅板部分の上に、銅メツキを
施す事により、所定の厚さの、アンダーカツトの
少ない成形銅板を得ることができ、精度の良い、
パワーモジユール基盤が製造出来る。この場合、
回路構成された各要素の中で、さらに厚くする必
要のない要素となる部分の成形銅板をレジストで
おおう事により、必要とする要素部分の成形銅板
だけに銅メツキを施す事も出来る。 However, if etching is continued from only one direction in the thickness direction, undercuts become significant and vertical edges no longer appear. Therefore, each element part of the molded copper plate containing the circuit is covered with a resist, the tab part is etched from both sides, the etching is stopped to the extent that undercutting on the etched side does not become significant, the resist is removed, and the etching is done on the oxide ceramic substrate. If accurately placed and directly joined, a tab thickness that can be cut out using a cutter, router, etc. can be achieved. As the power consumption of the electronic components mounted on the power module board increases, the thickness of the molded copper plate that is directly bonded to the oxide ceramic board increases, so by etching the tabs from both sides, it is possible to accurately configure the circuit. It is possible to manufacture power module bases based on However, when attempting to etch a thicker molded copper plate using this method, undercutting on the etching side becomes severe, which may be impractical. Therefore, by applying copper plating on the molded copper plate portion with the circuit structure of the power module board manufactured by the above manufacturing method, it is possible to obtain a molded copper plate with a predetermined thickness and less undercut. Good precision,
Power module bases can be manufactured. in this case,
By covering the molded copper plates of the elements that do not need to be made thicker with resist among the circuit elements, copper plating can be applied only to the parts of the molded copper plates that are necessary.
実施例 １
第１図に示すように、20mm×10mm×0.3mmの２
個の銅板１が幅２mmのタブ２で接続された形の連
結体をプレスで成形加工してつくつた。Example 1 As shown in Figure 1, 20mm x 10mm x 0.3mm
A connected body in which copper plates 1 were connected by tabs 2 with a width of 2 mm was formed by press forming.
銅板１間の隙間は0.8mmであつた。タブ部分以
外の銅板表面に、エツチングレジストとして市販
のスクリーン印刷インキ：商品名Protokote（吉
川化工株式会社製）を筆で塗布し、乾燥後、塩化
第二鉄溶液の中に浸漬し、タブ部分の厚さが0.1
mmになるまでエツチングした。水洗い後、５％
NaOH溶液に浸漬してレジストを除去し、水洗、
乾燥後アルミナ基盤（96％Al2O3）に上記銅板を
載せて、1065℃で５分間、酸素濃度2ppmの雰囲
気中で加熱し、銅板とセラミツクス基盤を直接接
合させた。タブ部分と回路構成された銅板部分と
の境界をカツターで切断した。切断したときの銅
板の断面形状を第３図に示す。銅板のエツチング
時にサイドエツチによりアンダーカツトが発生し
た。しかし、カツターで切除した断面はアルミナ
基盤に対して直角に切り落とされており、製品と
して精度的には問題はない程度であつた。 The gap between the copper plates 1 was 0.8 mm. A commercially available screen printing ink as an etching resist (product name: Protokote (manufactured by Yoshikawa Kako Co., Ltd.) is applied with a brush to the surface of the copper plate other than the tab area, and after drying, it is immersed in a ferric chloride solution, and Thickness is 0.1
It was etched to mm. After washing with water, 5%
Remove resist by immersing in NaOH solution, washing with water,
After drying, the copper plate was placed on an alumina substrate (96% Al 2 O 3 ) and heated at 1065° C. for 5 minutes in an atmosphere with an oxygen concentration of 2 ppm to directly bond the copper plate and the ceramic substrate. The boundary between the tab part and the copper plate part containing the circuit was cut with a cutter. Figure 3 shows the cross-sectional shape of the copper plate when cut. When etching a copper plate, an undercut occurred due to side etching. However, the cross section cut with the cutter was cut at right angles to the alumina base, and there was no problem with the accuracy of the product.
