JPH0410700Y2 - - Google Patents

Info

Publication number
JPH0410700Y2
JPH0410700Y2 JP1990020545U JP2054590U JPH0410700Y2 JP H0410700 Y2 JPH0410700 Y2 JP H0410700Y2 JP 1990020545 U JP1990020545 U JP 1990020545U JP 2054590 U JP2054590 U JP 2054590U JP H0410700 Y2 JPH0410700 Y2 JP H0410700Y2
Authority
JP
Japan
Prior art keywords
silicon
silicon substrate
ceramic base
ceramic
devices
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1990020545U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0357946U (cg-RX-API-DMAC7.html
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPH0357946U publication Critical patent/JPH0357946U/ja
Application granted granted Critical
Publication of JPH0410700Y2 publication Critical patent/JPH0410700Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

Landscapes

  • Solid State Image Pick-Up Elements (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
JP1990020545U 1980-01-09 1990-03-02 Expired JPH0410700Y2 (cg-RX-API-DMAC7.html)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CA343,318A CA1115852A (en) 1980-01-09 1980-01-09 Mounting and packaging of silicon devices on ceramic substrates, and assemblies containing silicon devices

Publications (2)

Publication Number Publication Date
JPH0357946U JPH0357946U (cg-RX-API-DMAC7.html) 1991-06-05
JPH0410700Y2 true JPH0410700Y2 (cg-RX-API-DMAC7.html) 1992-03-17

Family

ID=4116006

Family Applications (2)

Application Number Title Priority Date Filing Date
JP82081A Pending JPS56101750A (en) 1980-01-09 1981-01-08 Method of mounting and packaging silicon unit on ceramic substrate and package unit therefor
JP1990020545U Expired JPH0410700Y2 (cg-RX-API-DMAC7.html) 1980-01-09 1990-03-02

Family Applications Before (1)

Application Number Title Priority Date Filing Date
JP82081A Pending JPS56101750A (en) 1980-01-09 1981-01-08 Method of mounting and packaging silicon unit on ceramic substrate and package unit therefor

Country Status (5)

Country Link
US (1) US4406054A (cg-RX-API-DMAC7.html)
EP (1) EP0032565B1 (cg-RX-API-DMAC7.html)
JP (2) JPS56101750A (cg-RX-API-DMAC7.html)
CA (1) CA1115852A (cg-RX-API-DMAC7.html)
DE (1) DE3070907D1 (cg-RX-API-DMAC7.html)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4566170A (en) * 1983-05-10 1986-01-28 Pitney Bowes Inc. Method of producing a light emiting diode array
US4760440A (en) * 1983-10-31 1988-07-26 General Electric Company Package for solid state image sensors
DE3516954A1 (de) * 1984-05-14 1985-11-14 Gigabit Logic, Inc., Newbury Park, Calif. Montierte integrierte schaltung
US5162251A (en) * 1991-03-18 1992-11-10 Hughes Danbury Optical Systems, Inc. Method for making thinned charge-coupled devices
JP4663304B2 (ja) * 2004-11-30 2011-04-06 株式会社吉野工業所 液状物の注出容器

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3577037A (en) * 1968-07-05 1971-05-04 Ibm Diffused electrical connector apparatus and method of making same
US3984620A (en) * 1975-06-04 1976-10-05 Raytheon Company Integrated circuit chip test and assembly package

Also Published As

Publication number Publication date
DE3070907D1 (en) 1985-08-29
EP0032565B1 (en) 1985-07-24
CA1115852A (en) 1982-01-05
JPH0357946U (cg-RX-API-DMAC7.html) 1991-06-05
US4406054A (en) 1983-09-27
JPS56101750A (en) 1981-08-14
EP0032565A1 (en) 1981-07-29

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