実施例 ２
実施例１と同様の手順で同様の銅−アルミナ基
盤接合体を作成した。タブ部分を切除して良好な
接合体を得た後、メツキ用レジストとして市販の
商品名フロンマスクMA−１（古藤産業株式会社
製）を、銅板の表面部以外の面、すなわち銅板の
タブ部とサイドエツチ部及びアルミナ面に筆で塗
布して乾燥させた後に無電解銅メツキを施した。
無電解銅メツキは、市販されているメツキ液：商
品名ナイコウプロセス（キザイ株式会社製）を用
い、銅を50μｍ厚付けし、銅の厚さを銅板の厚さ
と併せて0.35mmとした。メツキ終了後、５％
NaOH溶液でレジストを除去した。この時の断
面を第４図に示す。図から理解出来る様に、タブ
部分のエツチング時に形成されたアンダーカツト
が若干残つている。又、メツキ層の断面もかなら
ずしも垂直ではない。しかし銅板と銅板のギヤツ
プが設計仕様内に入つており、パワーモジユール
基盤としての使用に問題はない製品であつた。こ
の方法によれば、メツキにより、最終の板厚を所
望の厚さに仕上げる事が可能である。Example 2 A similar copper-alumina substrate bonded body was created using the same procedure as in Example 1. After cutting off the tab portion to obtain a good bonded body, apply a commercially available product name Freonmask MA-1 (manufactured by Furuto Sangyo Co., Ltd.) as a plating resist to the surface other than the surface of the copper plate, that is, the tab portion of the copper plate. It was applied with a brush to the side etches and the alumina surface, and after drying, electroless copper plating was applied.
For electroless copper plating, a commercially available plating solution (trade name: Naiko Process (manufactured by Kizai Co., Ltd.)) was used to apply copper to a thickness of 50 μm, and the thickness of the copper was 0.35 mm including the thickness of the copper plate. 5% after completion of Metsuki
The resist was removed with NaOH solution. A cross section at this time is shown in FIG. As can be seen from the figure, some undercuts formed during etching of the tab remain. Furthermore, the cross section of the plating layer is not necessarily vertical. However, the gap between the copper plates was within the design specifications, and the product could be used as a power module base without any problems. According to this method, it is possible to finish the final plate thickness to a desired thickness by plating.
比較例 １
第１図に示した回路構成された銅板のギヤツプ
にタブ部分を設けず、連続した一枚の銅板をアル
ミナ基盤に直接接合させ、回路構成された銅板に
相当する面積に、レジストを塗布し、乾燥後、エ
ツチングによりギヤツプを作成した。この時の基
盤の断面図を第５図に示す。サイドエツチが激し
く、銅板表面近傍のギヤツプはかなり大きくな
り、このため銅板表面の面積が小さくなり電子部
品の搭載が難かしい製品となつた。Comparative Example 1 A continuous copper plate was bonded directly to the alumina substrate without providing a tab part in the gap of the copper plate with the circuit structure shown in Figure 1, and a resist was applied to the area corresponding to the copper plate with the circuit structure. After coating and drying, a gap was created by etching. A cross-sectional view of the base plate at this time is shown in FIG. The side etch was severe, and the gap near the surface of the copper plate became quite large.As a result, the surface area of the copper plate became small, making it difficult to mount electronic components on the product.
［発明の効果］
上記のごとき本発明の方法によつて製造したパ
ワーモジユール基盤は、成形銅板より薄いタブ部
分で複数個の成形銅板が互いに連結された形の
まゝ酸化物セラミツクス基盤に直接接合された後
タブを切除してつくられるものであるため、低コ
ストで回路構成された要素を精度よく配置出来、
厚い銅板を接合体として形成出来るため、熱放散
性の優れた製品として得ることができる。[Effects of the Invention] The power module base manufactured by the method of the present invention as described above has a plurality of molded copper plates connected to each other through tab portions that are thinner than the molded copper plates, and is directly attached to an oxide ceramic base. Since it is made by cutting out the tabs after being joined, it is possible to place the circuit elements with high precision at low cost.
Since thick copper plates can be formed as a bonded body, a product with excellent heat dissipation properties can be obtained.
第１図は本発明で用いる回路構成された銅板２
枚がタブ部分で連結された形の銅板集合体を表わ
す。第２図はアルミナ基盤に、エツチングされた
タブ部分で連結されている成形銅板集合体を直接
接合した時の断面図を表わす。第３図は接合した
銅板のタブ部分をカツターで切除した後の断面図
を表わす。第４図は接合した銅板の表面にメツキ
を施した後の断面図を表す。第５図は本発明の方
法によらずにエツチングを行なつた場合の銅−セ
ラミツクス接合体の断面図を表す。図中の参照番
号は次のものを表わす。
１……回路構成された銅板、２……タブ、３…
…アルミナ基盤、４……メツキ層、５……エツチ
ングによるアンダーカツト。
Figure 1 shows a copper plate 2 with a circuit structure used in the present invention.
This represents an assembly of copper plates connected by tabs. FIG. 2 shows a cross-sectional view of a molded copper plate assembly connected by etched tabs directly bonded to an alumina substrate. FIG. 3 shows a cross-sectional view after the tab portion of the joined copper plates is cut out with a cutter. FIG. 4 shows a cross-sectional view after the surfaces of the bonded copper plates have been plated. FIG. 5 shows a cross-sectional view of a copper-ceramic bonded body when etching is not performed according to the method of the present invention. Reference numbers in the figures represent the following: 1...Copper plate with circuit configuration, 2...Tab, 3...
...Alumina base, 4...Plated layer, 5...Undercut by etching.
Claims (1)
がタブ部分により互いに連結された形の成形銅板
集合体をつくり、該集合体のタブ部分以外の部分
をレジストで覆つてエツチングすることにより、
タブ部分がタブ以外の部分の成形銅板より薄くな
るように処理した後レジストを除去して前記集合
体をセラミツクス基板上に位置精度よく配置して
成形銅板とセラミツク基板とを直接接合させ、接
合後にタブ部分を切除することを特徴とするパワ
ーモジユール基盤の製造方法。 ２ タブのエツチングを両面から行なうことを特
徴とする特許請求の範囲第１項に記載の方法。 ３ 接合させた成形銅板の表面にメツキを施すこ
とを特徴とする特許請求の範囲第１〜２項のいず
れかに記載の方法。 ４ 接合させた成形銅板の中で、特定の成形銅板
の表面だけにメツキを施すことを特徴とする特許
請求の範囲第３項に記載の方法。[Claims] 1. A molded copper plate assembly in which a plurality of molded copper plates are connected to each other by tab portions is made from one continuous copper plate, and the parts of the assembly other than the tab portions are covered with a resist. By etching the
After processing so that the tab part is thinner than the other parts of the molded copper plate, the resist is removed and the assembly is placed on the ceramic substrate with good positional accuracy, and the molded copper plate and the ceramic substrate are directly bonded. A method for manufacturing a power module board, characterized by cutting out a tab portion. 2. The method according to claim 1, characterized in that the tab is etched from both sides. 3. The method according to any one of claims 1 to 2, characterized in that the surfaces of the bonded formed copper plates are plated. 4. The method according to claim 3, wherein plating is applied only to the surface of a specific formed copper plate among the bonded formed copper plates.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6914586A JPS62224995A (en) | 1986-03-27 | 1986-03-27 | Manufacture of power module board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6914586A JPS62224995A (en) | 1986-03-27 | 1986-03-27 | Manufacture of power module board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62224995A JPS62224995A (en) | 1987-10-02 |
| JPH0423432B2 true JPH0423432B2 (en) | 1992-04-22 |
Family
ID=13394193
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6914586A Granted JPS62224995A (en) | 1986-03-27 | 1986-03-27 | Manufacture of power module board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62224995A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01161892A (en) * | 1987-12-18 | 1989-06-26 | Toshiba Corp | Ceramics circuit board and its manufacture |
| JP4923224B2 (en) * | 2007-10-01 | 2012-04-25 | Ｄｏｗａメタルテック株式会社 | Plating method for metal ceramic composite member and pattern manufacturing method for metal ceramic composite member |
| JP6324479B1 (en) * | 2016-12-16 | 2018-05-16 | Ｊｘ金属株式会社 | Metal board for circuit board, circuit board, power module, metal plate molded product, and method for manufacturing circuit board |
-
1986
- 1986-03-27 JP JP6914586A patent/JPS62224995A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62224995A (en) | 1987-10-02 |
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